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The utilization of biodegradable magnesium (Mg) alloys in the fabrication of temporary non-vascular stents is an innovative trend in biomedical engineering. However, the heterogeneous degradation profiles of these biomaterials, together with potential bacterial colonization that could precipitate infectious or stenotic complications, are critical obstacles precluding their widespread clinical application. In pursuit of overcoming these limitations, this study applies the principles of biomimicry, particularly the hydrophobic and anti-fouling characteristics of lotus leaves, to pioneer the creation of nanocomposite coatings. These coatings integrate poly-trimethylene carbonate (PTMC) with covalent organic frameworks (COFs), to modify the stent's surface property. The strategic design of the coating's topography, porosity, and self-polishing capabilities collectively aims to decelerate degradation processes and minimize biological adhesion. The protective qualities of the coatings were substantiated through rigorous testing in both in vitro dynamic bile tests and in vivo New Zealand rabbit choledochal models. Empirical findings from these trials confirmed that the implementation of COF-based nanocomposite coatings robustly fortifies Mg implantations, conferring heightened resistance to both biocorrosion and biofouling as well as improved biocompatibility within bodily environments. The outcomes of this research elucidate a comprehensive framework for the multifaceted strategies against stent corrosion and fouling, thereby charting a visionary pathway toward the systematic conception of a new class of reliable COF-derived surface modifications poised to amplify the efficacy of Mg-based stents. Biodegradable magnesium (Mg) alloys are widely utilized in temporary stents, though their rapid degradation and susceptibility to bacterial infection pose significant challenges. Our research has developed a nanocomposite coating inspired by the lotus, integrating poly-trimethylene carbonate with covalent organic frameworks (COF). The coating achieved self-polishing property and optimal surface energy on the Mg substrate, which decelerates stent degradation and reduces biofilm formation. Comprehensive evaluations utilizing dynamic bile simulations and implantation in New Zealand rabbit choledochal models reveal that the coating improves the durability and longevity of the stent. The implications of these findings suggest the potential COF-based Mg alloy stent surface treatments and a leap forward in advancing stent performance and endurance in clinical applications. [Display omitted] [ABSTRACT FROM AUTHOR]

• This article compared the clinicopathological differences between the cystic duct carcinoma and type I/II perihilar cholangiocarcinoma. • This article compared the efficacy of routine imaging examinations to distinguish between the cystic duct carcinoma and type I/II perihilar cholangiocarcinoma. • This article suggested NLR and GS as new indicators for the differential diagnosis of the cystic duct carcinoma and type I/II perihilar cholangiocarcinoma. [ABSTRACT FROM AUTHOR]

Digital light processing 3D printing can be applied to fabricate complex silicon nitride (Si 3 N 4) components. However, because of the surface hydroxyl groups and large refractive index, it is still a foremost challenge to realize a stable photosensitive Si 3 N 4 slurry with combined benefits of low viscosity and large curing depth. In this study, we propose a new formulation strategy to prepare Si 3 N 4 slurry. Starting from the optimization of monomer ratio, we have systematically optimized powder particle size, dispersant and photoinitiator on the rheological properties and curing properties of Si 3 N 4 slurry. Specifically, we have fabricated a stable photosensitive Si 3 N 4 slurry (48 vol%) with a viscosity of 2.09 Pa s (30 s−1), a critical curing energy of 126.09 mJ/cm2 and a maximum curing depth of 80 µm. Finally, based on this optimized slurry, we have successfully obtained complex Si 3 N 4 green body with no defect, which demonstrates great potential to fabricate arbitrary complex ceramic components for various applications. [ABSTRACT FROM AUTHOR]

For new-generation miniaturized and high-frequency electronics, it is of vital importance to develop advanced electronic packaging materials, which combine high electromagnetic interference (EMI) shielding effectiveness (SE) and efficient thermal management capabilities, including heat absorption, thermal conductivity (TC) and heat dissipation. However, high EMI SE and efficient thermal management usually cannot complement each other for the same packaging material, because EMI shielding devices convert electromagnetic radiation directly into heat consumption, leading to consequent severe challenge to dispose heat dissipation. Herein, we have newly developed a high-performance phase change composites, in which MXene is confined in shape-stabilized phase change material (PCM) for simultaneous achievement of high EMI SE and efficient thermal management. Regarding high EMI, MXene can effectively shield electromagnetic radiation by converting the radiation into heat consumption. As for thermal management, PCM enables efficient heat absorption via the phase change process, and MXene enhances the thermal conductivity (TC) of MXene/PCM composite to facilitate heat dissipation. As a result, our developed MXene/PCM composite can achieve a high EMI SE of 64.7 dB in X-band, with an improved TC of 0.74 W/m·K. Furthermore, the interlayer capillary effect of MXene inhibits the leakage of liquid PCM during the solid-liquid phase transition, which can maintain the PCM shape stability. Our newly-designed shape-stabilized MXene/PCM composites with high EMI SE and large TC shed new light on designing EMI shielding materials with prolonged exposure to electromagnetic radiation, which can be envisioned to exhibit vast implications for advanced new-generation miniaturized and high-frequency electronics. [Display omitted] [ABSTRACT FROM AUTHOR]

Nano-SiO 2 porous thermal insulating material (TIM) has drawn tremendous research interests due to its advantages of low density, high porosity and low thermal conductivity. However, its long-term stability in humid environment can be severely deteriorated by the high hydrophilicity resulting from tetrahedral coordination of oxygen and capillary effect of porous structure. It is still a great challenge to cost-effectively fabricate bulk TIM with superior hydrophobicity and consequent remarkable self-cleaning capability. Herein, via an oil-in-water microemulsion treatment, we have proposed a new strategy to construct 3D superior hydrophobic nano-SiO 2 porous TIM. The polymethylhydrosiloxane-modified TIM exhibits a large water contact angle of 166°, and corresponding excellent self-cleaning characteristic while maintaining low thermal conductivity of 0.031 W/m·K. Moreover, our high hydrophobicity of TIM exhibits excellent durability under high temperature up to 400 °C, high humidity of 100%, and chemical erosions. Detailed knowledge of the physical chemistry basis of the superior hydrophobic nano-SiO 2 porous TIM can provide great opportunity to fabricate advanced self-cleaning and heat insulating devices especially targeted for harsh environments. [ABSTRACT FROM AUTHOR]

The high integration density of microelectronic devices leads to local heat accumulation, and effective heat dissipation and signal transmission of packaging materials have become the primary issues to be solved. However, existing polymer materials have difficulty meeting the requirements due to their unsatisfactory thermal conductivity and thermal expansion properties. In this work, we proposed the use of digital light processing (DLP) printing technology to construct a triply periodic minimum surface (TPMS) skeleton, and a continuous and efficient heat conduction path was successfully constructed in epoxy resin by impregnating h-BN on the skeleton surface. When the loading of h-BN was 20 vol%, the thermal conductivity of the TPMS(SiO 2)@BN/EP(BN) composites was 1.86 W/(m·K), which was 786 % higher than that of pure epoxy resin. In addition, the thermal expansion coefficient of the composites decreased by more than 70 %. At the test frequencies of 3∼10 MHz, the composites showed stable dielectric properties, and the dielectric constant was always maintained in a low range, between 3.85 and 4.15. This work has realized the transformation of the method for constructing a heat conduction path from disordered to ordered and from random to repeatable. This provides a new strategy for the selection of microelectronic packaging materials. [ABSTRACT FROM AUTHOR]