127 results on '"Jalar, Azman"'
Search Results
2. Undissolved gold in fine-pitch BGA solder joint under thermal cycling test
3. Gallium Oxide UV Sensing in Contemporary Applications
4. Moisture Content and Early Corrosion Detection of Cu Wire Bonding in a Semiconductor Package
5. Titanium dioxide ion-sensitive extended gate field effect transistor (ISEGFET): selective detection of potassium ions in artificial blood serum
6. Superluminal Geometrodynamics of Braneworld Hyperdrive via Brane-Bulk Interaction
7. Thermal Management on the Solder Joints of Adjacent Ball Grid Array (BGA) Rework Components Using Laser Soldering
8. Effect of Thermomechanical Treatment on Microstructural and Localized Micromechanical Properties of Sn–0.7Cu Solder Alloy
9. Unleashing the potential of gallium oxide: A paradigm shift in optoelectronic applications for image sensing and neuromorphic computing applications
10. Micromechanical response of SAC305 solder alloy under gamma radiation via nanoindentation approach
11. Dynamic precipitation and dynamic recrystallization behaviors of Mg-Gd-Nd-Zr magnesium alloy during thermal compression deformation
12. Early Corrosion Detection of Cu-Ag Wedge bonding in Semiconductor Package
13. Effect of Nd on microstructure and mechanical properties of Mg-7Gd-0.5Zr alloy
14. Effect of alloy particle size and stencil aperture shape on solder printing quality
15. Micromechanical and microstructure evolution of leaded (SnPb) and lead-free (SAC305 and SnCu) mixed solder joints during isothermal aging
16. EDS analysis on effect of low dosage gamma radiation and micromechanical properties of SnAg3Cu0.5 solder
17. Magnesium-doped ZnO nanorod electrolyte–insulator–semiconductor (EIS) sensor for detecting calcium ions
18. Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint
19. Effect of ultrasonic bonding and lamination on electrical performance of copper indium gallium (de)Selenide CIGS thin film photovoltaic solar panel.
20. Bondability of ultrasonic Aluminum bonds on the molybdenum (de)selenide and molybdenum of back contact layer of copper indium gallium (de)selenide CIGS thin film photovoltaic solar panel
21. Linear growth behaviour of intermetallic compound layer in electronic interconnections
22. Study on Rare Earth Modified Co Based Composite Powder and its Effects on the Microstructure and Properties of Cemented Carbide
23. Effect of Deformation Temperature on the Dynamic Recrystallization Mechanism and Dynamic Precipitation Behavior of Mg-Gd-Nd-Zr Alloy
24. Laser Rework Process for Efficient Lead-Free Solder Joints Ball Grid Array (BGA) Component Rework
25. Superluminal geometrodynamics of braneworld hyperdrive via brane–bulk interaction.
26. Effect of Sn Plating Thickness on Wettability, Solderability, and Electrical Connections of Electronic Lead Connectors for Surface Mount Technology Applications
27. Effect of Ultrasonic Process Parameter on Resistance and Plastic Deformation of the Aluminum Ribbon Bond on Molybdenum Layer
28. Real-time viral detection through electrolyte-gated field effect transistors: possibility of rapid COVID-19 detection.
29. Effect of PVD-coated wall aperture roughness on the life span of fine-pitch stencil printing.
30. Measurement of Aluminium Remnant Thickness on Copper Wire Bonding using 3D Laser Scanning Microscope
31. Ultrasonic Al Bond on Mo Back-Contact Layer of CIGS Solar Panel Characterization Using Infinite Focus Microscope (IFM) and Micro-Ohmmeter
32. Real-time viral detection through electrolyte-gated field effect transistors: possibility of rapid COVID-19 detection
33. Dynamic Precipitation and Dynamic Recrystallization Behaviors of Mg-Gd-Nd-Zr Magnesium Alloy During Thermal Compression Deformation
34. Review on Corrosion in Electronic Packaging Trends of Collaborative between Academia–Industry
35. Temperature Cycling Test on Ultrasonic Aluminum Bonds and Conductive Adhesive of Copper Indium Gallium (di)Selenide (CIGS) Thin-Film Photovoltaic Solar Panel
36. INFLUENCE OF THERMOMECHANICAL PROCESSING ON MICROMECHANICAL PROPERTIES OF SN-0.7CU SOLDER ALLOY VIA NANOINDENTATION APPROACH
37. EVOLUTION OF DISCRETE SEMICONDUCTOR COPPER WEDGE BOND IN BIASED TEMPERATURE HUMIDITY CHAMBER
38. Voltage Bias Enhancement for Leakage Test on Discrete Products to Detect Low Contact
39. Intermetallic Compound Thickness of Ball Grid Array Solder Joints Under Thermal Cycling Test Using ANOVA
40. Effects of Underfill Materials on Behavior of Intermetallic Compound Thickness of Ball Grid Array Solder Joints Using ANOVA
41. Cardinal and Ordinal Directions Approach in Investigating Arrayed Solder Joints Crack Propagation of Ball Grid Array Semiconductor Packages
42. TEMPERATURE-INDUCED THICKNESS REDUCTION OF MICROMECHANICAL PROPERTIES OF Sn-0.7Cu SOLDER ALLOY
43. Magnesium-Doped ZnO Nanorod Electrolyte–Insulator–Semiconductor (EIS) Sensor for Detecting Organic Solvents
44. Micromechanical response of SAC305 solder alloy under gamma radiation via nanoindentation approach
45. Effect of heat shield locations on rework- induced thermal management in ball grid array solder joint
46. Sulfur Ingression on Encapsulated Leadframe of Discrete Semiconductor Package
47. Effect of 60% thickness reduction of Sn-Cu solder alloy on localized micromechanical properties via nanoindentation approach
48. Effect of Nd on Microstructure and Mechanical Properties of Mg-7gd-0.5zr Alloy
49. Kesan Rawatan Termomekanik dengan Mampatan Tunggal terhadap Mikrostruktur dan Sifat Mikromekanik Aloi Pateri Sn-0.7Cu
50. EDS analysis on effect of low dosage gamma radiation and micromechanical properties of SnAg3Cu0.5 solder.
Catalog
Books, media, physical & digital resources
Discovery Service for Jio Institute Digital Library
For full access to our library's resources, please sign in.