19 results on '"Su, Yen-Fu"'
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2. Research on efficiency droop mechanism and improvement in AlGaInP Ultra-High-Brightness LEDs using the transient measurement method
3. Investigation of interconnect design on interfacial cracking energy of Al/TiN barriers under a flexural load
4. Determination of Initial Crack Strength of Silicon Die Using Acoustic Emission Technique
5. Analysis of LED wire bonding process using arbitrary Lagrangian-Eulerian and equilibrium mesh smoothing algorithm
6. Determination of the junction temperature of Gallium Nitride (GaN)-based high power LED under thermal with current loading conditions
7. Thermal analysis and reliability assessment of power module under power cycling test using global- local finite element method
8. Study on current and junction temperature stress aging effect for accelerated aging test of Light emitting diodes.
9. Evaluation of Die Strength by Using Finite Element Method With Experiment Validation
10. Structure design and reliability assessment of double-sided with double-chip stacking packaging
11. Analysis of LED wire bonding process using arbitrary Lagrangian-Eulerian and explicit time integration methods
12. Development of double-sided with double-chip stacking structure using panel level embedded wafer level packaging
13. A thermal performance assessment of panel type packaging (PTP) technology for high efficiency LED
14. Acceleration factor analysis of aging test on gallium nitride (GaN)-based high power light-emitting diode (LED).
15. Light degradation test and design of thermal performance for high-power light-emitting diodes
16. Determination of silicon die initial crack using acoustic emission technique
17. A study on the thermal performance of a chip-in-substrate-type LED package structure
18. Effects of Uniaxial Compaction Pressure on the Dielectric Properties of BaTiO3/Polyvinylidene Fluoride Composites
19. Dielectric Properties and Ferroelectric Domain of BaTiO3 Powders
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