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1. Effect of surface finishes on electromigration reliability in eutectic Sn–58Bi solder joints.

Author

Kim, Jae-Ha, Lee, Young-Chul, Lee, Sang-Min, and Jung, Seung-Boo

Subjects
*EUTECTICS, *ELECTRODIFFUSION, *CATHODES, *TIN, *SOLDER joints, *RELIABILITY (Personality trait), *BISMUTH
Abstract

Highlights: [•] We studied the failure behavior induced by EM test on the Sn–Bi solder joint. [•] We evaluated the EM reliability of Sn–Bi solder joint on various surface finishes. [•] The Bi was segregated from cathode to anode side. [•] The OSP surface finish showed longer time to failure than others. [ABSTRACT FROM AUTHOR]

Published
2014
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