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To meet commercialization requirements, the distributions of materials in hafnium-based ferroelectric devices—including their phase and orientation—need to be controlled. This article presents a method for improving the ferroelectric phase ratio and orientation by adjusting the stress distribution of the annealing structure in a three-dimensional capacitor. In such a structure, stress can be applied in three directions: tangential, axial, and radial; there are, thus, more ways to regulate stress in three-dimensional structures than in two-dimensional structures. This work sought to clarify the role of the stress direction on the proportions and orientations of ferroelectric phases. The results of stress simulations show that a structure with an internal TiN electrode, but no filling provides greater axial and tangential stresses in the hafnium-oxide layer. In comparison with the case of the hole being filled with tungsten, the proportion of the O phase is increased by approximately 20%, and in experiments, the projection of the polarization direction onto the normal was found to be increased by 5%. Axial and tangential stresses are regarded to be beneficial for the formation of the O phase and for improving the orientation of the polarization direction. This work provides a theoretical basis and guidance for the three-dimensional integration of hafnium-based ferroelectric materials. [ABSTRACT FROM AUTHOR]

We conducted a comprehensive investigation on the influence of TiN thickness and stress on the ferroelectric properties of Hf 0.5 Zr 0.5 O 2 thin films. TiN top electrode layers with varying thicknesses of 2, 5, 10, 30, 50, 75, and 100 nm were deposited and analyzed. It was observed that the in-plane tensile stress in TiN films increased with the thickness of the TiN top electrode. This is expected to elevate the tensile stress in the Hf 0.5 Zr 0.5 O 2 film, consequently leading to an enhancement in ferroelectric polarization. However, the effect of stress on the ferroelectric behavior of Hf 0.5 Zr 0.5 O 2 films exhibited distinct stages: improvement, saturation, and degradation. Our study presents novel findings revealing a saturation and degradation phenomenon of in-plane tensile stress on the ferroelectric properties of polycrystalline Hf 0.5 Zr 0.5 O 2 films, thereby partially resolving the discrepancies between experimental observations and theoretical predictions. The observed phase transformation induced by tensile stress in Hf 0.5 Zr 0.5 O 2 films played a crucial role in these effects. Furthermore, we found that the impact of the TiN top electrode thickness on other factors influencing ferroelectricity, such as grain size and oxygen vacancies, was negligible. These comprehensive results offer valuable insights into the influence of stress and TiN top electrode thickness on the ferroelectric behavior of Hf 0.5 Zr 0.5 O 2 films. [ABSTRACT FROM AUTHOR]

Hf0.5Zr0.5O2 (HZO) is a promising candidate for low-power non-volatile memory due to its nanoscale ferroelectricity and compatibility with silicon-based technologies. Stress and oxygen vacancy (VO) are key factors that impact the ferroelectricity of HZO. However, their combined effects have not been extensively studied. In this study, we investigated the impact of the VO content on HZO thin films' ferroelectricity under different electrode stresses by using TiN and tungsten (W) top electrodes and controlling ozone dose time during HZO deposition. The HZO thin films with W top electrodes exhibit elevated stress levels and a greater abundance of orthorhombic/tetragonal phases, and the HZO thin films with TiN top electrode shows an increase in the monoclinic phase with increasing ozone dose time. The residual polarization (Pr) of the capacitors with TiN and W top electrodes displayed different or even opposing trends with increasing ozone dose time, and the VO content decreases with increasing ozone dose time for both sets of capacitor samples. We propose a model to explain these observations, considering the combined influence of electrode stresses and VO on the free and formation energy of the crystalline phase. Increasing the VO content promotes the transformation of the tetragonal phase to the orthorhombic phase in HZO films with TiN top electrodes, and with W top electrodes, a higher VO content prevents the tetragonal phase from transforming into the orthorhombic/monoclinic phase. Additionally, an alternative explanation is proposed solely from the perspective of stress. These findings provide valuable insights into the regulation of ferroelectricity in HZO thin films. [ABSTRACT FROM AUTHOR]

HfO 2 -based thin films have raised considerable interest in ferroelectric memory devices due to their thickness scalability and process compatibility with CMOS. Stress exhibits a significant influence on ferroelectric polarization in HfO 2 -based films. However, the effect of stress has yet to be clarified despite numerous efforts, and there has been a lack of systematic review to collate and discuss this effect. This paper briefly introduces how stress is characterized in HfO 2 -based polycrystalline films as basis. Then, the process in which stress affects ferroelectricity is carefully discussed. The paper subsequently elaborates both the effects of out of plane stress and in plane stress. Furthermore, the interaction between stress and other factors is presented. Finally, the up-to-date research on the effect of stress are summarized, and several further research challenges for researchers are provided. Given the ubiquitous stress during the chip manufacturing process, a detailed summary of the stress effect has technological implications for processing and applications of HfO 2 -based thin films. [ABSTRACT FROM AUTHOR]

The ferroelectric field effect transistor (FeFET) is a very promising candidate for low-power and non-volatile memory. However, the co-existing effect of ferroelectric polarization and interface charge trapping in the FeFETs is demonstrated and many efforts have been made to eliminate this charge-trapping effect, which is usually treated as a deleterious effect. In contrast, we have found that the charge-trapping effect can play a dominant role in ferroelectric gates. In this work, we have verified that the charge-trapping effect of the ferroelectric/insulator interface could induce a memory window as the main physical mechanism in the TiN/Hf0.5Zr0.5O2/SiO2/p-Si (MFIS) structure, in which the ferroelectric characteristics of HZO thin films was verified through a reverse-grown MFIS structure. We also demonstrated that 2.5 nm SiO2 is optimal for the charge tunneling effect and the device has the largest memory window. Moreover, in order to enlarge the memory window of MFIS capacitors, we utilized the stress-enhanced ferroelectric polarization characteristics of Hf0.5Zr0.5O2 to improve the charge-trapping effect. Such a finding demonstrates that the ferroelectric-aided charge-trapping devices are potential to be used in non-volatile memories. [ABSTRACT FROM AUTHOR]

There are three basic multiphonon trap-assisted tunneling (TAT) mechanisms in the gate leakage current of a metal-oxide-semiconductor (MOS) structure: the short-ranged trap potential, nonadiabatic interaction and electric field induced trap-band transitions. In this paper, a comparison of these three mechanisms is made for the first time in a single (Schenk's model) MOS structure. A properly box-normalized electron wave function in the SiO2 conduction band in an electric field is used to calculate the field ionization rate of a deep neutral trap. It is found that capture and emission rates of a deep neutral trap are almost the same in the short-ranged trap potential and nonadiabatic interaction induced TAT processes, so the two mechanisms give a similar contribution to the total TAT current. The calculated TAT current and the average relaxation energy (∼1.5 eV) due to these two mechanisms are in good agreement with the experimental results. In contrast, capture and emission rates in Schenk's model are several orders smaller. The TAT current induced by this mechanism is also much smaller and can be ignored. [ABSTRACT FROM AUTHOR]

In this paper, we demonstrate a charge trapping memory with aluminum nanocrystals (Al- NCs) embedded in Al2O3 high-k dielectric. Compared to metal/Al2O3/SiO2/Si structure, this device exhibits a larger memory window (6.7 V at ±12 V), faster program/erase speed and good endurance. In particular, data retention is improved greatly both at room temperature and in high-temperature (up to 150 °C). The results indicate that the device with the embedding Al-NCs in Al2O3 film has a strong potential for future high-performance nonvolatile memory application. [ABSTRACT FROM AUTHOR]