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We report a novel application of calcein-acetomethyl ester in flow cytometry for rapid estimation of the number of G+-bacteria in rodent feces (Apodemus sylvaticus and Mus sp.f. muridae). We also use the combined application of flow cytometry and Syto-13 or Sypro Orange staining to count rapidly the total bacterial population and to describe bacterial subpopulations in the intestine.

High resolution monochromatic synchrotron-radiation diffraction images of five, high quality epitaxial heterojunctions on silicon, gallium arsenide, and indium phosphide substrates display several forms of accommodation to lattice mismatch. From the images, we deduce a coherent set of factors for the loss of crystalline order in layered semiconducting crystals. Lattice mismatch is demonstrated in each of the systems by warping after layer deposition. Nevertheless, local lattice orientation is maintained across each layer interface. In two of the systems, one severely mismatched while the other is not, no arrays of dislocations appear. Sets of mixed linear lattice mismatch dislocations, consistent with identification as 60° dislocations, are found in two of the other systems with intermediate degrees of mismatch. A set of pure edge dislocations penetrating all layers is found in a system with a grid structure. These observations indicate that the formation of extensive arrays of dislocations during uniform one micrometer layer deposition depends not only on the extent of lattice mismatch and layer thickness but also on the degree of crystalline order of the substrate. Establishment of a nonpseudomorphic layer mismatched with the substrate by several tenths of a percent is an important factor, as previously determined. However, localized absence of crystalline order, e.g. in the form of scratches or dislocations in the substrate, appears also to be required for the formation of arrays of interface mismatch dislocations. Where these criteria are not fulfilled, the formation of dislocations in uniform layered systems is inhibited. Localized residual stress can initiate dislocation formation even where it would not appear in uniform layers. The images show also that crystalline disorder in state-of-the-art indium phosphide differs markedly from that in comparable gallium arsenide. Understanding of crystalline order in both monolithic materials is extended by this work.

The formation of mismatch dislocations in layered semiconductor structures was found recently in high resolution monochromatic synchrotron x-radiation diffraction images to be correlated with characteristics of the substrate as well as with the layer thickness and degree of lattice mismatch of non pseudomorphic layers.1,2We have now extended these studies to examine the accommodation to strain as a function of lattice mismatch in a series of high electron mobility transistor (HEMT) structures grown by molecular beam epitaxy (MBE) on indium phosphide substrates.Five distinct types of irregularity are observed: 1) lattice warping, 2) the formation of a nonpseudomorphic layer, 3) the formation of extended arrays of linear mismatch dislocations at the interface between the substrate and a nonpseudomorphic layer, 4) the formation of oval regions of tweed-like local lattice variation imbedded among these arrays, and 5) extended tweed-like local lattice variation over large peripheral areas in which the formation of straight mismatch dislocation arrays is not observed.Warping of the lattice is found in nearly all layered structures. A distinct layer with a different lattice parameter but without visible misfit dislocations is formed with a mismatch of 0.27 %. With increase of the mismatch to 0.5 %, the other three forms of accommodation appear in distinct regions of the structure: arrays of mismatch dislocations; oval regions of tweed-like irregularity, oriented in the [011] direction; and peripheral regions of extended tweed-like local lattice variation.

Low-order, monolayer by monolayer (1×1) AlAs/GaAs superlattices grown by MBE using different growth techniques have been studied by X-ray diffractometry. High-resolution multiple-crystal diffractometry was used to study diffraction features near the [004] peaks due to the substrate and epilayers. Using this technique, we have investigated the effect of growth techniques on the strain and tilt of the superlattices. High-resolution X-ray diffraction (HRXRD) results suggest that the sample grown by migration-enhanced epitaxy (MEE) is more highly strained and has more tilt than the same superlattice sample grown using the interrupted growth (IG) technique.

The acquisition of RHEED oscillation information on (100) GaAs substrates is described for use in the growth of “lattice-matched] Iny (AlxGa1−x)1-Y As layers on (100) InP substrates with 0.52 < y < 0.53 and 0.00 < x < 1.00. The observed frequency of the RHEED oscillations on GaAs is the same as on InP, however, the measured lattice parameters of the grown layers are less than that of InP. The x-ray diffraction images show that the misfit dislocations perpendicular to the primary flats of 2” round (100) InP wafers are denser than the parallel ones. Photoluminescence (at 10K) and photoreflectance (at 300K) measurements on a composite layer structure of x=0, 0.2, 0.4, 0.6, 0.8 and 1 clearly show six distinct peaks with narrow FWHMs of less than 20 meV. The measured bandgaps increase linearly with the Al content.

In this work we examine the physical properties for the superlattice system (GaAs)n1 (AlAs)n2/GaAs(100) for low values of n1 and n2, i.e., n1 = n2 = 3, 6, 12. Normal, interrupted growth, and migration enhanced epitaxy (MEE) growth techniques were used to grow the superlattice structures in a molecular beam epitaxy system. X-ray diffraction spectra were obtained, and the major and satellite peak positions were analyzed to obtain the superlattice periodicity. An analysis of the major diffraction peaks and their associated satellites produced superlattice periodicity in good agreement with theory. Diffraction peaks were also observed in regions adjacent to the primary diffraction peaks which did not occur in the expected satellite positions. An analysis of these peaks relative to the primary peak indicate periodicities corresponding to layer thickness greater than the intended period. One possible cause for these periodicities is growth conditions that exist during the growth of the superlattice which result in the deposition of fractional monolayers. In this study we present results which suggest that an arsenic-deficient growth condition may be a contributing factor in the deposition of fractional monolayers.

We report the results of our study of controlled interface roughness in low-order GaAs/AlAs superlattices. Samples were prepared using either the interrupted growth or the migration-enhanced epitaxy (MEE) technique. The samples were prepared with m atomic planes of GaAs and m atomic planes of AlAs (m × m) per modulation wavelength and repeated p times. For this study, m = 1 or 3. The samples were studied using X-ray diffraction. The interrupted growth samples both showed a split in one diffraction line indicating layers were not of integral order while the MEE samples showed no splitting, indicating integral order layers.

Differential resistivity and Hall effect measurements and secondary ion mass spectrometry (SIMS) are used to study the annealing behavior of Be-implanted GaAs0.6P0.4. Results similar to that previously reported for Be-implanted GaAs are observed, including outdiffusion of Be into the Si3N4 encapsulant during 900‡C annealing of high dose implants. Nearly all (85–100%) of the Be remaining after a 900‡C, 1/2 hr anneal is electrically active. However, the electrical activation at low annealing temperatures (600–700‡C) is much lower in GaAs0.6P0.4 than in GaAs. A substantial amount of diffusion is observed even for the low fluence Be implants in GaAs0.6P0.4 annealed at 900‡C, indicating a greater dependence of the diffusion on defect-related effects in the ternary.

Semi-insulating chromium-doped GaAs was implanted with 100 keV Be ions to fluences of 5 × 1013 and 1 × 1015 ions/cm2. Specimens were annealed at 800°C for thirty minutes. Beryllium atomic concentration profiles, as determined by secondary ion mass spectrometry (SIMS), were compared to the defect density profiles obtained from transmission electron stereomicroscopy techniques for the annealed samples. A major redistribution of Be was observed compared to the as-implanted distribution after annealing at the higher fluence, whereas only a slight redistribution of Be occurred for the lower fluence. A major difference in the defect density profiles was observed with the fluences used for this study in the region where the annealed specimens were compared. The distribution of defects throughout the implanted-annealed layer was examined in GaAs annealed after implantation with the higher fluence using sectioned specimens. The relationships between the atomic Be concentration profile, the defect density profile, and the distribution of some specific defects were compared in these sectioned layers. The distribution and size of defects appear to be directly influenced by the Be concentration and its associated implantation induced damage.

Atomic profiles of ion-implanted Be and S in GaAs have been measured as a function of implant fluence and annealing temperature. Concentration versus depth profiles were ob-tained by means of secondary ion mass spectrometry (SIMS) techniques. Pyrolytically deposited and sputter-coated Si02 and Si3N4 films were used as encapsulants for the 500 to 900° annealing study. Semi-insulating GaAs was implanted with 200 keV34S+ to fluences of 1 × 1014 and 52× 1014/cm2, and 100 keV9Be+ in the 1 × 1013 to 1 × 1015/cm2 fluence range. The S profiles did not change significantly after annealing at 800°C, although there was some skewing after annealing above 600°C. In contrast, the Be profiles showed significant changes and a decrease in the peak concentration for the ≥ 5 × 10T4/cm2 implants after a 700°C anneal. After a 800°C anneal the Be profile was essentially flat with a monotonic decrease from the surface into the implanted re-gion and a 900°C anneal caused a further decrease in the Be concentration. Profiles of Be implants of ≤ 1 × 1014/cm2 did not change significantly after annealing indicating that the higher fluence cases were related to solubility effects.

The narrow and direct bandgap of indium antimonide is frequently used to good advantage in detection of light in the infra-red region; however, to date little use has been made of the high mobilities associated with this material. Although its high intrinsic carrier concentration generally necessitates operation at cooled temperatures, higher speeds and the advantage of integrating other devices on-chip with the infrared detectors encourages the development of an active device technology on this semiconductor. Considering its small bandgap, the problems associated with good p-n junctions may favor the MISFET in this application. Surprisingly, little has been done toward this goal, though structures such as chargecoupled- devices [1], focal array detectors [2], and a few insulated gate FETs [3,4] have been fabricated. In this paper we present the results of our recent work toward the development of a fabrication technology for InSb MISFETs. Specifically, we have conducted a study of etchants, metal contacts, and dielectrics for application to mesa-structure, insulated gate field transistors.