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The monograph discusses the failure of aluminum interconnecting metalization patterns used on silicon integrated circuits. The primary subject area is limited to those failures occurring in the metalized aluminum interconnecting stripes independent of their terminating interfaces. The subject is covered by first describing metalization failures at a gross level in terms of the function of the metalization and the manners in which it can fail, the means of detecting these failures, and the use of failure analysis techniques to determine the failure cause and phenomena. Section III describes the failure phenomena pertinent to metalization. A bibliography of references on metalization failures concludes the report.

The purpose of the monograph is to present an overview of the state-of-the-art of flip-chip die bonding. Following the summary in the next section, a description of the basic technology of flip-chip die bonding is given. Discussions of substrates, metallurgy systems, flip-chip assembly, and environmental protection and external leads follow. These sections are then brought into perspective by a discussion of complete flip-chip systems and reliability. The final section reviews current developmental activities of major integrated circuit manufacturers.

The monograph describes the basic philosophy of screening monolithic integrated circuits, IC failure modes and mechanisms, available screening techniques, and the establishment of a total screening program. The Appendix presents a summary of recent screening experience in terms of costs, screen test results and reliability improvement.

The monograph presents a review of the state of the art of silicon nitride usage by discussing: Problems with use of silicon dioxide (Background); The uses of silicon nitride in the planar process; Silicon nitride processing; Reliability experience with silicon nitride.

In semiconductor devices interconnecting wire bonds have been a continuing source of reliability problems. This monograph discusses the relevance of design and processing factors to reliability problems with wire bonds. The prevention and control of such problems are discussed in terms of design, processing, post production screening and sampling tests. The current literature on the subject is reviewed and incorporated in the above discussions. An analysis of the RAC data base is presented along with the resulting bond failure rate equations and summary data. The report contains three appendices including a cross reference guide to the literature as well as bibliography of over 90 references with abstracts. (Author)

An experimental study of a balanced electric arc of 200 to 400 amperes in an atmospheric pressure cross-flow air stream of velocities up to 60 ft/sec and transverse magnetic field strengths up to 50 gauss was made. An open-jet type facility permitted the use of diagnostic techniques in the arc wake region. The arc's significant dimension transverse and parallel to the flow was measured. This dimension increased transverse to the flow and decreased parallel to the flow as the transverse blowing velocity was increased. Velocity profiles, energy flux distributions, relative turbulence levels and frequency measurements were obtained in the arc wake using miniaturized probe techniques. Flow visualization studies were performed using micron-sized particles. The input and output arc power distribution was obtained. The energy convectively transferred to the arc wake was equal to the additional electrical energy input required to maintain the arc in the presence of the transverse blowing. A drag coefficient for the arc, analogous to that of a solid cylinder subjected to a cross-flow, was defined and measured to have values between 0.7 and 1.2. Comparisons between the wake of an arc and that of a heated solid cylinder indicated similarity in vortex shedding frequency and convective heat transfer. (Author)