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The measurement of distance plays an integral part in many aspects of modern societies. In this paper an integrated mode-locked laser on a chip is used for distance measurement based on mode-resolved interferometry. The emission from the on-chip source with a repetition rate of 2.5 GHz and a spectral bandwidth of 3 nm is coupled into a Michelson interferometer. The interferometer output is recorded as a spectral interferogram, which is captured in a single camera image. The images are analyzed using Hilbert transform to extract the distance. The distance derived shows a deviation of 6 \mum from the reference, for a distance up to 25 mm. We also demonstrate interferometry with repetition frequency sweep which can also be used with the source. Performance is expected to be better in the near future with the rapid developments in the field of on-chip laser sources which are demonstrating larger spectral widths and coherence lengths.

Low-excess-loss arrayed waveguide gratings are enabled by unique application of deep UV lithography in InP integrated photonics through reduced feature sizes and, more specifically, well-resolved inter-waveguide gap dimensions. Submicrometer wafer-flatness is shown to be required to achieve the critical dimension uniformity better than 10 nm on 3-in substrates. Arrayed waveguide grating devices were fabricated and the effect of inter-waveguide gap scaling on the excess losses was measured and compared to simulations. Excess losses down to 0.15 dB were demonstrated to be lower than predicted with the 2-D simulations. The tapering of the etch depth inside the gaps due to the lag effect of the etch process may explain the improvements.

The standardization of photonic integration processes for InP has led to versatile and easily accessible generic integration platforms. The generic integration platforms enable the realization of a broad range of applications and lead to a dramatic cost reduction in the development costs of photonic integrated circuits (PICs). This paper addresses the SMART Photonics generic integration platform developments. The integration technology based on butt joint active-passive epitaxy is shown to achieve a platform without compromising the performance of the different components. The individual components or building blocks are described. A process design kit is established with a comprehensive dataset of simulation and layout information for the building blocks. Latest results on process development and optimization are demonstrated. A big step forward is achieved by applying high-resolution ArF lithography, which leads to increased performance for AWGs and a large increase in reproducibility and yield. The generic nature of the platform is demonstrated by analyzing a number of commercial multiproject wafer runs. It is clear that a large variety of applications is addressed with more than 200 designs from industry as well as academia. A number of examples of PICs are displayed to support this. Finally, the design flow is explained, with focus on layout-aware schematic-driven design flow that is required for complex circuits. It can be concluded that generic integration on InP is maturing fast and with the current developments and infrastructure it is the technology of choice for low cost, densely integrated PICs, ready for high-volume manufacturing.

Foundry services for photonic integration enable access to such technologies and facilitate fab-less businesses models. The technologies are sufficiently mature for proof-of-concept demonstrators, advanced prototypes, and two-medium small-volume production. Further improvement of the technology processes behind those services requires extensive research and development efforts in order to advance the foundry offerings and assure scalability, process control, and the yield required for volume production. A high-level automation of test and assembly processes in the PIC manufacturing chain is essential to improve statistical process control and scalability of all processes. These allow for early known-good-die identification, optimization of fabrication process window, improved yield, and volume production. In this paper we propose a standardized approach to chip layout that supports automated test and assembly processes already at the design phase. Moreover, we describe a modular test software framework based on open standards. Within this test framework, standard file formats for chip, equipment, and measurement description, and the open file formats for storage and exchange of data are described. This test framework is a part of the openEPDA initiative and enables test automation, user-defined testing, data analysis, exchangeability, and traceability across the full manufacturing chain from design to product.

Selective area growth is used for the first time in the TU/e generic integration platform to modify independently the bandgap of active sections. A chip combining 4 tunable lasers with shifted wavelength ranges has been fabricated. A 96 nm wide tuning range is demonstrated.

Access to fabrication of photonic integrated circuits is enabled via multi-project wafer runs offered by foundries. Such services open a path for proof-of-concept demonstrators and advanced prototypes. However, the technology processes behind those services need extensive developments in order to be scalable and suitable for volume production. Those developments are in a vast part related to test, assembly and packaging across the full PIC manufacturing chain. Standardization and automation of the test methods and equipment is essential for better statistical process control and scalability. When implemented, these will allow for early known-good-die identification, optimization of fabrication process window, improved yield and volume production.The challenges related to PIC testing will be discussed and current developments in our labs towards standardization and automation of test methods from a design phase to system level functional module evaluation will be presented.

We present our work on the realization of integrated III/V-on-silicon integrated mode-locked lasers. We demonstrate 1 GHz repetition rate mode-locked lasers with a spectrum spanning more than a 1 THz.

ArF deep UV (193 nm) lithography was successfully applied to fabricate Arrayed Waveguide Gratings in generic Indium Phosphide technology. The sub-dB transmission losses demonstrate the advantages of scaling down the minimum feature size to 100 nm.

We report a novel type of monolithically integrated tunable semiconductor laser. The tuning is achieved by three intracavity Mach–Zehnder interferometers, realized in passive waveguides and using voltage-controlled electro-optic phase modulators requiring only four control voltages. The potential of the design is demonstrated by a realized laser system that shows an optical linewidth of 363 kHz, output power of 3 mW, and a record tuning range of 74.3 nm. Such a continuous wavelength span is in excess of any monolithic semiconductor laser reported up to date. Precision of the tuning mechanism is demonstrated by a scan over a 0.89-GHz-wide absorption line of acetylene. The laser design is suitable for a number of applications, including gas spectroscopy, telecommunication, and optical coherence tomography. The laser has been fabricated in a multi-project wafer run on an indium phosphide-based generic photonic foundry platform and demonstrates the potential of these technology platforms.

Picosecond-pulse III-V-on-silicon mode-locked lasers based on linear and ring extended cavity geometries are presented. In passive mode-locked operation a 12 kHz -3dB linewidth of the fundamental RF tone at 4.7 GHz is obtained for the linear cavity geometry and 16 kHz for the ring cavity geometry. Stabilization of the repetition rate of these devices using hybrid mode-locking is also demonstrated.

RF frequency downconverters are of key importance in communication satellites. Classically, this is implemented using an electronic mixer. In this paper we explore the use of photonic technology to realize the same functionality. The potential advantages of such an approach compared to the classical microwave solutions are that it is lighter weight, has lower power consumption and can be made smaller if photonic technology is used. An additional advantage is the fact that the optical local oscillator (LO) reference can easily be transported over longer distances than the equivalent LO signal in the microwave domain due to the large bandwidth and low loss and dispersion of optical fiber. Another big advantage is that one can envision the use of short pulse trains as the LO - starting off from a sinusoidal RF reference - in order to exploit subsampling. Subsampling avoids the need for high frequency LO references, which is especially valuable if a downconversion over several 10s of GHz is required. In this paper we present the operation principle of such a photonic frequency downconverter and describe the performance of the developed micro-photonic building blocks required for this functionality. These micro-photonic building blocks are implemented on a III-V semiconductor-on-silicon photonic platform. The components include a micro-photonic hybridly modelocked laser, a 30GHz electroabsorption modulator and an intermediate frequency (1.5GHz) photodetector.

Optical frequency combs emerge as a promising technology that enables highly sensitive, near-real-time spectroscopy with a high resolution. The currently available comb generators are mostly based on bulky and high-cost femtosecond lasers for dense comb generation (line spacing in the range of 100 MHz to 1 GHz). However, their integrated and low-cost counterparts, which are integrated semiconductor mode-locked lasers, are limited by their large comb spacing, small number of lines and broad optical linewidth. In this study, we report a demonstration of a III-V-on-Si comb laser that can function as a compact, low-cost frequency comb generator after frequency stabilization. The use of low-loss passive silicon waveguides enables the integration of a long laser cavity, which enables the laser to be locked in the passive mode at a record-low 1 GHz repetition rate. The 12-nm 10-dB output optical spectrum and the notably small optical mode spacing results in a dense optical comb that consists of over 1400 equally spaced optical lines. The sub-kHz 10-dB radio frequency linewidth and the narrow longitudinal mode linewidth (

Optical sensing offers unrivalled precision with real-time monitoring, but the complexity in implementing the optical sources has so far limited deployments to high value measurement systems. Innovations in photonic integration are beginning to enable breakthroughs in terms of cost, size and performance. Integrated sources and readouts can be created with large-scale semiconductor wafer production techniques. InP integrated photonics is able to combine best-in-class components including the lasers and amplifiers within one photonic chip. The chip-scale integration of complete circuits enables on-chip stabilisation and environmental corrections for further advances in measurement precision and at lower power consumption.

In this paper we introduce the III–V photonic integration platforms for emerging applications beyond telecommunications. Recent achievements in the InP generic and InP membrane platforms for wireless and sensing applications are reviewed. The realized chips show the great potential of the InP-based photonic integration due to its full functionality, high flexibility and high performance.

Progress on the development of a long wavelength (∼2 µm) generic monolithic photonic integration technology on indium phosphide substrate and a novel concept of a tunable laser realized as a photonic integrated circuit using such technology are presented. Insights into the development of active and passive waveguide structures which are used to define a limited set of on-chip functionalities in the form of building blocks will be given. A novel tunable laser was proposed and designed using such predefined set of basic building blocks. The laser geometry features an intra-cavity wavelength tuning mechanism based on asymmetric Mach-Zehnder interferometers in a nested configuration. The photonic integrated circuit chip was fabricated within the first long wavelength multi-project wafer run. The experimental evaluations of the fabricated device show a record tuning range of 31 nm around 2027 nm and successful measurements of a 0.86 GHz wide absorption line of carbon dioxide. These results provide a demonstration of a fully functional photonic integrated circuit operating at wavelengths that are much longer than those in the typical telecommunication windows as well as the use of indium phosphide based generic photonic integration technologies for gas sensing applications.

The performance of integrated planar waveguide mode locked lasers can be enhanced using the available photonic integration platform technology in indium-phosphide. Extended cavity mode locked oscillators including DBR mirrors and phase modulators can be realized at telecom wavelengths to improve performance and control over the device. Integrated pulse shapers and special amplifiers can be used to improve the output properties further.

A novel operation mode field reconfigurable DBR laser is designed, realized and investigated experimentally. With different controlling of the same hardware, a shared-cavity six-section DBR laser diode can be flexibly configured to operate as a continuous wave or a pulsed wave laser.

We present our recent work on the realization of III-V-on-silicon mode-locked lasers and integrated nonlinear waveguides for the realization of integrated frequency combs.

Monolithic integration of four widely tunable extended cavity lasers suitable for gas detection is presented. Each laser features a precise, grid-less tuning mechanism with a low-linewidth, single-mode output over a wide wavelength range of 74nm.

For the first time we demonstrate an anti-colliding mode-locked laser implemented on a III-V-on-silicon platform. In passive mode-locked operation a 1.7kHz 3dB linewidth of the fundamental RF tone at 4.83GHz is obtained.

A review is given of a number of lasers in a form of photonic integrated circuits realized on InP substrate using a generic integration approach. The potential of these photonic circuits lies in their compactness, low power consumption, and significant reduction of fabrication cost by realization in generic foundry runs. Generic integration platforms offer the possibility of realizing functionally advanced photonic circuits using combinations of just a few standardized and parameterized building blocks. This vibrant field opens new doors to innovative product development for SMEs as well as curiosity-driven research.

A tunable laser for single line gas spectroscopy is realized as a monolithic photonic integrated circuit in an InP based generic foundry platform. The laser operates at wavelengths around 2.0 μm and has a tuning range of 22 nm.

In this paper we present our recent progress on 2.5 GHz mode-locked, quantum well lasers operating at 1550 nm. Two such lasers are monolithically integrated on an InP substrate. Stable passive and hybrid mode-locking of both lasers operating at the same time with a small repetition rate difference is demonstrated.

A tunable laser operating from 2015 – 2040 nm realized as a monolithic InP photonic integrated circuit is presented. The laser uses an intracavity tuning mechanism based on parallel asymmetric Mach-Zehnder interferometers with electro-refractive modulators. The device is intended for a single line gas spectroscopy and was designed and fabricated using a generic integration technology platform.

A compact and fabrication-tolerant integrated remotely tunable optical delay line is proposed for millimeter-wave beam steering and is fabricated in an InP generic foundry. The proposed delay line is based on a spectrally cyclic-arrayed waveguide grating feedback loop. Its major features include the tolerant architecture with reduced chip size, and bi-directional operation with simplified remote tuning. Moreover, its cyclic feature guarantees further cascaded operations either for 2D radio beam steering or for high-resolution delay generation. The experimental results show less than 6.5-dB insertion loss of the integrated delay line. Five different delays from 0 to 71.6 ps are generated with less than 0.67-ps delay errors.

A mode-locked extended cavity quantum well ring laser at 1.58 μm with a repetition rate of 2.5 GHz in the form of a photonic integrated circuit is presented. The device is realized using InP-based active-passive integration technology. The 33 mm long cavity contains gain, saturable absorption, and passive waveguide sections as well as phase shifter sections to enable fine tuning of the spectral position of the lasing modes. Passive and hybrid mode-locked operation, along with the wavelength tuning of the laser modes, are experimentally demonstrated. In the passive mode-locking regime, a beat signal at the fundamental round trip frequency with a 3 dB bandwidth of 6.1 kHz is produced on a fast photo diode.