74 results on '"Vanfleteren, Jan"'
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2. Reducing out-of-plane deformation of metal interconnects in structural electronics
3. Over-molding of two-dimensional curved shape using polyimide copper cladding foil
4. Solar cells integration in over-molded printed electronics
5. Vacuum Lamination of a Stretchable Sensor System in PolyPropylene
6. Fully Integrated Flexible Dielectric Monitoring Sensor System for Real-Time In Situ Prediction of the Degree of Cure and Glass Transition Temperature of an Epoxy Resin.
7. Effect of overmolding process on the integrity of electronic circuits
8. Thermoplastically Shaped Wearable Medical Devices
9. Coupled Half-Mode Cavity-Backed Slot Antenna for IR-UWB in Air-Filled SIW Technology
10. Autonomous wearable RFID-based sensing platform for the Internet-of-Things
11. Key generation based on fast reciprocal channel estimation for body-worn sensor nodes
12. Modular transmitter and receiver for space-time coding
13. One-time deformable thermoplastic devices based on flexible circuit board technology
14. Capacitive sensor network for composites production monitoring
15. Design Automation of Meandered Interconnects for Stretchable Circuits.
16. Stretchable Mold Interconnect Optimization: Peeling Automation and Carrierless Techniques.
17. A new technology for rigid 3D free-form electronics based on the thermoplastic deformation of flat standard PCB type circuits
18. Highly Efficient Impulse-Radio Ultra-Wideband Cavity-Backed Slot Antenna in Stacked Air-Filled Substrate Integrated Waveguide Technology.
19. Applying QMSIW technique in textile for compact wearable design and high body-antenna isolation
20. An Electrochemical Biosensor Based on AuNP-Modified Gold Electrodes for Selective Determination of Serum Levels of Osteocalcin.
21. Flexible and stretchable electronics for wearable healthcare
22. Wearable Flexible Lightweight Modular RFID Tag With Integrated Energy Harvester.
23. Threefold Rotationally Symmetric SIW Antenna Array for Ultra-Short-Range MIMO Communication.
24. Arbitrarily Shaped Rigid and Smart Objects Using Stretchable Interconnections.
25. Short, Stretchable Molded Interconnect reliability under 10% cyclic elongation
26. Embedded flexible optical shear sensor
27. Reliability assessment of stretchable interconnects
28. A novel approach to embed off-chip RF passives in PCB based on thin film technology
29. Module miniaturization by ultra thin package stacking
30. Thermo-mechanical analysis of flexible and stretchable systems
31. Design of flexible, low-power and wireless sensor nodes for human posture tracking aiding epileptic seizure detection
32. Multiple chip integration for flat flexible electronics
33. Active optical links embedded in flexible substrates
34. Design of Metal Interconnects for Stretchable Electronic Circuits using Finite Element Analysis
35. Stretchable electronic systems
36. Improved chip & component encapsulation by dedicated diffusion barriers to reduce corrosion sensitivity in biological and humid environments.
37. Stretchable biocompatible electronics by embedding electrical circuitry in biocompatible elastomers.
38. The i-module approach: Towards improved performance and reliability of photovoltaic modules.
39. High-Yield Fabrication Process for 3D-Stacked Ultrathin Chip Packages Using Photo-Definable Polyimide and Symmetry in Packages.
40. PDMS Selective Bonding for the Fabrication of Biocompatible All Polymer NC Microvalves.
41. 3-D Stacking of Ultrathin Chip Packages: An Innovative Packaging and Interconnection Technology.
42. Stretchable Electronics Technology for Large Area Applications: Fabrication and Mechanical Characterization.
43. Fabrication and Characterization of Flexible Ultrathin Chip Package Using Photosensitive Polyimide.
44. Design of an Implantable Slot Dipole Conformal Flexible Antenna for Biomedical Applications.
45. Developing an Advanced Module for Back-Contact Solar Cells.
46. Polyimide-Enhanced Stretchable Interconnects: Design, Fabrication, and Characterization.
47. UTCP: A Novel Polyimide-Based Ultra-Thin Chip Packaging Technology.
48. Fine-Pitch Capabilities of the Flat Ultra-Thin Chip Packaging (UTCP) Technology.
49. Fabrication Processes for Embedding Thin Chips in Flat Flexible Substrates.
50. Design and Manufacturing of Stretchable High-Frequency Interconnects.
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