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In order to explore the influence of interlayer between dielectric layer and channel layer on performance of thin film transistors (TFTs), the single layer titanium doped zinc oxide (TiZO) TFTs and the dual layer indium tin oxide (ITO)/TiZO TFTs were fabricated successfully in this work. The effects of interlayer thickness on the performance of TFTs were studied and the optimal thickness condition was obtained. The experimental results indicate that the introduction of interlayer contributes to the improvement of TFT characteristics. In addition, the dual-layer ITO/TiZO TFTs also present a good uniformity, which is suitable for large-area display applications.

Smart meter terminals are some of the most familiar monitoring unit. As recent research because of poor contact, aging, corrosion and other factors, the terminal of smart meter will cause heat, and eventually lead to the burnout of the meter.simulation. In this paper, we summarize how NTC temperature sensors can be operated, and their working principle is presented. Then the thermal of the smart meter is simulated by computer and we also discuss the advantages of this sensor.

Accelerometers are some of the most familiar micro electronic mechanical system (MEMS) sensor. Accelerometers are used in many fields, such as vehicle braking, mobile phone, gauge check and so on. In this paper, we summarize how accelerometers sensors can be operated, and their working principle is presented, and then the fabrication process of the accelerometers sensors is presented. Then we conducted a preliminary test on the performance of the sensor and discuss the optimization scheme of manufacturing process.

Cantilever-based sensor is kind of the most popular MEMS sensor. In this paper, by taking an example the process of analyzing a transducer is explained, such as building models and performing mathematic operations on result data to get the performance parameters of a cantilever-based sensor. We also state the principle of the cantilever bio-sensor. In the meantime we explain the theory of the operating of cantilever, and a cantilever sensor design guided by mechanical simulation.

Dry etching process are some of the most familiar MEMS technology. In this paper, we study the rate enhancements observed through operation of the power of plasma source and the oxygen flow rate in a single step at low temperature for high dose implanted photoresist removal.

The phenomenon of transient catastrophic optical damage (COD) was studied experimentally by means of thermal infrared imaging, photon emission microscope (EMMI), and electron diffraction technology (SAED) under high-resolution transmission electron microscope. We have recorded the dynamics of COD process using thermal infrared camera. The temperature of transient COD has a sudden increase of 32.07 °C when the COD event occurs which maintains less than 8.69 ms accompanying with the sudden decrease of output power. The reverse leakage current was investigated by EMMI. The leakage current of the COD sample increase and the photo in the active region was observed. Moreover, the result obtained from SAED technology identified that the silicon was changed into polycrystalline near the active area, contrasting to the silicon outside active area still remained initial single phase after COD.

A novel cantilever array sensor was micro-fabricated for precise bio-marker detection. The device was fabricated on a SOI wafer with CMOS compatible processes. In order to reducing the effect of k variation due to adsorption, a local biochemical reaction cavity was designed in the free end of the cantilever, the antibody-immobilization was performed in this local area by micro printing technology. This approach can be applied to enhance the performance of all the cantilever-based sensors. The PDMS package is designed to be used for the cantilever sensor which is greatly promoting the practicality of the sensor.

The thermomechanical stress characteristics in high-power 808-nm AlGaAs/GaAs laser diode bars were investigated experimentally and theoretically using infrared thermography and finite element method in detail. The transient thermomechanical stress curves changing with total operation current were measured using infrared thermography. The results indicated that thermomechanical stress of laser diodes chip has a logarithmical dependence on the total operation current. In addition, the dependence of thermomechanical stress on total operation current was analyzed based on finite element method which was great consistent with the experimental results. The calculated results showed that thermomechanical stress of laser diodes chip had a higher increasing rate with higher operation current density, and the plastic deformation would occur when the thermal stress reaches the yield strength.

Processes that define the cantilever sensor from the front side of the wafer are designed to release the stress of the buried oxide layer and top silicon layer. This approach can be applied to enhance the performance of all the cantilever-based sensors. Then, a novel cantilever array sensor was micro-fabricated for precise bio-marker detection.

Processes that define the cantilever sensor from the front side of the wafer are designed to release the stress of the buried oxide layer and top silicon layer. This approach can be applied to enhance the performance of all the cantilever-based sensors. Then, a novel cantilever array sensor was microfabricated for precise bio-marker detection.

In this paper, the recent two years of failure analysis cases of our laboratory are screened and some of them are displayed, they are mostly selected with a relation to the influence of temperature and humidity. To illustrate the typical and common failure phenomenon, plastic packaging products are focused. The main failure mode of these failed products include package delaminations, solder abnormality, moisture ingress. By finding out the occurrence mechanism and summing up these issues, the corresponding analysis for improvement and preventive measures were put forward. In addition, for this paper, some significant failure analysis technologies and equipments are performed, and the related pictures, make sense and useful, impress the understanding of the readers.