144 results on '"Jalar, Azman"'
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2. Undissolved gold in fine-pitch BGA solder joint under thermal cycling test
3. Moisture Content and Early Corrosion Detection of Cu Wire Bonding in a Semiconductor Package
4. Titanium dioxide ion-sensitive extended gate field effect transistor (ISEGFET): selective detection of potassium ions in artificial blood serum
5. Effect of deformation temperature on the dynamic recrystallization mechanism and dynamic precipitation behavior of Mg-Gd-Nd-Zr alloy
6. Unleashing the potential of gallium oxide: A paradigm shift in optoelectronic applications for image sensing and neuromorphic computing applications
7. Micromechanical response of SAC305 solder alloy under gamma radiation via nanoindentation approach
8. Dynamic precipitation and dynamic recrystallization behaviors of Mg-Gd-Nd-Zr magnesium alloy during thermal compression deformation
9. Early Corrosion Detection of Cu-Ag Wedge bonding in Semiconductor Package
10. Effect of Nd on microstructure and mechanical properties of Mg-7Gd-0.5Zr alloy
11. Effect of alloy particle size and stencil aperture shape on solder printing quality
12. EDS analysis on effect of low dosage gamma radiation and micromechanical properties of SnAg3Cu0.5 solder
13. Magnesium-doped ZnO nanorod electrolyte–insulator–semiconductor (EIS) sensor for detecting calcium ions
14. Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint
15. Effect of ultrasonic bonding and lamination on electrical performance of copper indium gallium (de)Selenide CIGS thin film photovoltaic solar panel.
16. Bondability of ultrasonic Aluminum bonds on the molybdenum (de)selenide and molybdenum of back contact layer of copper indium gallium (de)selenide CIGS thin film photovoltaic solar panel
17. Calcium ion-selective electrode based on the facile synthesis of CuO over Cu wires
18. Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition
19. Low-cost fabrication of a pH sensor based on writing directly over parchment-type paper with pencil
20. Superluminal geometrodynamics of braneworld hyperdrive via brane–bulk interaction.
21. Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu
22. Temperature Dependence of Elastic–Plastic Properties of Fine-Pitch SAC 0307 Solder Joint Using Nanoindentation Approach
23. Effect of surface roughness and hardness of leadframe on the bondability of gold wedge bonds
24. Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition
25. Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly
26. Real-time viral detection through electrolyte-gated field effect transistors: possibility of rapid COVID-19 detection.
27. Effect of PVD-coated wall aperture roughness on the life span of fine-pitch stencil printing.
28. Adsorption isotherm and kinetic study of gas-solid system of formaldehyde on oil palm mesocarp bio-char: Pyrolysis effect
29. Deformation behavior relationship between tensile and nanoindentation tests of SAC305 lead-free solder wire
30. SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly
31. Deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) solder wire under varied tensile strain rates
32. Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability
33. Study of the side gate junctionless transistor in accumulation region
34. Microstructural evolution and micromechanical properties of gamma-irradiated Au ball bonds
35. In-vitro bioactivity of wollastonite materials derived from limestone and silica sand
36. Low temperature production of wollastonite from limestone and silica sand through solid-state reaction
37. A wide-band UV photodiode based on n-ZnO/p-Si heterojunctions
38. Strength distribution of Au ball bond using nanoindentation approach
39. Structural and Optical Properties of a bi-Structured ZnO Film Prepared Via Electrodeposition
40. Nanosilicate Extraction from Rice Husk Ash as Green Corrosion Inhibitor
41. The Influence of Pd-Doped Au Wire Bonding on HAZ Microstructure and Looping Profile in Micro-Electromechanical Systems (MEMS) Packaging
42. Structural phase transformations in radiolytically synthesized Al–Cu bimetallic nanoparticles
43. Review on Corrosion in Electronic Packaging Trends of Collaborative between Academia–Industry.
44. Synthesis and characterization of ZnO thin films by thermal evaporation
45. Cardinal and Ordinal Directions Approach in Investigating Arrayed Solder Joints Crack Propagation of Ball Grid Array Semiconductor Packages.
46. TEMPERATURE-INDUCED THICKNESS REDUCTION OF MICROMECHANICAL PROPERTIES OF Sn-0.7Cu SOLDER ALLOY.
47. Effect of Applied Load in the Nanoindentation of Gold Ball Bonds
48. Some thoughts on bondability and strength of gold wire bonding
49. Microhardness and Tensile Properties of a 6XXX Alloy Through Minor Additions of Zr
50. Sulfur Ingression on Encapsulated Leadframe of Discrete Semiconductor Package.
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