Search

GaN power switching transistors featuring MIS- and MOS-gate structures are highly preferred over the Schottky-gate counterpart, because of suppressed gate leakage, enlarged gate swing, and more scalable threshold voltage. Nevertheless, MIS-/MOS-gate GaN devices are confronted with stability and reliability challenges, which arise from interface traps at the critical dielectric/III-nitride interface, as well as bulk traps inside the gate dielectric including border traps near the critical interface. In this work, we present several key techniques toward reliable MIS-/MOS-gate GaN power devices, including advanced interface engineering technology, gate structure optimizations for high-performance/stability normally-off GaN power transistors, and long-lifetime gate dielectric technology. Schematic cross sections of GaN-based MIS-HEMT and MOS-channel-HEMT. [ABSTRACT FROM AUTHOR]