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We are presenting the result of the microshutter arrays for multi-object spectroscopy. Microshutter arrays are MEMS technology devices that are 2D programmable field masks for object selection in the sparsely populated fields. This next generation microshutters are based on the first generation of the microshutter arrays developed for the James Webb Space Telescope Near-Infrared Spectrometer (JWST NIRSpec) we developed new fabrication process that allowed to build fully electrostatic microshutter arrays. The microshutter arrays based on this new development have been successfully demonstrated in the FORTIS project sounding rocket flight. We are currently in the process of expanding the fabrication process to large format microshutter arrays designed for the use on the future NASA flagship missions such as HabEx and LUVOIR.

We have demonstrated a kilopixel, filled, infrared bolometer array for the balloon-borne Primordial Inflation Polarization Explorer (PIPER). The array consists of three individual components assembled into a single working unit: 1) a transition-edge-sensor bolometer array with background-limited sensitivity, 2) a quarter–wavelength backshort grid, and 3) an integrated Superconducting Quantum Interference Device (SQUID) multiplexer (MUX) readout. The detector array is a filled, square–grid of suspended, one-micron thick silicon bolometers with superconducting sensors. The Backshort–Under–Grid (BUG) is a separately fabricated component serving as a backshort to each pixel in the array. The backshorts are positioned in the cavities created behind each detector by the back–etched well. The spacing of the backshort beneath the detector grid can be set from ~30-300_microns by independently adjusting process parameters during fabrication. Kilopixel arrays are directly indium–bump–bonded to a 32x40 SQUID multiplexer circuit. The array architecture is suitable for a wide range of wavelengths and applications. Detector design specific to the PIPER instrument, fabrication overview, and assembly technologies will be discussed.