32 results on '"Zhao, X.J."'
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2. Relationship between crack propagation trends and grains in SnAgCu interconnects
3. Au-Au ‘cold-weld’ bond strength in adhesively bonded flip-chip interconnects
4. Design for reliability - a Reliability Engineering Framework
5. High-speed mechanical impact reliability of solder interconnections in high-power LEDs
6. Cold welding: A new factor governing the robustness of adhesively bonded flip-chip interconnects
7. HART: A new highly accelerated robustness test for conductive adhesive interconnects
8. Constitutive Properties of Bulk Solder at `Drop-Impact' Strain Rates
9. Improvement of mechanical impact resistance of BGA packages with Pb-free solder bumps
10. Numerical Simulation of Transient Thermal Effects in Skin Tissue.
11. Numerical simulation Of 2D bend-flows with WENO schemes.
12. Simulation for 2D flows in a rectangular meandering channel.
13. Study on the reliability of high power device assemblies using high-Pb solder alternatives: an overview.
14. High-speed mechanical impact reliability of solder interconnections in high-power LEDs.
15. Frequency dependent S-N curves for predicting drop impact robustness of Pb-free solder interconnects.
16. A study of crack propagation in Pb-free solder joints under drop impact.
17. A Study of Component-Level Measure of Board-Level Drop Impact Reliability by Ball Impact Test.
18. A Component Level Test Method for Evaluating the Resistance of Pb-free BGA Solder Joints to Brittle Fracture under Shock Impact.
19. To simulate the formation of TSSOP solder joint with SAC solder and assess on the effects of the stencil design and the misalignment on the joint shape.
20. Prediction of moisture induced failures in flip chip on flex interconnections with non-conductive adhesives.
21. Assembly process modeling for flip chip on flex interconnections with non-conductive adhesive.
22. An FPGA controlled WDM buffer memory
23. Large eddy numerical simulation of flows over a backward-facing step.
24. A numerical model for simulation of flow with effects of streamline curvature.
25. A novel bidirectional add/drop module using waveguide grating routers and wavelength channel matched fiber gratings.
26. To simulate the formation of TSSOP solder joint with SAC solder and assess on the effects of the stencil design and the misalignment on the joint shape
27. Feasibility Study on Board Assembly of TSSOP Components with NiPdAu PPF Finish
28. Evaluation of soldering and reliability performance of NiPdAu finished PPF with Pb-free solder alloy 95.5Sn4.0Ag0.5Cu.
29. Feasibility study on board assembly of TSSOP components with NiPdAu PPF finish.
30. Towards a predictive behavior of non-conductive adhesive interconnects in moisture environment.
31. A novel bi-directional add/drop module for single fiber bi-directional self-healing wavelength division multiplexed ring networks.
32. Optical DRAMS using refreshable WDM loop memories.
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