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Increasing the bias voltage is a method of reducing the motional resistance of the capacitive disk resonator to match the impedance of the RF circuit. But there are few reports on the study of reliable working range of bias voltage under the shock and vibration environment. Therefore, the reliability of disk resonator under the step and pulse acceleration impact respectively is systematically analyzed in this paper. By the expression of the biggest inertial acceleration the disk can bear under the reliable condition, the maximal reliable range curves of the disk resonator under the dynamic impact environment are obtained. According to the actual sizes of disk in the literature, it can be seen that when a step shock of 13000 g is supplied, the reliability range is reduced to 75% compared with the original state. For the pulse shock, the reliability range is related to the pulse amplitude and time width. Research of this paper can provide the basis for the selection of bias voltage of disk resonator under the inertial shock.

A novel MEMS accelerometer with grid strip capacitors is developed. The mechanical and electrical noise can be reduced greatly for the novel structure design. ANSOFT-Maxwell software was used to analyze the fringing electric field of the grid strip structure and its effects on the designed accelerometer. The effects of the width, thickness and overlapping width of the grid strip on the sensing capacitance are analyzed by using the ANSOFT-Maxwell software. The results show that the parameters have little effect on the characteristics of the presented accelerometer. The designed accelerometer was fabricated based on deep RIE and silicon–glass bonding processes. The preliminary tested sensitivities are 0.53 pF/g and 0.49 pF/g in the x and y axis directions, respectively. A resonator with grid strip structure was also fabricated whose tested quality factor is 514 in air, which proves that the grid strip structure can reduce mechanical noise.

A novel MEMS inertial sensor with enhanced sensing capacitors is developed. The designed fabricated process of the sensor is a deep RIE process, which can increase the mass of the seismic to reduce the mechanical noise, and the designed capacitance sensing method is changing the capacitance area, which can reduce the air damping between the sensing capacitor plates and reduce the requirement for the DRIE process precision, and reduce the electronic noise by increasing the sensing voltage to improve the resolution. The design and simulation are also verified by using the FEM tool ANSYS. The simulated results show that the transverse sensitivity of the sensor is approximately equal to zero. Finally, the fabricated process based on silicon–glass bonding and the preliminary test results of the device for testing grid capacitors and the novel inertial sensor are presented. The testing quality factor of the testing device based on the slide-film damping effect is 514, which shows that the enhanced capacitors can reduce mechanical noise. The preliminary testing result of the sensitivity is 0.492 pf/g.

The comb capacitances fabricated by deep reactive ion etching (RIE) process have high aspect ratio which is usually smaller than 30: 1 for the complicated process factors, and the combs are usually not parallel due to the well-known micro-loading effect and other process factors, which restricts the increase of the seismic mass by increasing the thickness of comb to reduce the thermal mechanical noise and the decrease of the gap of the comb capacitances for increasing the sensitive capacitance to reduce the electrical noise. Aiming at the disadvantage of the deep RIE, a novel capacitive micro-accelerometer with grid strip capacitances and sensing gap alterable capacitances is developed. One part of sensing of inertial signal of the micro-accelerometer is by the grid strip capacitances whose overlapping area is variable and which do not have the non-parallel plate's effect caused by the deep RIE process. Another part is by the sensing gap alterable capacitances whose gap between combs can be reduced by the actuators. The designed initial gap of the alterable comb capacitances is relatively large to depress the effect of the maximum aspect ratio (30 : 1) of deep RIE process. The initial gap of the capacitance of the actuator is smaller than the one of the comb capacitances. The difference between the two gaps is the initial gap of the sensitive capacitor. The designed structure depresses greatly the requirement of deep RIE process. The effects of non-parallel combs on the accelerometer are also analyzed. The characteristics of the micro-accelerometer are discussed by field emission microscopy (FEM) tool ANSYS. The tested devices based on slide-film damping effect are fabricated, and the tested quality factor is 514, which shows that grid strip capacitance design can partly improve the resolution and also prove the feasibility of the designed silicon-glass anodically bonding process.