Search

The authors report the fabrication of p-n junctions, consisting of n-type SrTiO3 or BaTiO3 and p-type Si substrates, by the pulsed-laser deposition technique. The BaTiO3/Si junction exhibits excellent rectifying behavior and significantly reduced leakage current at 300 K exceeding breakdown voltage of -25 V with leakage current <0.5 μA, while SrTiO3/Si with an interfacial layer shows moderate junction characteristics. It was demonstrated that the BaTiO3/Si grown at an optimum growth temperature of 650 °C displayed superior performance which is promising for electronic devices. Both junctions show photocurrent at 300 K due to electron injection following the photoexcitation of n-type perovskite. [ABSTRACT FROM AUTHOR]