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Perspectives about growth of bulk gallium nitride crystals, fabricating high structural quality gallium nitride wafers and the market demand for them are presented. Three basic crystal growth technologies, halide vapor phase epitaxy, sodium flux, and ammonothermal, are described. Their advantages and disadvantages, recent development, and possibilities are discussed. The main difficulty with crystallization of thick GaN is determined. Some new solutions for bulk growth are proposed. It is shown that only crystallization on high structural quality native seeds will ensure proper progress. New ideas for fabricating gallium nitride crystals and wafers with a better control of their structural properties and point defect concentration are proposed. [ABSTRACT FROM AUTHOR]

Unscreened (ungated) plasmons in large-area grating-gate AlGaN/GaN heterostructures were studied experimentally by Fourier-transform spectroscopy. Special attention was paid to the recently discovered THz plasmonic crystal modes observed at totally depleted gated regions when plasma oscillations were localized only in ungated parts of the grating-gate structures. The frequency of these modes is still gate voltage-dependent in the limited range due to the depletion of the ungated parts located close to the gate edges. Double gate structures with an additional bottom gate were fabricated and studied to improve the gate voltage tunability of the unscreened plasmons. Since this gate is located deep below the channel, the plasmons behaved as ungated ones, but their frequency still could be tuned by this bottom gate. We show that the combined effect of the top and bottom gates allows the efficient tuning of terahertz frequencies of unscreened modes in the grating-gate AlGaN/GaN plasmonic crystals. [ABSTRACT FROM AUTHOR]

Abstract Recent progress in ammonothermal technology of bulk GaN growth in basic environment is presented and discussed in this paper. This method enables growth of two-inch in diameter crystals of outstanding structural properties, with radius of curvature above tens of meters and low threading dislocation density of the order of 5 × 104 cm−2. Crystals with different types of conductivity, n-type with free electron concentration up to 1019 cm−3, p-type with free hole concentration of 1016 cm−3, and semi-insulating with resistivity exceeding 1011 Ω cm, can be obtained. Ammonothermal GaN of various electrical properties is described in terms of point defects present in the material. Potential applications of high-quality GaN substrates are also briefly shown. [ABSTRACT FROM AUTHOR]

Results of gallium nitride crystallization by ammonothermal method are presented. GaN crystals grown earlier by a HVPE method on an ammonothermal GaN substrate and an MOCVD-GaN/sapphire template were used as seeds. Structural and optical properties of the obtained materials are studied and compared. Large radius of curvature (>100 m) and low dislocation density (7×10 4 cm −2 ) can be reproduced in the ammonothermal method using an HVPE-GaN seed grown before on ammonothermal GaN. This proves that the use of HVPE-GaN grown on ammonothermal seeds allows to reproduce high crystallinity in a subsequent ammonothermal growth. It also demonstrates that a much more effective multiplication process of high quality GaN can be launched using a combination of the ammonothermal and HVPE methods. [ABSTRACT FROM AUTHOR]

Zinc is often regarded as an alternative to magnesium p-type dopants in gallium nitride. However, besides many theoretical predictions, at present, there are poor data on experimentally revealed p-type conductivity and evaluation of Zn activation energy by means of electrical transport measurements. In this paper, ammonothermal crystallization of bulk GaN:Zn monocrystals is reported. Despite a high doping level of Zn (up to 2 × 1020 cm−3), p-type conductivity with hole concentration as low as of 4 × 1015 cm−3 at room temperature and mobility about 3 cm2/V s was observed. A deep nature of the Zn acceptor was proved, as the ionization energy can exceed 260 meV. In addition, conduction in the impurity band appeared at temperatures as high as room temperature. [ABSTRACT FROM AUTHOR]

GaN/AlGaN quantum wells (QWs) were grown by metal–organic vapor phase epitaxy (MOVPE) on c -, a -, m -, and (20.1)-plane GaN substrates obtained by the ammonothermal method in the same MOVPE process, i.e. a process with growth parameters optimized for c -plane GaN templates. The structural properties of GaN/AlGaN QWs were carefully investigated by high angle annular dark field scanning transmission electron microscopy. Sharp GaN/AlGaN interfaces were seen for QWs grown on the c -, a -, and m -plane GaN substrates, but very rough interfaces with {1-100} and {1-101} facets were observed on the (20.1)-plane GaN substrate. In addition, the Al-rich region of AlGaN and GaN transition was identified for each of the GaN/AlGaN QW samples deposited in this process. The thickness and composition of this region varied with the crystallographic orientation of GaN substrates. [ABSTRACT FROM AUTHOR]

One of the main advantages of the hydride vapor phase epitaxy (HVPE) method for crystallizing bulk gallium nitride is the crystallization of GaN with a relatively high growth rate (>100 μm/h). In this paper various growth rates in the c -direction during crystallization of GaN by HVPE on ammonothermally grown GaN crystals are determined and examined. The influence of the highest (380 μm/h) and the lowest (40 μm/h) growth rate on the structural quality and purity of the HVPE-GaN crystals is analyzed. The optimal macroscopically stable growth rate (without cracks and pits) and the way of achieving it are presented and discussed. [ABSTRACT FROM AUTHOR]

The results of the Hydride Vapor Phase Epitaxy (HVPE) on ammonothermal GaN seeds (Am-GaN) with various misorientations: 0.3, 0.5 and 1 degree to the [1 0 −1 0] and [1 1 −2 0] directions are presented. Growth rate and structural quality of the HVPE-GaN layers are analyzed. Morphology of the crystal growing surface at the beginning of the crystallization process (after one and two hours of growth) and at the end of it (after eight hours) is presented as a function of the Am-GaN seed misorientation. Based on these results a rough growth model is proposed and discussed in detail. [ABSTRACT FROM AUTHOR]

The work shows a successful fabrication of AlGaN/GaN high electron mobility transistor (HEMT) structures on the bulk GaN substrate grown by ammonothermal method providing an ultralow dislocation density of 104 cm−2 and wafers of size up to 2 inches in diameter. The AlGaN layers grown by metalorganic chemical vapor phase epitaxy method demonstrate atomically smooth surface, flat interfaces with reproduced low dislocation density as in the substrate. The test electronic devices—Schottky diodes and transistors—were designed without surface passivation and were successfully fabricated using mask-less laser-based photolithography procedures. The Schottky barrier devices demonstrate exceptionally low reverse currents smaller by a few orders of magnitude in comparison to the Schottky diodes made of AlGaN/GaN HEMT on sapphire substrate. [ABSTRACT FROM AUTHOR]