40 results on '"Derakhshandeh, Jaber"'
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2. Confined IMCs for low temperature and high throughput D2W bonding
3. Fundamental study of IMC grains at low anneal temperature
4. Low temperature backside damascene processing on temporary carrier wafer targeting 7μm and 5μm pitch microbumps for N equal and greater than 2 die to wafer TCB stacking
5. Electrodeposition of Indium for Low Temperature 3D Stacking
6. A study on IMC morphology and integration flow for low temperature and high throughput TCB down to $10\mu \mathrm{m}$ pitch microbumps
7. Cobalt-Tin Intermetallic Compounds as Alternative Surface Finish for Low Temperature Die-to-Wafer Solder Stacking
8. Process development and characterization of 3D multi-die stacking
9. ELD NiB for microbumps passivation and wirebonding
10. Evaluation of UBM oxidation through air exposure and heating and effectiveness of wet and plasma cleaning on solder joint formation during TCB
11. A novel iso-thermal intermetallic compound insertion bonding approach to improve throughput for 3D die to wafer stacking
12. 10 and 7 μm Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process
13. Process Complexity and Cost Considerations of Multi-Layer Die Stacks
14. New approach to apply 1,2,3-benzotriazole as a capping layer on UBMs for 3D TCB stacking and investigation of oxidation protection and solder wetting
15. A Novel Intermetallic Compound Insertion Bonding to Improve Throughput for Sequential 3-D Stacking.
16. A Novel Resistance Measurement Methodology for $In~Situ$ UBM/Solder Interfacial Reaction Monitoring.
17. TCB optimization for stacking large thinned dies with 40 and 20 μm pitch microbumps
18. An in-situ resistance measurement to extract IMC resistivity and kinetic parameter of alternative metallurgies for 3D stacking
19. Study on 3D self-aligned assembly using chips with etched edge and SAM for liquid confinement
20. A novel in-situ resistance measurement to extract IMC resistivity and kinetic parameter for CoSn 3D stacks
21. Improving solder wetting of micro bumps on metal pads using metallic or organic pad coatings
22. Growth rate of IMC in the binary sytems of Co/Sn and Cu/Sn
23. 3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures
24. Die to wafer 3D stacking for below 10um pitch microbumps
25. Liquid mediated direct bonding and bond propagation
26. 3D Stacking Using Bump-Less Process for Sub 10um Pitch Interconnects
27. Investigation of Co Thin Film as Buffer Layer Applied to Cu/Sn Eutectic Bonding and UBM With Sn, SnCu, and SAC Solders Joints.
28. Cobalt UBM for fine pitch microbump applications in 3DIC
29. Picking large thinned dies with high topography on both sides
30. Impact of ELD layers in mechanical properties of microbumps for 3D stacking.
31. 3D stacking of Co- and Ni-based microbumps.
32. Reflow process optimization for micro-bumps applications in 3D technology
33. Fine Pitch Rapid Heat Self-Aligned Assembly and Liquid-Mediated Direct Bonding of Si Chips.
34. Integrating low temperature aligned carbon nanotubes as vertical interconnects in Si technology
35. Monolithic 3D integration of SRAM and image sensor using two layers of single grain silicon
36. Analog and digital output lateral photodiodes fabricated by µ-Czochralski process at low temperature
37. A novel silicon interposer for measuring devices requiring complex two-sided contacting.
38. High-Efficiency Silicon Photodiode Detector for Sub-keV Electron Microscopy.
39. Monolithic 3-D Integration of SRAM and Image Sensor Using Two Layers of Single-Grain Silicon.
40. VUV/Low-Energy Electron Si Photodiodes With Postmetal 400^\circC PureB Deposition.
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