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InGaN-based multi-quantum well (MQW) solar cells are promising devices for photovoltaics (e.g., for tandem solar cells and concentrator systems), space applications, and wireless power transfer. In order to improve the efficiency of these devices, the factors limiting their efficiency and stability must be investigated in detail. Due to the complexity of a MQW structure, compared with a simple pn junction, modeling the spectral response of these solar cells is not straightforward, and ad hoc methodologies must be implemented. In this paper, we propose a model, based on material parameters and closed-formula equations, that describes the shape of the quantum efficiency of InGaN/GaN MQW solar cells, by taking into account the layer thickness, the temperature dependence of the absorption coefficient, and quantum confinement effects. We demonstrate (i) that the proposed model can effectively reproduce the spectral response of the cells; in addition, (ii) we prove that the bulk p-GaN layer absorbs radiation, but the carriers photogenerated in this region do not significantly contribute to device current. Finally, we show that (iii) by increasing the temperature, there is a redshift of the absorption edge due to bandgap narrowing, which can be described by Varshni law and is taken into account by the model, and a lowering in the extraction efficiency due to the increase in recombination (mostly Shockley–Read–Hall) inside the quantum wells, which is also visible by decreasing light intensity. [ABSTRACT FROM AUTHOR]

Degradation of InGaN–GaN LEDs has been the subject of intense investigations in the past few years. While current- and temperature-induced degradation processes have been described, the impact of photon-induced degradation has not been investigated in detail in the literature. This paper aims at improving the understanding of the mechanisms responsible for the degradation of the InGaN subject to high photon densities by stressing the devices under a high-intensity laser beam in open-circuit conditions (i.e., in the absence of external current). We analyzed the degradation by means of electrical, optical, and deep-level characterization techniques. First, we demonstrate the existence of optically induced degradation processes in GaN LEDs: from photoluminescence measurements, we observed a decrease in the luminescence after stress, more prominent in the region irradiated during stress. Second, we ascribe this effect to a decrease in internal quantum efficiency due to the generation of non-radiative defects within the active region. Third, by steady-state photocapacitance measurements, we reveal the presence of a shallow level with an energy of EC–2.2 eV, which can be ascribed to gallium vacancies and its complexes with oxygen and nitrogen and can be related to the increase in yellow luminescence. [ABSTRACT FROM AUTHOR]

Understanding the properties of N-implanted β-Ga2O3 is fundamental for the optimization of doping and isolation structures based on gallium oxide. This paper reports an extensive analysis of the impact of thermal annealing on the concentration and properties of deep levels in N-implanted β-Ga2O3 Schottky barrier diodes by means of capacitance isothermal transient spectroscopy. Samples with annealing temperatures from 800 to 1200 °C were considered. The original results presented in this paper demonstrate the following: (a) The instability of current–voltage characteristics detected for all the samples under test can be attributed to the presence of three electron traps with activation energies of 0.6, 0.7, and 1 eV, consistent with previous reports in β-Ga2O3. (b) The detected traps are not the nitrogen level but intrinsic defects whose concentration is increased by the implantation process. (c) The concentration of deep levels decreases as the annealing temperature increases, demonstrating that the annealing process can effectively restore the quality of the material while keeping the conductivity decrease related to the presence of the nitrogen. Finally, (d) we demonstrate that the residual leakage and the turn-on voltage shift are correlated with the Arrhenius signature of the detected deep levels. An interpretation is proposed to explain the measurement results. [ABSTRACT FROM AUTHOR]

Over the last decade, gallium nitride (GaN) has emerged as an excellent material for the fabrication of power devices. Among the semiconductors for which power devices are already available in the market, GaN has the widest energy gap, the largest critical field, and the highest saturation velocity, thus representing an excellent material for the fabrication of high-speed/high-voltage components. The presence of spontaneous and piezoelectric polarization allows us to create a two-dimensional electron gas, with high mobility and large channel density, in the absence of any doping, thanks to the use of AlGaN/GaN heterostructures. This contributes to minimize resistive losses; at the same time, for GaN transistors, switching losses are very low, thanks to the small parasitic capacitances and switching charges. Device scaling and monolithic integration enable a high-frequency operation, with consequent advantages in terms of miniaturization. For high power/high-voltage operation, vertical device architectures are being proposed and investigated, and three-dimensional structures—fin-shaped, trench-structured, nanowire-based—are demonstrating great potential. Contrary to Si, GaN is a relatively young material: trapping and degradation processes must be understood and described in detail, with the aim of optimizing device stability and reliability. This Tutorial describes the physics, technology, and reliability of GaN-based power devices: in the first part of the article, starting from a discussion of the main properties of the material, the characteristics of lateral and vertical GaN transistors are discussed in detail to provide guidance in this complex and interesting field. The second part of the paper focuses on trapping and reliability aspects: the physical origin of traps in GaN and the main degradation mechanisms are discussed in detail. The wide set of referenced papers and the insight into the most relevant aspects gives the reader a comprehensive overview on the present and next-generation GaN electronics. [ABSTRACT FROM AUTHOR]

This tutorial paper focuses on the physical origin of thermal droop, i.e., the decrease in the luminescence of light-emitting diodes (LEDs) induced by increasing temperature. III-nitride-based LEDs are becoming a pervasive technology, covering several fields from lighting to displays, from automotive to portable electronics, and from horticulture to sensing. In all these environments, high efficiency is a fundamental requirement, for reducing power consumption and system cost. Over the last decade, a great deal of effort has been put in the analysis of the efficiency droop, the decrease in LED internal quantum efficiency (IQE) induced by high current density. On the other hand, an IQE decrease is observed also for increasing temperature, a phenomenon usually referred to as thermal droop. For commercial LEDs, the IQE decrease related to thermal droop can be comparable to that of efficiency droop: for this reason, understanding thermal droop is a fundamental step for making LEDs capable of operating at high temperature levels. In several fields (including street lighting, automotive, photochemical treatments, projection, entertainment lighting, etc.), compact and high-flux light sources are required: typically, to reduce the size, weight, and cost of the systems, LEDs are mounted in compact arrays, and heat sinks are reduced to a minimum. As a consequence, LEDs can easily reach junction temperatures above 85–100 °C and are rated for junction temperatures up to 150–175 °C (figures from commercially available LED datasheets: Cree XHP70, Osram LUW HWQP, Nichia NVSL219CT, Samsung LH351B, and LedEngin LZP-00CW0R) and this motivates a careful analysis of thermal droop. This paper discusses the possible physical causes of thermal droop. After an introduction on the loss mechanisms in junctions, we will individually focus on the following processes: (i) Shockley–Read–Hall (SRH) recombination and properties of the related defects; (ii) Auger recombination and its temperature dependence, including the discussion of trap-assisted Auger recombination; (iii) impact of carrier transport on the thermal droop, including a discussion on carrier delocalization, escape, and freeze out; (iv) non-SRH defect-related droop mechanisms. In addition, (v) we discuss the processes that contribute to light emission at extremely low current levels and (vi) the thermal droop in deep ultraviolet LEDs, also with reference to the main parasitic emission bands. The results presented within this paper give a tutorial perspective on thermal droop; in addition, they suggest a pathway for the mitigation of this process and for the development of LEDs with stable optical output over a broad temperature range. [ABSTRACT FROM AUTHOR]

An experiment on degradation mechanisms of InGaN light-emitting diode (LED) test structure which do not fulfill the requirements of longlife products is described and a combined capacitance-voltage (C-V), deep level transient spectroscopy (DLTS), electro-luminescence (EL), and cathodoluminescence (CL) study of short-term instabilities of InGaN/GaN LEDs submitted to low current aging test at room temperature is presented. The main cause of the degradation is the generation of nonradiative paths, due to the generation/propogation of defects activated by carrier transport.

We present an electro-optical method for the extrapolation of the nonradiative and Auger recombination coefficients in InGaN/GaN Light-emitting diodes (LEDs). The method has the advantage of permitting the extrapolation of the recombination parameters of packaged devices, contrary to conventional techniques based on the analysis of quasibulk structures. For the analyzed devices, the average values of the nonradiative and Auger recombination coefficients have been determined to be equal to 2.3×107 s-1 and 1.0×10-30 cm6 s-1, respectively. These results are consistent with previous reports based on the analysis of quasibulk structures and on theoretical simulations. The method described in this paper constitutes an efficient tool for the analysis of the recombination dynamics in GaN-based LEDs. The results obtained within this work support the hypothesis on the importance of Auger recombination in determining the so-called efficiency droop in LED structures. [ABSTRACT FROM AUTHOR]

Describes a failure mechanism of AlGaAs/InGaAs pseudomorphic high electron mobility transistors after carrier dc accelerated testing. Characterization of hot carrier effects by means of gate current measurements and electroluminescence spectroscopy; Measurements of direct current, pulsed and low-frequency ac; Electron traps at gate-to-drain electric fields.