1. Large-area unmodified superhydrophobic copper substrate can be prepared by an electroless replacement deposition
- Author
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Song, Wei, Zhang, Jianjun, Xie, Yunfei, Cong, Qian, and Zhao, Bing
- Subjects
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ELECTROLESS plating , *HYDROPHOBIC surfaces , *SUBSTRATES (Materials science) , *SURFACE roughness , *SPECTRUM analysis , *MOLECULAR self-assembly , *COPPER compounds - Abstract
Abstract: Using an electroless replacement deposition method, large-area superhydrophobic metal substrate could be obtained. The superhydrophobic surfaces were prepared via a replacement reaction between copper substrate and HAuCl4 solution. The roughness of the copper substrate increased much after the replacement reaction. X-ray powder diffraction (XRD) pattern and energy dispersive X-ray (EDX) spectroscopy have proved that gold, CuCl and Cu2O formed on the surface of copper substrate after the replacement reaction. The surface showed remarkable superhydrophobic properties with a contact angle higher than 150 degrees without any modification with a self-assembled monolayer (SAM) of long chain thiol or perfluoro molecules. [Copyright &y& Elsevier]
- Published
- 2009
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