11 results on '"Zhang G.Q."'
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2. From chemical building blocks of polymers to microelectronics reliability.
3. Cure, temperature and time dependent constitutive modeling of moulding compounds.
4. A novel tool for cure dependent viscoelastic characterization of packaging polymers.
5. Mechanical characterization of SiLK by nanoindentation and substrate curvature techniques.
6. Mechanism-based delamination prediction during reflow with moisture preconditioning.
7. Effect of metal layout design on passivation crack occurrence using both experimental and simulation techniques.
8. Advanced numerical prototyping methods in modern engineering applications.
9. Virtual qualification of moisture induced failures of advanced packages [IC packages].
10. On wire failures in micro-electronic packages.
11. Modeling of cure-induced warpage of plastic IC packages.
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