33 results on '"Chien, Wei-Ting Kary"'
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2. Exploration of baking temperature effects on 28 nm BEOL reliability
3. Early detection and prediction of HKMG SRAM HTOL performance by WLR PBTI tests
4. Influence of I/O oxide process on the NBTI performance of 28 nm HfO2-based HKMG p-MOSFETs
5. An Extended Building-In Reliability Methodology on Evaluating SRAM Reliability by Wafer-Level Reliability Systems
6. A Study On The Dielectric Intrinsic Breakdown Specification
7. AdaBalGAN: An Improved Generative Adversarial Network With Imbalanced Learning for Wafer Defective Pattern Recognition
8. Fast Semiconductor Reliability Assessments Using SPRT
9. The Competing Aging Effects on SRAM Operating Life Tests
10. Statistical Process Control for Monitoring the Particles With Excess Zero Counts in Semiconductor Manufacturing
11. The applications of FIB 3-point localization method in semiconductor failure analyses
12. Advanced delayer methods for TEM sample preparations
13. A study for big-data (Hadoop) application in semiconductor manufacturing
14. A method to group reliability data by hierarchical clustering
15. Influence of I/O oxide process on the NBTI performance of 28nm HfO2-based HKMG p-MOSFETs
16. Performance enhancement of ILD by reducing residues during contact W CMP
17. Reliability improvement based on silicon nitride MIM capacitors for mixed-signal and RF applications
18. Resolving plasma induced damage for a CMOS embedded-OTP technology
19. Wafer level package wafer probing shift error-proof quality control
20. The investigation of semiconductor shipping bag reliability
21. Electromigration Lifetime Optimization by Uniform Designs and a New Lifetime Index
22. Comprehensive Wafer Level Package Die Processing Service quality control enhancement
23. The reversed intrinsic curve and voltage dependence for ultra-low k dielectrics
24. Reliability Baseline Management and Applications in Semiconductor Manufacturing
25. Board level reliability enhancements for wafer level package
26. Ultra low-K CPI evaluations for foundry backend and assembly saw processes
27. Employing optimal experimental design to optimize the accelerated life test plan for TDDB
28. Early detection for quality and reliability management
29. Productive Polishing TEM Sample Preparation Methodology Development
30. Gate oxide reliability improvement for UMOS technology.
31. An investigation on the high temperature dependence of the HCI on NMOSFET transistor.
32. Sample preparation DOE for the die pull test.
33. Sample preparation and improvement for Die Pull test.
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