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The micro-discharge effect limits the development of high-frequency microwave power components to miniaturization and integration. Therefore, it has become a focus of research to effectively suppress the micro-discharge effect, increase the micro-discharge threshold, and strengthen the environmental stability of high-frequency microwave devices. In this study, different elemental ratios of carbon (C)/silver (Ag)/titanium (Ti) composite films were obtained by multi-target magnetron co-sputtering technology and then systematically analyzed for micro-discharge effects. When the doping ratio of C/Ag/Ti was 3.538/1/0.013, the corresponding maximum secondary electron emission coefficient (δmax) decreased to 1.01 owing to the suppression of secondary electron emission by the increase in the content of sp2 hybrid bond. The micro-discharge threshold of Ku band waveguide filters coated with moderate C/Ag/Ti composite films showed an optimal performance of 10 000−12 500 W, which was increased by approximately 20 times. Moreover, the microstructure of the composite films exhibited higher density and flatness with a tiny increase in the titanium doping ratio, representing good environmental stability. Thus, the effective suppression of the secondary electron emission yield, significant improvement in the micro-discharge threshold, and enhancement of the environment stability of microwave components could be realized simultaneously by reasonably controlling the content of titanium in silver and titanium co-doped carbon-based composite films. [ABSTRACT FROM AUTHOR]

The ring-shaped Cohesin complex, consisting of core subunits Smc1, Smc3, Scc1, and SA2 (or its paralog SA1), topologically entraps two duplicated sister DNA molecules to establish sister chromatid cohesion in S-phase. It remains largely elusive how the Cohesin release factor Wapl binds the Cohesin complex, thereby inducing Cohesin disassociation from mitotic chromosomes to allow proper resolution and separation of sister chromatids. Here, we show that Wapl uses two structural modules containing the FGF motif and the YNARHWN motif, respectively, to simultaneously bind distinct pockets in the extensive composite interface between Scc1 and SA2. Strikingly, only when both docking modules are mutated, Wapl completely loses the ability to bind the Scc1-SA2 interface and release Cohesin, leading to erroneous chromosome segregation in mitosis. Surprisingly, Sororin, which contains a conserved FGF motif and functions as a master antagonist of Wapl in S-phase and G2-phase, does not bind the Scc1-SA2 interface. Moreover, Sgo1, the major protector of Cohesin at mitotic centromeres, can only compete with the FGF motif but not the YNARHWN motif of Wapl for binding Scc1-SA2 interface. Our data uncover the molecular mechanism by which Wapl binds Cohesin to ensure precise chromosome segregation., Competing Interests: Competing interests statement:The authors declare no competing interest.