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For rooting the development of GaN-based optoelectronic devices, understanding the roles of midgap recombination centers (MGRCs), namely, nonradiative recombination centers and deep-state radiative recombination centers, on the carrier recombination dynamics is an essential task. By using the combination of time-resolved photoluminescence and positron annihilation spectroscopy (PAS) measurements, the origins of major MGRCs in the state-of-the-art GaN epilayers, bulk crystals, and Mg-implanted layers were identified, and their concentrations were quantified for deriving the capture coefficients of minority carriers. In this article, potential standardization of the room-temperature photoluminescence lifetime for the near-band-edge emission (τ PL RT ) as the concentration of major MGRCs well below the detection limit of PAS is proposed. For n-GaN substrates and epilayers grown from the vapor phase, τ PL RT was limited by the concentration of carbon on N sites or divacancies comprising a Ga vacancy (VGa) and a N vacancy (VN), [VGaVN], when carbon concentration was higher or lower, respectively, than approximately 1016 cm−3. Here, carbon and VGaVN act as major deep-state radiative and nonradiative recombination centers, respectively, while major MGRCs in bulk GaN crystals were identified as VGa(VN)3 vacancy clusters in Na-flux GaN and VGa or VGaVN buried by a hydrogen and/or VGa decorated with oxygen on N sites, VGa(ON)3–4, in ammonothermal GaN. The values of τ PL RT in n-GaN samples are compared with those of p-GaN, in which τ PL RT was limited by the concentration of VGa(VN)2 in Mg-doped epilayers and by the concentrations of VGaVN and (VGaVN)3 in Mg-implanted GaN right after the implantation and after appropriate activation annealing, respectively. [ABSTRACT FROM AUTHOR]

The anisotropic hole transport along [0001] and [11 2 ¯ 0] in the p-doped (10 1 ¯ 0) GaN layer was compared for layers grown on bulk (10 1 ¯ 0) GaN substrates and on (10 1 ¯ 0) sapphire. The sheet resistance along [0001] was 1.1 times larger on GaN substrates and even 1.2 times larger on sapphire than that along [11 2 ¯ 0]. The anisotropic hole transport on bulk GaN substrates is due to the anisotropy of the hole's effective mass and the different contribution of carriers in different bands, whereas the larger anisotropy for GaN on sapphire is also due to additional scattering at stacking faults. The annealing process of metal Mg applied to the m-plane p-type GaN successfully results in a robust p-type ohmic contact, functioning as a p + + layer. [ABSTRACT FROM AUTHOR]

The precise control of Mg concentration ([Mg]) in p-type GaN layers from 2.3 × 1016 to 2.0 × 1019 cm−3 was demonstrated by halide vapor phase epitaxy (HVPE) on n-type GaN (0001) freestanding substrates. [Mg] in GaN layers could be controlled well by varying the input partial pressure of MgCl2 formed by a chemical reaction between MgO solid and HCl gas under the thermodynamic equilibrium condition. In the sample with [Mg] of 2.0 × 1019 cm−3, a step-bunched surface was observed because the surface migration of Ga adatoms was enhanced by the surfactant effect of Mg atoms. The samples show high structural qualities determined from x-ray rocking curve measurements. The acceptor concentration was in good agreement with [Mg], indicating that almost all Mg atoms act as acceptors. The compensating donor concentrations in the samples were higher than the concentrations of Si, O, and C impurities. We also obtained the Mg acceptor level at a sufficiently low net acceptor concentration of 245 ± 2 meV. These results show that the HVPE method is promising for fabricating GaN vertical power devices, such as n-channel metal–oxide–semiconductor field-effect transistors. [ABSTRACT FROM AUTHOR]

As the size of micro light-emitting diodes (μLEDs) decreases, μLEDs encounter etching damage especially at the sidewalls that critically affects their properties. In this study, we investigated the influence of etching bias power (Pbias) on the performance of μLEDs and found that the current–voltage and light output–current characteristics of μLEDs were enhanced when Pbias was reduced. It was shown that at low Pbias, the chemical reaction between etching gas and gallium nitride, rather than ion sputtering, dominated the etching process, leading to low plasma damage and rough surface morphology. Additionally, to understand the etching-induced surface roughening behaviors, various substrates with different threading dislocation densities were treated at low Pbias. It was found that for the sample (with p-contact size of 10 × 10 μm2), the efficiency droop was approximately 20%, although the current reached 10 mA due most probably to the suppressed polarization effect in the quantum well. It was further observed that the external quantum efficiency (EQE) was dependent on Pbias, where the lowest Pbias yielded the highest maximum EQE, indicating that the plasma damage was mitigated by reducing Pbias. Optimization of dry etching and polarization-suppression conditions could pave the way for realizing high-performance and brightness μLEDs for next-generation displays. [ABSTRACT FROM AUTHOR]

In this study, vertical-type thick BGaN PIN diodes were successfully fabricated to improve the neutron capture rate of BGaN diodes by improving the BGaN epitaxial growth technique. In this technique, 5-μm-thick epitaxial growth was achieved using trimethylboron as a B metal-organic source, which suppressed the gas-phase reaction. The α-particle energy spectrum, the neutron pulse signal, and the residual energy of particles emitted from a neutron capture reaction were measured using the fabricated BGaN diodes by performing radiation detection measurements. The detected signal position in the neutron detection signal spectrum was similar to that of 2.3 MeV α-particles. These results indicate that vertical-type BGaN diodes can be used as effective neutron detectors. [ABSTRACT FROM AUTHOR]

Ga-rich zones created along macrosteps in n-AlGaN plausibly function as electron pathways of AlGaN-based deep-ultraviolet (DUV) LEDs fabricated on AlN templates using 1.0°-miscut c(0001) sapphire substrates toward the m[1-100] axis. This work was performed to clarify AlN mole fractions (xAl) of Ga-rich zones. xAl ≃ (7/12, 6/12, and 5/12) was observed in Ga-rich zones in AlαGa1−αN (α ≃ 0.63, 0.55, and 0.43, respectively) by the method proposed in our previous article in which we showed that Ga-rich zones of Al8/12Ga4/12N were created in Al0.7Ga0.3N. xAl in the Ga-rich zones obtained from an energy-dispersive x-ray signal by scanning transmission electron microscopy calibrated by Rutherford backscattering well agreed with xAl obtained by cross-sectional cathodoluminescence (CL) spectroscopy using scanning electron microscopy. A weak CL shoulder peak corresponding to Al4/12Ga8/12N was also observed for Al0.43Ga0.57N. In addition, xAl ≃ n/12 (n = 6–9) in Al-rich zones appeared in the rest of the Ga-rich zones. Furthermore, nanobeam electron diffraction patterns of the Ga-rich zones indicated a high possibility of a regular configuration of Ga and Al atoms on the c(0001) plane in our samples. Consequently, xAl values in nonflat AlGaN layers with macrosteps were often determined to be near n/12 (n: integer). Thus, Ga-rich zones (xAl = n/12: n = 4–8) formed in our nonflat AlGaN layers, which originated from the macrosteps along [11–20] edgelines normal to the m[1–100] axis, are suggested to be metastable. The creation of discrete xAl in Ga-rich zones should contribute to the stable production of DUV-LEDs using high-miscut sapphire substrates. [ABSTRACT FROM AUTHOR]

AlGaN-based deep-ultraviolet light-emitting diodes (LEDs) incorporating uneven multiple quantum wells (MQWs) with inclined and terrace zones, which were fabricated on an AlN template with dense macrosteps, have exhibited a high internal quantum efficiency (IQE). To investigate the microscopic structure of uneven MQWs, cathodoluminescence (CL) mapping characterization was carried out, and the maps of the CL intensity at 300 K relative to that at 38 K were obtained for uneven MQWs that targeted 265 and 285 nm LEDs. At an electron beam current of less than 1.0 nA, the signals from inclined and terrace zones of the uneven MQWs were confirmed to satisfy the nonsaturated excitation condition at 300 K. Nonradiative recombination (NR) was insufficiently frozen even at 38 K, specifically on the terraces in the 265 nm MQW, suggesting high concentrations of NR centers due to point defects (PDs). In contrast, NR in the 285 nm MQW at 38 K was closer to freeze-out. The concentration of PDs in the 285 nm MQW was likely to be lower than that in the 265 nm MQW. Finally, the ratios of the CL intensity at 300 K to those at 38 K were mapped, demonstrating an approach to creating an approximate map of IQE. The values in the CL intensity ratio maps are discussed by considering the analytical error factors. The results support the model of localized current injection through Ga-rich stripe zones in the n-AlGaN cladding layer. [ABSTRACT FROM AUTHOR]

The effects of GaN quantum barriers with changing growth temperatures on the interfacial characteristics of GaN/InGaN single quantum well (SQW) grown on GaN templates by metalorganic vapour phase epitaxy were in situ investigated by X-ray crystal truncation rod (CTR) scattering and X-ray reflectivity measurements at growth temperature using a laboratory level X-ray diffractometer. Comparing the curve-fitting results of X-ray CTR scattering spectra obtained at growth temperature with that at room temperature, the InxGa1-xN with indium composition less than 0.11 was stabile of the indium distribution at the interface during the whole growth processes. By using several monolayers thickness GaN capping layer to protect the InGaN well layer within temperature-ramping process, the interfacial structure of the GaN/InGaN SQW was drastically improved on the basis of the curve-fitting results of X-ray CTR scattering spectra, and the narrow full width at half-maximum and strong luminous intensity were observed in room temperature photoluminescence spectra. [ABSTRACT FROM AUTHOR]