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Inspired by the double-helix structure of biological DNA, low-volume fraction and high-strength Al 2 O 3 twisted honeycomb structures with characteristics similar to those of helical structures in the z -axis were prepared by digital light processing 3D printing technology. As the twist angle increased, the compressive strength of the fabricated Al 2 O 3 structure decreased, and the deformation mechanism of the Al 2 O 3 structures gradually changed from stretching-dominated to bending-dominated, which can be predicted by the Gibson–Ashby model. The relationship between the effective elastic modulus and the volume fraction that can be modified by varying the wall thickness was described by the Pabst–Gregorova exponential relationship. The compressive strength of the Al 2 O 3 structure with a twist angle of 0° can reach 62.4 MPa at a volume fraction of 13.3%, providing guidance to optimize lightweight structures of ceramics. [ABSTRACT FROM AUTHOR]

Digital light processing 3D printing can be applied to fabricate complex silicon nitride (Si 3 N 4) components. However, because of the surface hydroxyl groups and large refractive index, it is still a foremost challenge to realize a stable photosensitive Si 3 N 4 slurry with combined benefits of low viscosity and large curing depth. In this study, we propose a new formulation strategy to prepare Si 3 N 4 slurry. Starting from the optimization of monomer ratio, we have systematically optimized powder particle size, dispersant and photoinitiator on the rheological properties and curing properties of Si 3 N 4 slurry. Specifically, we have fabricated a stable photosensitive Si 3 N 4 slurry (48 vol%) with a viscosity of 2.09 Pa s (30 s−1), a critical curing energy of 126.09 mJ/cm2 and a maximum curing depth of 80 µm. Finally, based on this optimized slurry, we have successfully obtained complex Si 3 N 4 green body with no defect, which demonstrates great potential to fabricate arbitrary complex ceramic components for various applications. [ABSTRACT FROM AUTHOR]

Nano-SiO 2 porous thermal insulating material (TIM) has drawn tremendous research interests due to its advantages of low density, high porosity and low thermal conductivity. However, its long-term stability in humid environment can be severely deteriorated by the high hydrophilicity resulting from tetrahedral coordination of oxygen and capillary effect of porous structure. It is still a great challenge to cost-effectively fabricate bulk TIM with superior hydrophobicity and consequent remarkable self-cleaning capability. Herein, via an oil-in-water microemulsion treatment, we have proposed a new strategy to construct 3D superior hydrophobic nano-SiO 2 porous TIM. The polymethylhydrosiloxane-modified TIM exhibits a large water contact angle of 166°, and corresponding excellent self-cleaning characteristic while maintaining low thermal conductivity of 0.031 W/m·K. Moreover, our high hydrophobicity of TIM exhibits excellent durability under high temperature up to 400 °C, high humidity of 100%, and chemical erosions. Detailed knowledge of the physical chemistry basis of the superior hydrophobic nano-SiO 2 porous TIM can provide great opportunity to fabricate advanced self-cleaning and heat insulating devices especially targeted for harsh environments. [ABSTRACT FROM AUTHOR]

Regarding advanced 5G mobile communication, microwave dielectric ceramics are considered as the most potential materials to develop new-generation base station resonators. Herein, ZnNb 2 O 6 ceramics with ε r of approximately 24 have been prepared using the solid-state reaction method, with tailored extra ZnO of x mol% (x = 1, 2 and 3). We have for the first time applied the P-V-L chemical bond theory to investigate ZnNb 2 O 6 ceramics with ZnO doping, by exploring the relationship of dielectric properties and chemical bond characteristics. Particularly, the Raman spectra demonstrates that the full width at half maximum of υ 1 (A g) vibration mode can exhibit significant correlation with the quality factor (Q × f). To further support the experimental study, we have also conducted the first-principle calculation of electron density difference via CASTEP package, which further confirms the change of temperature coefficient of resonance frequency (τ f). Our newly designed ZnNb 2 O 6 ceramics doped with 1 mol% ZnO exhibit excellent dielectric properties, i.e., ε r = 23.74, Q × f = 102,824 GHz and τ f = −55.38 ppm/°C, which demonstrates great potential to construct miniaturized 5G base station with advanced ceramic dielectrics. [ABSTRACT FROM AUTHOR]

Herein, a bio-based plasticizer ketalized tung oil butyl levulinate (KTBL) was developed using methyl eleostearate, a derivative of tung oil, and butyl levulinate. KTBL can be used as an auxiliary plasticizer to partially replace traditional plasticizer. The plasticizer has a ketone structure, an ester base, and a long linear chain. It was mixed with dioctyl phthalate (DOP), and the effect of the plasticizer KTBL as an auxiliary plasticizer on the plasticization of poly(vinyl chloride) (PVC) was studied. Their compatibility and plasticizing effect were evaluated using dynamic–mechanical thermal analysis (DMA), mechanical property analysis, and thermogravimetric analysis (TGA). The results demonstrate that when the KTBL to DOP ratio is 1:1, the blended sample with KTBL exhibits superior mechanical performance compared to pure DOP, resulting in an increased elongation at break from 377.47% to 410.92%. Moreover, with the increase in KTBL content, the durability is also significantly improved. These findings suggest that KTBL can serve as an effective auxiliary plasticizer for PVC, thereby reducing the reliance on DOP. [ABSTRACT FROM AUTHOR]

For new-generation miniaturized and high-frequency electronics, it is of vital importance to develop advanced electronic packaging materials, which combine high electromagnetic interference (EMI) shielding effectiveness (SE) and efficient thermal management capabilities, including heat absorption, thermal conductivity (TC) and heat dissipation. However, high EMI SE and efficient thermal management usually cannot complement each other for the same packaging material, because EMI shielding devices convert electromagnetic radiation directly into heat consumption, leading to consequent severe challenge to dispose heat dissipation. Herein, we have newly developed a high-performance phase change composites, in which MXene is confined in shape-stabilized phase change material (PCM) for simultaneous achievement of high EMI SE and efficient thermal management. Regarding high EMI, MXene can effectively shield electromagnetic radiation by converting the radiation into heat consumption. As for thermal management, PCM enables efficient heat absorption via the phase change process, and MXene enhances the thermal conductivity (TC) of MXene/PCM composite to facilitate heat dissipation. As a result, our developed MXene/PCM composite can achieve a high EMI SE of 64.7 dB in X-band, with an improved TC of 0.74 W/m·K. Furthermore, the interlayer capillary effect of MXene inhibits the leakage of liquid PCM during the solid-liquid phase transition, which can maintain the PCM shape stability. Our newly-designed shape-stabilized MXene/PCM composites with high EMI SE and large TC shed new light on designing EMI shielding materials with prolonged exposure to electromagnetic radiation, which can be envisioned to exhibit vast implications for advanced new-generation miniaturized and high-frequency electronics. [Display omitted] [ABSTRACT FROM AUTHOR]

The strong covalent bonding of SiC makes it difficult to be fully sintered using conventional sintering techniques. Therefore, electrical current-assisted sintering techniques such as spark plasma sintering are needed to sinter SiC. The finite numerical simulations have been generally used to predict and guide sintering processes of ceramics (i.e.TiC,AlO 3). In this work, the numerical simulations of the temperature distribution, electrical field and thermal field on the porous SiC cylindrical samples by Comsol were investigated in details. The influence of porosity on the temperature distribution and electrical field distribution of the SiC samples were analyzed. Both the maximum current density (1.19 × 107A/m2) and the maximum temperature (2030 °C) of the SPS device occurred at the punch/spacer interface. The temperature values at the centre of the samples were proportional to the porosity, and the temperatures at the center of the samples increased from ∼1960 °C to ∼2010 °C at t = 2000s, with the porosity increasing from 1% to 60%. The uniformity of the temperature distribution deteriorated as the porosity increases, and the temperature gradients between the center and edge of the samples with the porosity of 1% and 60%, were ∼80 °C and ∼130 °C at t = 2000s, respectively. [ABSTRACT FROM AUTHOR]

BaO-Sm 2 O 3 –5TiO 2 (BST) added by Al 2 O 3 was prepared by solid-state reaction method. The main phase is Ba 3.99 Sm 9.34 Ti 18 O 54 of orthorhombic tungsten bronze structure, and the secondary phase is Ba 1.18 Al 1.90 Ti 6.09 O 16 of tetragonal structure, which has two types of grains: one is grey and cubic, and the other is white and quasi-rectangular. Microstructure was characterized by XRD, SEM, and Raman spectra. Micromechanical properties of different phases were assessed by nanoindentation and micro-scratch tests with Berkovich indenter. Volume fractions of different phases obtained by statistical analysis of grid indentation are in good agreement with those obtained by XRD analysis. Vickers hardness method is more appropriate for the determination of the fracture toughness of dielectric ceramics. BST ceramic without addition of Al 2 O 3 has better mechanical properties than BST-A with addition of Al 2 O 3 , indicating that addition of Al 2 O 3 impairs the micromechanical properties of dielectric ceramics. [ABSTRACT FROM AUTHOR]

Bio-based vitrimers present a promising solution to the issues associated with non-renewable and non-recyclable attributes of traditional thermosetting resins, showcasing extensive potential for diverse applications. However, their broader adoption has been hindered by the requirement for catalyst inclusion during the synthesis process. In this study, a cardanol-based curing agent with poly-hydroxy and tertiary amine structures was prepared by a clean synthetic method under the theory of click chemistry. The reaction of a cardanol-based curing agent with diglycidyl ether of bisphenol A formed catalyst-free, self-healing, and recyclable bio-based vitrimers. The poly-hydroxy and tertiary amine structures in the vitrimers promoted the curing of epoxy-carboxylic acid in the cross-linked network and served as internal catalysts of dynamic transesterification. In the absence of catalysts, the vitrimers network can achieve topological network rearrangement through dynamic transesterification, exhibiting excellent reprocessing performance. Moreover, the vitrimers exhibited faster stress relaxation (1500 s at 180 °C), lower activation energy (92.29 kJ·mol−1) and the tensile strength of the recycled material reached almost 100% of the original sample. This work offers a new method for preparing cardanol-based epoxy vitrimers that be used to make coatings, hydrogels, biomaterials, adhesives, and commodity plastics in the future. [ABSTRACT FROM AUTHOR]

The high integration density of microelectronic devices leads to local heat accumulation, and effective heat dissipation and signal transmission of packaging materials have become the primary issues to be solved. However, existing polymer materials have difficulty meeting the requirements due to their unsatisfactory thermal conductivity and thermal expansion properties. In this work, we proposed the use of digital light processing (DLP) printing technology to construct a triply periodic minimum surface (TPMS) skeleton, and a continuous and efficient heat conduction path was successfully constructed in epoxy resin by impregnating h-BN on the skeleton surface. When the loading of h-BN was 20 vol%, the thermal conductivity of the TPMS(SiO 2)@BN/EP(BN) composites was 1.86 W/(m·K), which was 786 % higher than that of pure epoxy resin. In addition, the thermal expansion coefficient of the composites decreased by more than 70 %. At the test frequencies of 3∼10 MHz, the composites showed stable dielectric properties, and the dielectric constant was always maintained in a low range, between 3.85 and 4.15. This work has realized the transformation of the method for constructing a heat conduction path from disordered to ordered and from random to repeatable. This provides a new strategy for the selection of microelectronic packaging materials. [ABSTRACT FROM AUTHOR]

Recently, there has been strong interest in inorganic solid-state electrolytes for all-solid-state batteries, among which the garnet electrolyte LLZO has attracted much attention due to its excellent properties, such as high ionic conductivity and broad electrochemical stability. The aim of our study was to improve the performance of Ta-doped LLZO (LLZTO) by co-doping Ga and Y at the Li and La sites using conventional solid-phase synthesis methods. We thoroughly investigated how Ga and Y affect the microstructure and electrochemical properties of LLZTO. The results show that the relative density of Ga- and Y-doped LLZTO increases significantly up to 94% under the same sintering conditions. This doping resulted in a significant increase in ionic conductivity from 2.0 × 10−4 S·cm−1 to 1.05 × 10−3 S·cm−1 and a decrease in electronic conductivity from 2.16 × 10−7 S·cm−1 to 9.18 × 10−8 S·cm−1. Subsequently, the symmetric cells were assembled and tested, and it was found that the interfaces of the doped solid-state electrolytes were much more stable and that the cycling time was longer. Thus, our study successfully coordinated the co-doping of Ga, Y, and Ta, providing valuable insights for the subsequent production of LLZO materials with higher densities and better performance. This study is a promising step toward the realization of safer all-solid-state batteries with higher energy densities. • Innovative further doping of two elements on top of LLZTO solid electrolyte, harmonizing the doping of three elements. • An order of magnitude increases in ionic conductivity of LLZTO solid state electrolytes after doping. • The doped LLZTO solid state electrolyte has better suitability with lithium metal anode. [ABSTRACT FROM AUTHOR]

Different microstructures were obtained under various thermal conditions by adjusting the heat treatment parameters of the Cr-Co-Ni-Mo series of ultra-high strength stainless steel. The effect of organizational evolution on the stress corrosion cracking (SCC) of the Cr-Co-Ni-Mo series of ultra-high strength stainless steel was investigated using potentiodynamic polarization curves, electrochemical impedance spectroscopy (EIS), transmission electron microscopy (TEM), scanning electron microscopy (SEM) and other test methods in combination with slow strain rate tensile tests (SSRTs). The results show that the Mo- and Cr-rich clusters and precipitation of the Laves phase reduce the corrosion resistance, while increasing the austenite content can improve the corrosion resistance. The Cr-Co-Ni-Mo series of ultra-high strength stainless steel has a high SCC resistance after quenching at 1080 °C and undergoing deep cooling (DC) treatment at −73 °C. With increasing holding time, the strength of the underaged and peak-aged specimens increases, but the passivation and SCC resistance decreases. At the overaged temperature, the specimen has good SCC resistance after a short holding time, which is attributed to its higher austenite content and lower dislocation density. As a stable hydrogen trap in steel, austenite effectively improves the SCC resistance of steel. However, under the coupled action of hydrogen and stress, martensitic transformation occurs due to the decrease in the lamination energy of austenite, and the weak martensitic interface becomes the preferred location for crack initiation and propagation. [ABSTRACT FROM AUTHOR]

A multicolour LED is a miniaturized, long-lasting, and easy-to-achieve colour adjustable emission light source. It is widely used in outdoor displays and room lighting fields. However, the increase in the cost and the decrease in luminous efficiency when adjusting lighting colours have constrained the development of multicolour LEDs. In this study, we initially designed a phosphor conversion pixel array through optical simulation and then prepared the phosphor conversion pixel arrays with different layouts using a semi-cured template method. Finally, we packaged the phosphor conversion pixel array with the blue LED array as a remote phosphor LED. The measurement of the luminous performance indicated that the colour gamut of multicolour LEDs was included in the simulated colour gamut, and the colour of the light was consistent with the design guidelines. Notably, the multicolour LED emission efficiency packaged with a phosphor conversion pixel array could reach 125 lm/W, and the hexagonal phosphor conversion pixel array had better emission performance than the square phosphor conversion pixel array. • Based on the Monte Carlo principle, multicolour LEDs composed of array phosphor-converted film and blue-LED chip are designed. • Phosphor-converted pixel arrays are prepared by semi-cured template method with high moulding quality. • By comparing the experimental and simulation results, colour-tuneable characteristics of the multicolour LEDs is verified. • The luminous efficiency of multicolour LEDs reach up to 125.0 lm/W and changing pixel can reduce the secondary reabsorption of fluorescence. [ABSTRACT FROM AUTHOR]

• Polymer-matrix composites. • 3-Dimensional reinforcement. • Thermal properties. • Syntactic foams. • Hollow glass microspheres. Electronic packaging materials with low dielectric constant (D k) and high thermal conductivity (TC) are of vital importance in mitigating signal delay and enhancing heat dissipation efficiency in modern electronics. However, low D k and high TC are difficult to complement each other, because high TC filler usually possesses a high D k. Herein, we have newly designed a composite material simultaneously with low D k and high TC through hollow glass microspheres (HGMs), boron nitride particles, epoxy resin and reticulated porous ceramic (RPC). The composite material prepared by sintering HGMs and RPC is more effective in improving TC while keeping low D k. Specifically, the D k of the newly designed composite is lower than 3.0 with a large TC of 0.96 W/m·K. This new epoxy-matrix composite with both low D k and high TC can shed new light on designing electronic packaging materials for advanced miniaturized electronics. [ABSTRACT FROM AUTHOR]

YAG:Ce3+ yellow phosphor are particularly used luminescent materials to produce white light in phosphor-converted white LED (pc-WLED). Surface coating of YAG phosphor is the main concern for desired optical performance of the phosphors. Many scholars conducted various experimental analysis on the surface coating of phosphors to improve yellow emission, but the theoretical explanation by which phosphor coating could help improving light efficiency has not yet been studied. In this paper, based on Mie theory, the optical constants such as scattering coefficient, absorption coefficient and asymmetry parameter of YAG:Ce3+ phosphor and YAG@SiO 2 (YAG:Ce3+ phosphor surface coated with nano-SiO 2 layer) were calculated. An optical configuration of chip scale packages (CSP) WLED was constructed by coupling YAG:Ce3+ or YAG@SiO 2 phosphors with a LED laser. Based on the optical parameters calculated by Mie theory, the luminescent properties of YAG:Ce3+ and YAG@SiO 2 WLED were simulated by Monte Carlo method. The results showed that a thin SiO 2 coating layer on YAG phosphor result in an overall increase in luminous performances compared with original YAG WLED. The absorption coefficient of phosphor is the main concern affecting the light emission in WLED. Due to the fact that YAG@SiO 2 possess higher 460 nm absorption coefficient (460 μ a b s) , it could absorb more blue light than YAG, thereby it has a 1.2% higher conversion efficiency than YAG, finally the enhanced luminous efficiency of YAG@SiO 2 WLED is obtained. The results obtained in this work provides a potential method in future WLED packaging designing. • We improve the overall light extraction efficiency from the perspective of adjusting the structure of a single phosphor particle. • The optical constants of YAG phosphor and YAG@SiO 2 (YAG surface coated with nano-SiO 2 layer) were calculated based on Mie theory. • The luminescence performances of YAG and YAG@SiO 2 CSP WLED were simulated, the results showed that the absorption coefficient of phosphor is the main concern affecting the light emission in WLED. [ABSTRACT FROM AUTHOR]

• MXene/AgNWs aerogels with interpenetrating double-network structure were fabricated. • The porous structure contributes to higher attenuation of electromagnetic waves. • 3D network provides channel for electron and phonon transmission in epoxy composites. • The composites possess remarkable EMI SE and thermal conductivity. The novel multifunctional materials with anti-electromagnetic interference (EMI) and effective thermal management are ideal for modern electronic industry. Generally, the EMI shielding effectiveness (SE) and thermal conductivity (TC) of materials can be effectively enhanced by compounding with high electrically and thermally conductive fillers. However, it seems that the high-performance cannot be compensated without sacrificing the high fillers loading. Herein, from one-dimensional silver nanowires (AgNWs) and two-dimensional MXene, three-dimensional MXene/AgNWs aerogels were designed as electric and heat transferring skeletons for epoxy nanocomposites by directional-freezing and freeze-drying methods. The resultant MXene/AgNWs/Epoxy nanocomposites with a low MXene/AgNWs content of 8.2 wt% combine a high electrical conductivity of 1532 S/m, and an exceptional EMI SE value of 94.1 dB with 3 mm thickness at the X-band frequency, as well as an improved TC of 2.34 W/m·K. The fabricated MXene/AgNWs/Epoxy nanocomposites possess excellent comprehensive properties enable valuable applications in electronic devices for EMI shielding and thermal management. [ABSTRACT FROM AUTHOR]