Search

The authors developed a cellular based Monte Carlo (MC) feature scale model capable of direct coupling to the dominant plasma species ratios from a reactor scale model in order to simulate the profile evolution of shallow trench isolation etch in chlorine-based plasmas and its variation from the center to the edge of the wafer. Carefully planned experiments along with scanning electron microscopy (SEM) were used to calibrate the MC model, where one to two plasma parameters were systematically varied. Simulated feature profiles were found to agree well with experimental observations, capturing details such as microtrenching, faceting, tapering, and bowing. The particle counts used to achieve these fits agreed well with those estimated from SEM, corroborating the chemistry and physics used in the feature scale model. In addition, the feature scale model uses a novel surface representation that eliminates the artificial flux fluctuations originating from the discrete cells used in the simulation and enables a much more precise calculation of the surface normal, which dictates the trajectory of reflected species.

A two-dimensional numerical fluid model was developed to investigate the effects of reactor design on the radial profiles of plasma species, namely, etch products and positive ions, during shallow trench isolation etching in Cl2∕O2∕Ar inductively coupled plasmas. Specifically, the dual-coil and dual gas-feed designs of the reactor were examined. The former parameter was determined to be effective in tailoring the radial ion flux profile at pressures higher than 20mT, while the latter parameter was shown to alter the etch product transport in the convection-dominant flow regime. Coupling of the reactor scale model to a feature scale model allowed investigation of minor center to edge variations in the etched feature profile. This hybrid model suggests that the general radial decrease in the etch depth seen from a set of design of experiments is caused by an inherent decrease in the spatial distribution of chlorine radicals. In addition, the increase in the silicon sidewall angle from center to edge can be ...