16 results on '"Chen, Kevin J."'
Search Results
2. On the operating speed and energy efficiency of GaN-based monolithic complementary logic circuits for integrated power conversion systems
- Author
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Zheng, Zheyang, Xu, Han, Zhang, Li, and Chen, Kevin J.
- Published
- 2021
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3. Short-Circuit Characteristics and High-Current Induced Oscillations in a 1200-V/80-mΩ Normally-Off SiC/GaN Cascode Device.
- Author
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Lyu, Gang, Sun, Jiahui, Wang, Yuru, and Chen, Kevin J.
- Subjects
MODULATION-doped field-effect transistors ,FIELD-effect transistors ,GALLIUM nitride ,CURRENT fluctuations ,STRAY currents - Abstract
A normally-off SiC-JFET/GaN-HEMT cascode device is recently proposed, featuring a cascode configuration that incorporates a high-voltage (HV, e.g., 1200 V) silicon-carbide (SiC) junction field effect transistor (JFET) delivering the HV blocking capability and a low-voltage (LV) enhanced-mode (E-mode) gallium-nitride (GaN) high electron mobility transistor (HEMT) providing the normally-off gate control. This all-wide-bandgap device exhibits superior thermal stability and high switching speed compared to its counterparts, e.g., the SiC/Si cascode device. In this article, we study short-circuit (SC) characteristics of a 1200-V/80-mΩ SiC/GaN cascode device by considering the interactions between the SiC and GaN devices. The single-event SC withstand time (SCWT) of the demonstrated SiC/GaN cascode device is tested to be ∼3 μs under a dc-bus voltage (Vdc) of 600 V when the turn-on gate voltage (VG-on) is set to 5 V. The SC failure occurs due to the formation of hot spots induced by thermal-runaway leakage currents inside the SiC JFET. The SCWT of the cascode device could be improved by applying a moderate VG-on (e.g., SCWT = ∼6.5 μs at VG-on = 3.5 V under v dc = 600 V) without affecting the on-state resistance (r on). However, it is identified that current oscillations tend to be triggered during the SC period when VG-on is too low (e.g., lower than 3 V). The oscillation behavior is attributed to the energy stored in the interconnection parts between the SiC and GaN devices. The harmful oscillations could be suppressed by applying higher VG-on, which drives the SiC JFET into low-transconductance mode by modulating the drain-to-source voltage (VDS-G) of the LV GaN HEMT. [ABSTRACT FROM AUTHOR]
- Published
- 2022
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4. 650-V Normally-OFF GaN/SiC Cascode Device for Power Switching Applications.
- Author
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Zhong, Kailun, Wang, Yuru, Lyu, Gang, Wei, Jin, Sun, Jiahui, and Chen, Kevin J.
- Subjects
MODULATION-doped field-effect transistors ,GALLIUM nitride ,THRESHOLD voltage - Abstract
A 650-V/84-mΩ normally-off GaN/SiC cascode device is demonstrated with systematic static and dynamic characterizations. The cascode device features a low-voltage enhancement-mode (E-mode) gallium nitride (GaN) high electron mobility transistor (HEMT) to enable normally-off gate control, and a 650-V normally-on silicon carbide (SiC) JFET provides the high-voltage blocking capability. The GaN/SiC cascode device exhibits many application-desired behaviors, including reverse conduction capability, avalanche breakdown capability, thermally stable threshold voltage, low input/output capacitances, no dynamic RON degradation, and negligible dynamic VTH shift. In addition, a customized double-pulse test board is built to evaluate the switching performance of this cascode device and other 650-V SiC-based power devices. This cascode device adopting low-voltage GaN HEMT has low QG×RON and exhibits excellent switching performance. The switching losses (EON and EOFF) are much smaller than that of the 650-V Si/SiC cascode device and comparable to that of the state-of-the-art 650-V SiC MOSFETs. [ABSTRACT FROM AUTHOR]
- Published
- 2022
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5. GaN on Engineered Bulk Si (GaN-on-EBUS) Substrate for Monolithic Integration of High-/Low-Side Switches in Bridge Circuits.
- Author
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Lyu, Gang, Wei, Jin, Song, Wenjie, Zheng, Zheyang, Zhang, Li, Zhang, Jie, Feng, Sirui, and Chen, Kevin J.
- Subjects
BRIDGE circuits ,SWITCHING circuits ,GALLIUM nitride ,MODULATION-doped field-effect transistors ,ION implantation ,MOLECULAR beam epitaxy ,LOGIC circuits ,EPITAXY - Abstract
A cost-effective engineered bulk silicon (EBUS) substrate technology is presented, featuring p-n junction implemented on bulk Si substrates using mainstream ion implantation and thermal annealing processes. Standard p-GaN/AlGaN/GaN heterostructures are successfully grown on the EBUS substrate and used to fabricate 200-V enhancement-mode p-GaN gate HEMTs. By creating deep trenches in the EBUS substrate to isolate the local P+ silicon regions underneath the high-side (HS) and low-side (LS) power switches, adverse effects (e.g., back-gating and dynamic ON-resistance degradation) in the use of conventional bulk Si substrate are all eliminated. The mechanism of crosstalk suppression in the GaN-on-EBUS platform is revealed in comparison with conventional GaN-on-Si platform and verified by a series of designed tests. [ABSTRACT FROM AUTHOR]
- Published
- 2022
- Full Text
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6. Monolithic Integration of Gate Driver and Protection Modules With P -GaN Gate Power HEMTs.
- Author
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Xu, Han, Tang, Gaofei, Wei, Jin, Zheng, Zheyang, and Chen, Kevin J.
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THRESHOLD voltage ,INTEGRATING circuits ,TRAFFIC safety ,REACTION time ,GALLIUM nitride ,LOGIC circuits - Abstract
The high-speed superiority of GaN power devices with silicon-based peripheral circuits is not yet fully leveraged, mainly due to the parasitic inductance of interconnections. In this article, we demonstrate a GaN-based gate driver with an overcurrent (OC) protection circuit and an undervoltage lockout (UVLO) circuit on a p-GaN gate power HEMT platform. The gate driver features a rail-to-rail output voltage, suppressed gate ringing, and tunable driving speed, all of which are highly desired in high-efficiency and high-speed GaN power systems. To offer timely but reliable protections, the OC protection and UVLO circuit are designed with reference to the switching speed and the threshold voltage of GaN power devices. The OC protection is implemented with a separated sensing branch and blanking time controller, and the response time to an OC event is reduced to 10 ns after the blanking time. The UVLO circuit has a fixed hysteresis of 0.5 V, and its threshold voltage is especially tailored for the GaN integrated circuits. [ABSTRACT FROM AUTHOR]
- Published
- 2022
- Full Text
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7. Short-Circuit Failure Mechanisms of 650-V GaN/SiC Cascode Devices in Comparison With SiC MOSFETs.
- Author
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Sun, Jiahui, Zhong, Kailun, Zheng, Zheyang, Lyu, Gang, and Chen, Kevin J.
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METAL oxide semiconductor field-effect transistors ,FIELD-effect transistors ,JUNCTION transistors ,MODULATION-doped field-effect transistors ,GALLIUM nitride ,FAILURE mode & effects analysis - Abstract
Although the gallium nitride (GaN) high-electron-mobility transistor/silicon carbide (SiC) junction field-effect transistor (JFET) cascode device exhibits certain performance advantages over the SiC metal–oxide–semiconductor field-effect transistor (MOSFET), its robustness in harsh operating conditions is unknown. In this work, the short-circuit (SC) robustness of 650-V GaN/SiC cascode devices is characterized, analyzed, and compared with that of several mainstream SiC MOSFETs. GaN/SiC cascode devices exhibit competitive SC capability. Different failure modes are observed: thermal runaway in the SiC JFET of the cascode device and gate-to-source breakdown in the SiC MOSFET. The difference is associated with the configuration of the dielectric above SiC in the JFET and the source pad layout. According to the waveforms in SC events, failure spots, and thermal simulation results, a thermal runaway in the SiC JFET is attributed to the positive feedback between the drain leakage current and the junction temperature in the local area (hotspot) without the source pad on the top. The SC withstand time of the cascode device can be extended by reduction of the active area without the source pad. [ABSTRACT FROM AUTHOR]
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- 2022
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8. Negative Gate Bias Induced Dynamic ON-Resistance Degradation in Schottky-Type p -Gan Gate HEMTs.
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Jiang, Zuoheng, Hua, Mengyuan, Huang, Xinran, Li, Lingling, Wang, Chengcai, Chen, Junting, and Chen, Kevin J.
- Subjects
MODULATION-doped field-effect transistors ,IMPACT ionization ,LOGIC circuits - Abstract
In this article, the impacts of the off-state gate bias (VGS,OFF) on dynamic on-resistance (RON) are systematically investigated in commercial Schottky-type p-GaN Gate high-electron-mobility transistors. Double-pulse tester and pulsed I–V system are adopted to evaluate the dynamic RON with various off-state gate and drain bias (VDS,OFF) under hard- and soft-switching conditions. More negative VGS,OFF can aggravate the dynamic RON degradation under both soft- and hard-switching, especially when switching with a high VDS,OFF. The impacts of VGS,OFF on switching transients and off-state stress are investigated separately to reveal the underlying mechanisms, which are found to be associated with the generation and movements of holes. The off-state gate bias of the voltage-driving scheme needs to be carefully considered according to the identified mechanisms in terms of dynamic on-resistance degradation. [ABSTRACT FROM AUTHOR]
- Published
- 2022
- Full Text
- View/download PDF
9. GaN HEMTs on low resistivity Si substrates with thick buffer layers for RF signal amplification and power conversion.
- Author
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Song, Wenjie, Zhang, Jie, Zheng, Zheyang, Feng, Sirui, Yang, Xuelin, Shen, Bo, and Chen, Kevin J.
- Subjects
RADIO frequency ,BUFFER layers ,GALLIUM nitride ,MODULATION-doped field-effect transistors ,BREAKDOWN voltage ,LATTICE constants ,DISLOCATION density - Abstract
We report GaN high-electron-mobility transistors (HEMTs) with a thick (7.7 µm) GaN buffer on a Czochralski low resistivity Si (LRS) substrate. The GaN HEMTs exhibit high performance for both radio-frequency (RF) amplification and power conversion. The thick GaN buffer was grown by means of vacancy engineering, delivering a low dislocation density of ∼1.6 × 10
8 cm−2 , contributing to suppressed RF signal coupling to the lossy Si substrate and a high vertical voltage blocking capability. For RF performance, GaN HEMTs with a 650 nm gate exhibit an fT /fMAX value of 25.1/32.3 GHz and a maximum output power POUT of 2.2 W/mm at 4 GHz with a drain voltage VDS of 20 V, which is comparable with the performance of RF GaN HEMTs on a high-resistivity silicon substrate without the existence of the field plate. For power performance, the vertical breakdown voltage of the wafer is 1160 V, and the three-terminal lateral breakdown voltage is 885 V in a GaN HEMT with a gate-to-drain distance of 8 µm. The thick GaN layer on the LRS substrate scheme thus provides a compelling platform for monolithic integration of high-performance RF devices and high-voltage power devices. [ABSTRACT FROM AUTHOR]- Published
- 2022
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10. ON-Resistance Analysis of GaN Reverse-Conducting HEMT With Distributive Built-In SBD.
- Author
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Wei, Jin, Zhang, Li, Zheng, Zheyang, Song, Wenjie, Yang, Song, and Chen, Kevin J.
- Subjects
SCHOTTKY barrier diodes ,GALLIUM nitride ,POWER transistors - Abstract
Recently, a GaN reverse-conducting high-electron-mobility transistor (RC-HEMT) has been demonstrated. The RC-HEMT features built-in distributive Schottky contacts, which provide a low-loss freewheeling path. The RC-HEMT offers the same functionality as an HEMT/Schottky barrier diode (SBD) pair, but consumes much less chip area, thus its ${R}_{ \mathrm{\scriptscriptstyle ON}}$ (ON-resistance $\times $ total device width) is significantly reduced. Theoretically, ${R}_{ \mathrm{\scriptscriptstyle ON}}$ of the RC-HEMT can approach that of an HEMT. In practice, due to certain geometry limitations, ${R}_{ \mathrm{\scriptscriptstyle ON}}$ of an RC-HEMT lies between an HEMT/SBD pair and a single HEMT. This work investigates the factors that influence ${R}_{ \mathrm{\scriptscriptstyle ON}}$ of the RC-HEMT using both experimental measurements and numerical simulations. It is found that ${R}_{ \mathrm{\scriptscriptstyle ON}}$ of the RC-HEMT is strongly affected by the geometry of the source and channel regions, where HEMT sections and SBD sections are interdigitally distributed. With coarse patterning of these regions, ${R}_{ \mathrm{\scriptscriptstyle ON}}$ of the RC-HEMT is close to the HEMT/SBD pair. Through proper geometry scaling, ${R}_{ \mathrm{\scriptscriptstyle ON}}$ of RC-HEMT is reduced and approaches that of HEMT. [ABSTRACT FROM AUTHOR]
- Published
- 2022
- Full Text
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11. Impact of Drain Leakage Current on Short Circuit Behavior of GaN/SiC Cascode Devices.
- Author
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Sun, Jiahui, Zheng, Zheyang, Zhong, Kailun, Lyu, Gang, and Chen, Kevin J.
- Subjects
STRAY currents ,SHORT circuits ,GALLIUM nitride ,FAILURE analysis ,MODULATION-doped field-effect transistors ,THRESHOLD voltage ,SUPERCONTINUUM generation - Abstract
The short circuit (SC) behavior of a newly developed GaN-HEMT/SiC-JFET cascode device is investigated in this work. The reverse leakage current through the drain-side PN junction (IR) of the SiC JFET under SC conditions is measured simultaneously during the SC event. IR of the SiC JFET increases to 6.4 A at the end of a 5-μs nondestructive SC pulse. The increase of IR during the SC pulse induces a turning point in the SC current waveform and a dramatic negative threshold voltage shift (>30 V) in the SiC JEFT, resulting in high transient drain-to-source voltage in the GaN HEMT. The underlying mechanism is associated with the increase of local potential in the P-type layer of the SiC JFET with inevitable spread resistance (RSPD). It is suggested that reducing RSPD can improve SC capability and high IR should be considered in SC failure mechanism analysis and the design of external gate resistance of the SiC JFET. [ABSTRACT FROM AUTHOR]
- Published
- 2021
- Full Text
- View/download PDF
12. Short Circuit Capability Characterization and Analysis of p-GaN Gate High-Electron-Mobility Transistors Under Single and Repetitive Tests.
- Author
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Sun, Jiahui, Wei, Jin, Zheng, Zheyang, and Chen, Kevin J.
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SHORT circuits ,THERMAL fatigue ,FATIGUE cracks ,FAILURE analysis ,BUFFER layers ,MODULATION-doped field-effect transistors - Abstract
Short circuit (SC) capability of 650-V Schottky-type p-GaN gate high-electron-mobility transistors (HEMTs) under single and repetitive tests is characterized in this article. The investigated devices exhibit strong capability under a single SC test, but weak capability under repetitive SC tests with a bus voltage of 400 V and a gate drive voltage of 6 V. The failure mechanism under repetitive SC tests is revealed through electrothermal simulation and microscale failure spot analysis. Thermal fatigue cracks are formed due to the high temperature spike and local temperature fluctuations in the narrow GaN channel and buffer layers, leading to weak repetitive SC capability. The unique heat confinement effect in the GaN layer plays an important role in the formation of high temperature spike and fatigue cracks. The withstand time in a single SC test is several hundred microseconds due to fast drain current drop that results from high temperature and, to a lesser degree, the dynamic threshold voltage shift during the SC transient. The device failure in a single-event SC test is related to heat diffusion to a wider region. Some guidelines are proposed for handling and improving the repetitive SC capability. [ABSTRACT FROM AUTHOR]
- Published
- 2021
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13. Approaching precision public health by automated syndromic surveillance in communities.
- Author
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Chan, Ta-Chien, Tang, Jia-Hong, Hsieh, Cheng-Yu, Chen, Kevin J., Yu, Tsan-Hua, and Tsai, Yu-Ting
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PHYSICIANS ,HEALTH boards ,PRIMARY care ,PUBLIC health ,REPORTING of diseases - Abstract
Background: Sentinel physician surveillance in communities has played an important role in detecting early signs of epidemics. The traditional approach is to let the primary care physician voluntarily and actively report diseases to the health department on a weekly basis. However, this is labor-intensive work, and the spatio-temporal resolution of the surveillance data is not precise at all. In this study, we built up a clinic-based enhanced sentinel surveillance system named "Sentinel plus" which was designed for sentinel clinics and community hospitals to monitor 23 kinds of syndromic groups in Taipei City, Taiwan. The definitions of those syndromic groups were based on ICD-10 diagnoses from physicians. Methods: Daily ICD-10 counts of two syndromic groups including ILI and EV-like syndromes in Taipei City were extracted from Sentinel plus. A negative binomial regression model was used to couple with lag structure functions to examine the short-term association between ICD counts and meteorological variables. After fitting the negative binomial regression model, residuals were further rescaled to Pearson residuals. We then monitored these daily standardized Pearson residuals for any aberrations from July 2018 to October 2019. Results: The results showed that daily average temperature was significantly negatively associated with numbers of ILI syndromes. The ozone and PM
2.5 concentrations were significantly positively associated with ILI syndromes. In addition, daily minimum temperature, and the ozone and PM2.5 concentrations were significantly negatively associated with the EV-like syndromes. The aberrational signals detected from clinics for ILI and EV-like syndromes were earlier than the epidemic period based on outpatient surveillance defined by the Taiwan CDC. Conclusions: This system not only provides warning signals to the local health department for managing the risks but also reminds medical practitioners to be vigilant toward susceptible patients. The near real-time surveillance can help decision makers evaluate their policy on a timely basis. [ABSTRACT FROM AUTHOR]- Published
- 2021
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14. Flight Trajectory Optimization of Sailplane After Rope Break.
- Author
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Collazo Garcia III, Armando R., Ranjan, Prateek, Chen, Kevin J., James, Kai A., and Ansell, Phillip J.
- Abstract
A study was performed to characterize an optimum return trajectory for a sailplane after a rope-break failure during an aerotow launch procedure. The performance of an SGS 1-26E sailplane was simulated using the equations of motion for quasi-steady flight in a time-stepping routine and published aerodynamic polar data. A gradient-based optimization algorithm was implemented using the simulated trajectory considering the glide velocity, bank angles, and runway offset angle to determine the minimum rope-break altitude from which a successful return could be theoretically produced. The SGS 1-26E sailplane was used in a flight-test campaign for empirical turn modeling and validation of the performance simulation. The minimum altitude where a return trajectory and downwind runway landing could be successfully completed after a rope-break event was observed to be 76.4 ft above ground level. A headwind and crosswind presence was observed to decrease the minimum rope-break altitude with increasing wind velocity up to a critical value, after which rope-break altitudes began to increase. These minimum rope-break altitudes serve as a theoretical indication that safe trajectories can be performed at lower failure altitudes than the commonly practiced decision altitude of 200 ft for certain wind conditions. [ABSTRACT FROM AUTHOR]
- Published
- 2021
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15. Evaluating the Effectiveness of School Closure in COVID-19-Related Syndromes From Community-Based Syndromic Surveillance: Longitudinal Observational Study.
- Author
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Chung PC, Chen KJ, Chang HM, and Chan TC
- Abstract
Background: During the COVID-19 pandemic, a school closure policy was adopted to prevent cluster transmission in schools and subsequent household transmission. However, the effectiveness of school closure is not consistent in studies conducted in different countries., Objective: This study aimed to explore the association between school closure and the daily standardized incidence of COVID-19-related syndromes in an outpatient syndromic surveillance system., Methods: We calculated the incidence of COVID-19-related syndromes derived from a community-based syndromic surveillance system between the first week of January and the second or fourth weeks after school closure in 2021 and 2022 in Taipei City, Taiwan. The effect of school closure on the standardized incidence of COVID-19-related syndromes was evaluated by interrupted time series analysis using an autoregressive integrated moving average with a distributed lag function. The exogenous variables were changes in human mobility measured by Google COVID-19 community mobility reports. Furthermore, the models quantified the influence of different age groups and the hierarchy of medical facilities, such as clinics or community hospitals., Results: School closure was only negatively and significantly associated with the overall standardized incidence of COVID-19-related syndromes in 2021 for 2 weeks after the intervention (coefficient -1.24, 95% CI -2.40 to -0.08). However, in different age groups, school closure had a significantly negative association with the standardized incidence among people aged 13-18 years and ≥65 years for 2 weeks after the intervention in clinics in 2021. In community hospitals, school closure was significantly positively associated with the standardized incidence among people aged 19-24 years in 2021. In 2022, 2 weeks after the intervention, school closure had a significantly negative association with the standardized incidence among people aged 0-6, 7-12, and 19-24 years in community hospitals and aged >45 years in clinics. Furthermore, the standardized incidence was positively associated with movement change toward grocery and pharmacy stores in all age groups in 2022. In addition, movement changes toward residences were significantly positively associated with the standardized incidence among all age groups., Conclusions: Overall, school closure effectively suppresses COVID-19-related syndromes in students owing to the reduction of physical contact. In addition, school closure has a spillover effect on elderly people who stay at home., (©Ping-Chen Chung, Kevin J Chen, Hui-Mei Chang, Ta-Chien Chan. Originally published in the Interactive Journal of Medical Research (https://www.i-jmr.org/), 15.12.2023.)
- Published
- 2023
- Full Text
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16. Metastatic pancreatic neuroendocrine tumors feature elevated T cell infiltration.
- Author
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Greenberg J, Limberg J, Verma A, Kim D, Chen X, Lee YJ, Moore MD, Ullmann TM, Thiesmeyer JW, Loewenstein Z, Chen KJ, Egan CE, Stefanova D, Bareja R, Zarnegar R, Finnerty BM, Scognamiglio T, Du YN, Elemento O, Fahey TJ 3rd, and Min IM
- Subjects
- Animals, Mice, T-Lymphocytes, Chemokines, Tumor Microenvironment, Neuroendocrine Tumors, Pancreatic Neoplasms drug therapy
- Abstract
Pancreatic neuroendocrine tumors (PNETs) are malignancies arising from the islets of Langerhans. Therapeutic options are limited for the over 50% of patients who present with metastatic disease. We aimed to identify mechanisms to remodel the PNET tumor microenvironment (TME) to ultimately enhance susceptibility to immunotherapy. The TMEs of localized and metastatic PNETs were investigated using an approach that combines RNA-Seq, cancer and T cell profiling, and pharmacologic perturbations. RNA-Seq analysis indicated that the primary tumors of metastatic PNETs showed significant activation of inflammatory and immune-related pathways. We determined that metastatic PNETs featured increased numbers of tumor-infiltrating T cells compared with localized tumors. T cells isolated from both localized and metastatic PNETs showed evidence of recruitment and antigen-dependent activation, suggestive of an immune-permissive microenvironment. A computational analysis suggested that vorinostat, a histone deacetylase inhibitor, may perturb the transcriptomic signature of metastatic PNETs. Treatment of PNET cell lines with vorinostat increased chemokine CCR5 expression by NF-κB activation. Vorinostat treatment of patient-derived metastatic PNET tissues augmented recruitment of autologous T cells, and this augmentation was substantiated in a mouse model of PNET. Pharmacologic induction of chemokine expression may represent a promising approach for enhancing the immunogenicity of metastatic PNET TMEs.
- Published
- 2022
- Full Text
- View/download PDF
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