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This paper presents a novel approach for removing out-of-plane deformation in metal interconnects by adding a fractional structure to the original meander shape and using the optimised fabrication stack. In thermoformed electronics in cases where copper is used as the conductor, the twisting of meander-shaped structures caused by excessive mechanical stress can cause a non-uniform surface, delamination of the metal interconnect from the substrate, and in some cases, a short circuit to the adjacent tracks. Typically, stretchable electronics designers use various shapes and widths of the copper interconnect to tackle this issue. Using conventional meander shapes such as horseshoes and U shapes is not universally practical, especially when stretching is higher than 30 percent leading to significant out-of-plane deformation. Limiting this out-of-plane deformation by reducing the track width is not always applicable, as a minimum width is needed from a technology and conductivity perspective. The presented approach is inspired by computational and experimental studies of multiple meander shapes and fabrication methods. A geometry-based and fabrication-based approach is presented, which can reduce the mechanical stress of almost all possible meander shapes by increasing the meander’s path length to accommodate the metal track’s produced torque during stretching. An analytical approach is provided for calculating the optimal meander parameters, and the optimal fabrication stack is achieved based on simulation results. Experiments and finite-element modeling for an industrial case study show the improvement in the stress distribution and reduction of out-of-plane.

Electrowetting on dielectric (EWOD) is a promising technology for the construction of lab-on-chip devices which allows to perform on chip manipulation of pL-uL droplets with the use of applied electric fields. EWOD chips actuated with low voltages are preferred for the use with living cells, however, the microfabrication of those remains a challenge. Here, we propose the addition of a high quality 13 nm thick nanofilm of aluminum (III) oxide (II) to enhance the range of operational voltages of four EWOD dielectric stacks. Our ultimate goal is the development of a transparent microchip for a dynamic in vitro cell culture.

Osteoporosis and associated fractures are a major burden for individuals and society. Risk prediction is therefore highly warranted, as no simple, precise or sensitive tools for identification of individuals at risk of osteoporosis are currently available, mainly due to the multifactorial causes of osteoporosis including clinical, lifestyle and genetic factors. Early stage and easily accessible identification of high-risk individuals who might best benefit from prophylaxis should therefore include various technologies such as molecular medicine, nanobiotechnology, microfluidics, and biochemistry. The PoCOsteo project, funded by the European Commission in the framework of H2020-NMBP-X-KET-2017 (Grant Agreement number 767325), integrates proteomics and genomics technology into the development of a functional point of care (PoC) microfluidic device for osteoporosis risk detection. This device is aimed to be used by physicians to improve the prediction of potential fractures and to provide timely personalized care for affected individuals. In addition, monitoring of the treatment processes via this in-office test should provide results in real-time during consultation, thus reducing the low-compliance-rate, commonly reported in osteoporotic patients more efficiently and at lower costs. The design of this PoC tool will limit the amount of both expensive reagents and complex procedures and blood volume needed for the tests and should therefore be suitable also in countries with lack of reimbursement and lower medical care standards. The overall objective of the currently proposed PoCOsteo project therefore is the development, clinical validation and preparation for commercialization of a PoC tool for bone disease (i.e. osteoporosis) prevention, detection and treatment with academic/research partners from 5 countries (Gent University, University Rovira I Virgili, Fraunhofer IMM, Tehran University of Medical Sciences and Medical University of Graz) and 3 SME's (Labman, MicroLIQUID and Fundico) with a detailed project plan.