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A novel structure of bondwire and microstrip lines for Chip-to-Chip inter-connection up to 130GHz is firstly pre-sented in this paper. Its realization is based on PCB heterogeneous integration process. In order to reduce its high inserted loss which mainly caused of high inductance of the bondwire, the microstrip line of the structure is then optimized. Simulated results show that the minimum insertion loss of 1.0 dB for the structure can be achieved, with the bandwidth more than 35 GHz in bands of 100-135 GHz.

Atmosphere lamp in a car is a kind of adornment lamp that builds interior atmosphere, and it can let a person have warm, relaxed, comfortable feeling. This paper makes a simple analysis of the causes of electromagnetic interference in printed circuit board (PCB) wiring by ambient light examples, and increases PCB simulation analysis to help optimize in the design phase. We use the simulation software to analyze the test module, efficiently and accurately find the problem points, save the time and cost for the development of the project.