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Triboelectric nanogenerators (TENGs) are considered to be the most promising energy supply equipment for wearable devices, due to their excellent portability and good mechanical properties. Nevertheless, low power generation efficiency, high fabrication difficulty, and poor wearability hinder their application in the wearable field. In this work, PA66/graphene fiber films with 0, 1 wt%, 1.5 wt%, 2 wt%, 2.5 wt% graphene and PVDF films were prepared by electrospinning. Meanwhile, TENGs were prepared with PA66/graphene fiber films, PVDF films and plain weave conductive cloth, which were used as the positive friction layer, negative friction layer and the flexible substrate, respectively. The results demonstrated that TENGs prepared by PA66/graphene fiber films with 2 wt% grapheme showed the best performance, and that the maximum open circuit voltage and short circuit current of TENGs could reach 180 V and 7.8 μA, respectively, and that the power density was 2.67 W/m2 when the external load was 113 MΩ. This is why the PA66/graphene film produced a more subtle secondary network with the addition of graphene, used as a charge capture site to increase its surface charge. Additionally, all the layered structures of TENGs were composed of breathable electrospun films and plain conductive cloth, with water vapor transmittance (WVT) of 9.6 Kgm−2d−1, reflecting excellent wearing comfort. The study showed that TENGs, based on all electrospinning, have great potential in the field of wearable energy supply devices.

Three-dimensional microstructures play a key role in the fabrication of flexible electronic products. However, the development of flexible electronics is limited in further applications due to low positioning accuracy, the complex process, and low production efficiency. In this study, a novel method for fabricating three-dimensional circular truncated cone microstructures via low-frequency ultrasonic resonance printing is proposed. Simultaneously, to simplify the manufacturing process of flexible sensors, the microstructure and printed interdigital electrodes were fabricated into an integrated structure, and a flexible pressure sensor with microstructures was fabricated. Additionally, the effects of flexible pressure sensors with and without microstructures on performance were studied. The results show that the overall performance of the designed sensor with microstructures could be effectively improved by 69%. Moreover, the sensitivity of the flexible pressure sensor with microstructures was 0.042 kPa−1 in the working range of pressure from 2.5 to 10 kPa, and the sensitivity was as low as 0.013 kPa−1 within the pressure range of 10 to 30 kPa. Meanwhile, the sensor showed a fast response time, which was 112 ms. The stability remained good after the 100 cycles of testing. The performance was better than that of the flexible sensor fabricated by the traditional inverted mold method. This lays a foundation for the development of flexible electronic technology in the future.