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With this Special Issue, we are publishing 81 peer-reviewed manuscripts, a selection from the best work presented in June 2019 at the 28th IEEE Symposium on Fusion Engineering (SOFE), Jacksonville, FL, USA. This is the sixth SOFE Special Issue that IEEE TRANSACTIONS ON PLASMA SCIENCE (TPS) has published, a tradition that started with the 2009 SOFE in order to afford attendees the opportunity to publish an expanded version of their oral or poster presentations in a refereed journal. It has become a popular option. With each successive SOFE, more authors take advantage of the possibility offered by TPS to have their conference papers gain wider exposure and be cited by others working in fusion engineering and its related disciplines. Readers benefit as well. For example, this issue features a total of 22 papers on ITER and Wendelstein 7-X, a unique collection of papers on two projects that sit at the forefront of fusion engineering. [ABSTRACT FROM AUTHOR]

THE ADMINISTRATIVE COMMITTEE of the IEEE Ultrasonics, Ferroelectrics, and Frequency Control Society takes great pleasure in announcing the selection of the Outstanding Papers published in its 2012 Transactions. The award was presented during ceremonies at the 2013 Joint UFFC, EFTF, and PFM Symposium, July 21?25, 2013, in Prague, Czech Republic. Awards Committee Members selected three papers from among a total of 265 full papers which appeared in volume 59 of the IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

The combined IEEE International Conference on Plasma Science (ICOPS) (held annually) and Pulsed Power Conference (held biennially) are merged once every six years, sponsored by the Plasma Science and Applications Committee (PSAC) and the Pulsed Power Science and Technology Committee (PPS&T) of the IEEE Nuclear and Plasma Science Society (NPSS). The joint conference, called the Pulsed Power and Plasma Science Conference, was held on June 23–28, 2019, in Orlando, FL, USA. The conference’s technical program included a wide range of topics, which ranged from fundamental research to traditional and emerging technology applications. The conference had over 800 accepted abstracts, representing scientists from over 30 countries. The program also included a minicourse on “Computational Methods in Plasma Physics.” This year the PPPS sessions were enhanced by a number of exceptional plenary talks. [ABSTRACT FROM AUTHOR]

The IEEE International Conference on Plasma Science (ICOPS) is an annual meeting of plasma physics and chemistry researchers with emphasis on various applications of plasma science and technology. This meeting is sponsored by the Plasma Science and Applications Committee of the IEEE Nuclear and Plasma Science Society. [ABSTRACT FROM PUBLISHER]

Describes the above-named upcoming special issue or section. May include topics to be covered or calls for papers. [ABSTRACT FROM AUTHOR]

In this article the author cites the five papers presented in the "Institute of Electrical and Electronics Engineers (IEEE) First International Conference on Biometrics: Theory, Applications, and Systems," or BTAS 07, held in Washington, D.C. on September 27-29, 2009. It states that the papers received positive reviews and were revised for the special section of "IEEE Transactions on Systems, Man, and Cybernetics-Part A." Among these papers were authored by Elaine Newton and P. Jonathan Phillips, and Andreas Humm and colleagues from the University of Fribourg in Switzerland.

The 2013 IEEE Pulsed Power and Plasma Science Conference (PPPS 2013) was held at the Hyatt Regency in San Francisco, CA, USA in June 2013. The PPPS 2013 combined the 19th IEEE Pulsed Power Conference (PPC) and the 40th IEEE International Conference on Plasma Science (ICOPS). This conference marks the third combined IEEE PPPS meeting, following the very successful PPPS 2001 in Las Vegas, NV, USA, and the PPPS 2007 in Albuquerque, NM, USA. The most recent ICOPS was held in 2012 in Edinburg, Scotland, and the most recent PPC was held in 2011 in Chicago, IL, USA. [ABSTRACT FROM PUBLISHER]

The SISC is a workshop-style conference that provides a forum for device engineers, solid state physicists, and materials scientists to discuss topics of common interest, formally through invited and contributed presentations, and informally during various events including a poster presentation session. The SISC is sponsored by the IEEE Electron Devices Society, and will be held immediately prior to the IEEE IEDM. The program includes talks (theory and experiment) from all areas of MOS science and technology. A Best Student Presentation Award will be given in memory of E.H. Nicollian. Deadline for Receipt of Extended Abstracts: July 22, 2013 Abstract submission, previous technical programs, contact information, etc.: http://www.ieeesisc.org. Key Bridge Marriott Hotel, Arlington, VA (near downtown Washington, DC) December 5-7,2013 (Tutorial: December 4). [ABSTRACT FROM AUTHOR]

It is a special pleasure to be able to present IEEE Transactions on Semiconductor Manufacturing readers with a selection of papers from the 2020 International Conference on Compound Semiconductor Manufacturing Technology (CS-MANTECH). This has been an extraordinarily challenging year by almost any measure, with personal and business disruptions on a dramatic scale worldwide. However, progress in advancing the manufacturing of compound semiconductor devices continues unabated, and through this Special Section I hope to provide a window into some recent areas of progress. Under more normal circumstances, the CS-MANTECH conference is an annual event that provides a technical forum for presenting advancements in compound semiconductor devices. CS-MANTECH is unique in its strong emphasis on manufacturing technologies related to compound semiconductor device production. This year, however, the global COVID-19 pandemic made holding an international conference impossible. While we could not hold the conference as originally planned, authors still prepared high-quality papers reporting their advances in compound semiconductor devices and associated manufacturing technologies. The full conference program proceedings for the 2020 conference are available online at https://csmantech.org/digests. [ABSTRACT FROM AUTHOR]

As a guest Editor for the special section on the 2017, 2018, and 2019 International Conference on Microelectronic Test Structures (ICMTS), I am gratified to be able to present our IEEE Transactions on Semiconductor Manufacturing readers with a selection of papers based on work presented at the 2017, 2018, and 2019 conferences. [ABSTRACT FROM AUTHOR]

This marks the seventh issue of the IEEE Transactions on Plasma Science dedicated to Spacecraft Charging Technology. The theme of this issue is based on the papers presented at the 15th Spacecraft Charging Technology Conference, Kobe, Japan, in 2018. The history of spacecraft charging goes back to the first Spacecraft Charging Technology Conference, sponsored by AFRL and NASA, that was held at the U.S. Air Force Academy, Colorado Springs, CO, USA, in 1978. The 15th Spacecraft Charging Technology Conference was hosted by the Japan Aerospace Exploration Agency (JAXA) and the Graduate School of System Informatics, Kobe University. It continues a tradition of international conferences on a ~2-year cycle. This conference, as well as each previous one in the series, was a great success. The topical discussions have greatly helped in making progress in the fields of spacecraft charging, spacecraft-plasma interactions, and related areas. At the end of the 15th Conference, the assembly agreed to request publication of the proceedings of the conference in the IEEE Transactions on Plasma Science and to encourage the submission of the papers presented at the conference to the Journal. [ABSTRACT FROM AUTHOR]

This Mini-Special Issue of the IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES (TMTT) is devoted to the 2019 Asia-Pacific Microwave Conference (APMC 2019), Singapore, December 10–13, 2019. APMC is one of the premier international conferences in the microwave community. The conference brought in a unique mix of high-quality keynote, invited, and contributed papers by world-class speakers from academia and industry, providing an opportunity for microwave family members to exchange their visions, insights, challenges, and progress in microwaves. It received a total submission of 1064 papers covering microwave to terahertz spectrum with a variety of applications by the authors from 56 countries/regions and finally accepted 720 papers after careful and rigorous peer review. The conference consisted of 71 technical oral and poster sessions from 53 technical tracks, eight workshops/short courses, 29 invited talks, and two plenary talks. In particular, 17 special sessions are convened by session organizers to discuss emerging technologies. [ABSTRACT FROM AUTHOR]

The XXIII Magnetic Recording Conference, TMRC 2012, convened in San Jos?, California, on August 20?22, 2012. On behalf of the Organizing Committee, we are pleased to present in this issue of the IEEE Transactions on Magnetics selected papers from the Conference. The Magnetic Recording Conference is an annual forum with a format of only invited lectures and contributed poster paper presentations. Conferences such as TMRC bring to the forefront the technological anchors and deep science that enable and propel the data-driven society we take for granted. The invited-lecture-only format enabled in-depth expos?s and discussion on the conference topics, and each speaker committed to present a poster for further consideration and discussion. TMRC 2012 addressed paths to higher magnetic recording areal density, with emphasis on all the variants of energy-assisted recording, patterned media, and the recording channels and algorithms that the new technologies demand. To witness that milestone, and to participate in the discussions of the state-ofthe- art recording technologies presented by the 36 invited speakers and five contributed posters, there were 247 participants from Austria, Canada, China, Germany, Greece, Japan, Singapore, South Korea, UK, and the USA. [ABSTRACT FROM AUTHOR]

As guest editor for the Special Section on the 2019 International Conference on Compound Semiconductor Manufacturing Technology (CS-MANTECH), I am gratified to be able to present IEEE Transactions on Semiconductor Manufacturing readers with a selection of papers based on work presented at the 2019 edition of the conference. The CS-MANTECH conference is a unique technical forum for presenting advancements in compound semiconductor devices. A special strength of CS-MANTECH is its strong emphasis on manufacturing technologies associated with compound semiconductor manufacturing. While devices based on compound semiconductors have long been used in high-performance RF, microwave, and millimeter-wave systems, in recent years compound-semiconductors have been increasingly finding their way into power systems (through advancements in SiC, GaN, Ga2O3, and other wide band gap device technologies). In addition, while compound semiconductors have long been essential for optoelectronic applications such as detectors, LEDs, and lasers, the widespread commercialization of these technologies has led to rapid advances in volume manufacturing of these devices. Additionally, trends towards tighter integration with silicon-based technologies to provide enhanced system-level performance and functionality have been accelerating, providing further opportunities for advancements in compound semiconductor manufacturing. [ABSTRACT FROM AUTHOR]

The papers in this special section were presented at two major EMC events in 2018. These include the 2018 Joint IEEE International Symposium on Electromagnetic Compatibility and Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) and the 2018 IEEE Symposium on Electromagnetic Compatibility, and Signal and Power Integrity. [ABSTRACT FROM AUTHOR]

Focuses on the technical program presented at the 2001 Institute of Electrical and Electronics Engineers Microwave Theory and Techniques Society International Microwave Symposium in Phoenix, Arizona. Coverage of the technical program; Record on the number of paper submission; Citations on the topics in the symposium.

The 2017 Asia-Pacific Microwave Conference (APMC 2017) was held in Kuala Lumpur, Malaysia, on November 13, 2017–November 16, 2017. The conference was sponsored by the IEEE Microwave Theory and Techniques (MTT) Society, organized by the Malaysian IEEE AP/MTT/EMC Joint Chapter, and technically co-sponsored by the European Microwave Association and the IEEE Antennas and Propagation Society. Out of ~537 papers submitted, ~360 papers were accepted for presentation in the conference and publication in the 2017 APMC proceedings. These papers have also been published online on the IEEE Xplore website. The technical program involved 430 authors coming from 40 different countries. [ABSTRACT FROM AUTHOR]

On behalf of the Publications Committee, it is our pleasure to present selected papers from the Intermag 2017 Conference, which was held in Dublin, Ireland, from April 24–28, 2017. The outstanding quality of the conference is reflected by the scientific and technical quality of the papers presented in this special issue of the IEEE Transactions on Magnetics. The Publications Committee received 654 manuscripts which were submitted for peer review and possible publication in the present volume. In order to be considered for publication, the manuscripts were required to meet rigorous criteria for novelty in applied and basic magnetism. Following the standard IEEE review process, each paper was reviewed by at least two anonymous referees, and in the end, 425 papers were accepted for publication. [ABSTRACT FROM AUTHOR]

The article combines an editorial requests for research papers for future issue as well as calendar of events related to the Institute of Electrical & Electronics Engineers (IEEE). The topic of the April 2009 issue will be interoperable identity management systems, the article states. Topics include international symposiums on computational intelligence and design, applied imagery pattern recognition, and ubiquitous multimedia computing. Also discussed are international conferences on computer design and hot topics in Web systems.

Describes the above-named upcoming conference event. May include topics to be covered or calls for papers. [ABSTRACT FROM AUTHOR]

Describes the above-named upcoming conference event. May include topics to be covered or calls for papers. [ABSTRACT FROM AUTHOR]

Describes the above-named upcoming conference event. May include topics to be covered or calls for papers. [ABSTRACT FROM AUTHOR]

Describes the above-named upcoming conference event. May include topics to be covered or calls for papers. [ABSTRACT FROM AUTHOR]

Provides information on the creation and development of the International Symposium on Electrical Insulation (ISEI) by the Institute of Electrical and Electronic Engineers Incorporated. Discussion of the recipients of the Thomas Dakin Scientific Achievement Award; Research and technological development papers collected by the ISEI.

The IEEE International Magnetics Conference, Intermag Europe 2017, was held in Dublin, Ireland, from April 24–28, 2017. There were 1470 registrants from over 50 countries (including 45% from Europe, 37% from Asia, and 10% from the USA). A total of 2060 contributed digests were submitted, 73% of which were accepted, together with 96 invited digests. There were 56 oral sessions, 59 poster sessions, and eight special symposia covering the following topics: Magnetocaloric Materials: New Concepts for Energy Application; Smart City, Smart Living; Bio-Applied Magnetism; Additive Manufacturing and 3D Printing of Magnets; When THz Meets X-rays: An Ultrafast View on Magnetism; Magnetic Micro- and Nano-Actuators and Robots; STT-MRAM: Toward Volume Production; and Spin-Dependent Phenomena in 2D Materials and van der Waals Heterostructures. A total of 654 papers were submitted, 425 of which were accepted for publication in this issue of the IEEE Transactions on Magnetics. [ABSTRACT FROM AUTHOR]

As guest editors for the special section on the 2016 International Conference on Compound Semiconductor Manufacturing Technology (CS MANTECH), we are pleased to present the readership of IEEE Transactions on Semiconductor Manufacturing with a selection of papers developed from presentations made at this year’s conference. While semiconductor wafer volume is dominated by technologies based on silicon, compound semiconductor devices and integrated circuits are important for a range of applications and markets. Compound semiconductors have traditionally found use in technological areas demanding maximum performance, often for high speed or high frequency applications. Examples include high-speed wired, fiber, and point-to-point communications infrastructure, defense-related sensing and communications, and high-efficiency RF power amplifiers in consumer mobile wireless applications. However, recent trends have been eroding these traditional distinctions, with emerging applications such as power control and commercial wireless infrastructure being increasingly addressed using GaN and related materials, while ultra-low-power analog–and even future CMOS nodes for logic–embracing narrow-band gap III-V materials. [ABSTRACT FROM AUTHOR]

It is my great pleasure to present to you this special issue of the IEEE TRANSACTIONS ON MAGNETICS containing selected extended papers originally presented at the 20th Conference on the Computation of Electromagnetic Fields (Compumag 2015), which took place in Montreal from June 28 to July 2, 2015. From the original nearly 650 papers submitted to Compumag Montreal, 423 were presented at the conference and 348 submitted in extended format to the IEEE TRANSACTIONS ON MAGNETICS. Of those, 231 have been accepted and are included in this issue. [ABSTRACT FROM AUTHOR]

On behalf of the Publication Committee of the IEEE International Magnetic Conference (Intermag 2015), I am pleased to present a selection of papers from Intermag 2015 held at the China National Convention Center, Beijing, China, on May 11-15, 2015. Among the 1759 oral and poster presentations in Intermag 2015, 1076 papers were submitted for a peer review and possible publication in the present volume of the IEEE TRANSACTIONS ON MAGNETICS, covering various aspects of magnetic materials and devices. After a rigorous review process, 590 manuscripts were selected for publication in this issue of the Transactions, strictly following the IEEE rules for conference-related papers. [ABSTRACT FROM AUTHOR]

This Transaction’s Mini-Special Issue includes a selection of papers presented last year at the 2017 IEEE Radio Frequency Integrated Circuits Symposium (RFIC 2017) held in the Hawaii Convention Center, Honolulu, HI, USA, on June 4–6, 2017. The main theme of the 2017 RFIC Symposium was emerging 5G technology. [ABSTRACT FROM AUTHOR]

This Special Issue of IEEE Transactions on Dielectrics and Electrical Insulations is to provide an insight into the recent research in the various fields covered by the electrets and related phenomena. Most papers are extended versions of contributions presented at the 15th International Symposium on Electrets, held at Johns Hopkins University in Baltimore, Maryland, USA, August 11-13, 2014. After 42 years of ISE meetings held in South America, Asia, and Europe, ISE 15 brought the meeting back to its origins in the United States. The first two meetings in this conference series were held from Oct. 15-20, 1967 in Chicago and from Oct 8-13, 1972 in Miami. [ABSTRACT FROM AUTHOR]

Describes the above-named upcoming special issue or section. May include topics to be covered or calls for papers. [ABSTRACT FROM PUBLISHER]

Describes the above-named upcoming special issue or section. May include topics to be covered or calls for papers. [ABSTRACT FROM PUBLISHER]

These instructions give guidelines for preparing papers for this publication. Presents information for authors publishing in this journal. [ABSTRACT FROM PUBLISHER]

The articles in this special issue include papers from the CVPR'11 conference which was held in Colorado Spring, CO, June 2011. [ABSTRACT FROM PUBLISHER]

The article focuses on several papers that are presented at the Compumag conference, which were considered for inclusion in the special issue of Institute of Electrical and Electronics Engineers Inc. (IEEE) Transactions on Magnetics. Each paper was assigned two reviewers to complete an evaluation report for every paper, including score from zero to 10 in the different dimensions. It notes that the review process ensured high scientific and technical quality.

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM PUBLISHER]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM PUBLISHER]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]