Search

In the past few years, thermal through silicon via (TTSV) has been experimentally investigated as an effective heat dissipation path. Although a lot of heat dissipation- related issues have been solved in 3-D integrated circuit (3-D-IC), there are neglections in TTSV placement with non-uniform heat sources so far. In this study, a unique optimization is proposed to locate TTSV while effectively alleviating hot spots in 3-D-IC. The thermal dissipation of non-uniform heat sources are studied using the finite element method. The simulation results show that the minimum temperature is reduced by 2.1% compared with peak temperature in the single-layer chip, and by 1.9% in the three-layer chip. [ABSTRACT FROM AUTHOR]

This paper applies the multi-layer graphene nanoribbon as a new prospective filler material for through silicon via to solve the complex heat problems in the 3-D integrated circuits. An equivalent thermal model for 3-D integrated circuits with the MLGNR-based through silicon via is presented in this work, which take lateral heat transfer of through silicon via into account. The experimental results show that the heat transfer performance of MLGNR-based through silicon via is better than the conventional Cu-based through silicon via. Furthermore, it is found that the temperature predicted by the proposed model are in good accordance with the ANSYS simulation, and the maximum relative deviation is less than 4.0%. [ABSTRACT FROM AUTHOR]

An analytical thermal model is developed for N-die stacked chips with integrated micro-channels cooling. The model is implemented with some mathematical software. Comparison of the temperature predicted by the proposed model with some computer fluid dynamics software numerical results show excellent agreement, and the maximal relative error is less than 4.0%. [ABSTRACT FROM AUTHOR]

MicroChannel cooling is a promising technology for solving the three-dimensional integrated circuit thermal problems. However, the relationship between the microchannel cooling parameters and thermal behavior of the three dimensional integrated circuit is complex and difficult to understand. In this paper, we perform a detailed evaluation of the influence of the microchannel structure and the parameters of the cooling liquid on steady-state temperature profiles. The results presented in this paper are expected to aid in the development of thermal design guidelines for three dimensional integrated circuit with microchannel cooling. [ABSTRACT FROM AUTHOR]