Search

Inspired by the double-helix structure of biological DNA, low-volume fraction and high-strength Al 2 O 3 twisted honeycomb structures with characteristics similar to those of helical structures in the z -axis were prepared by digital light processing 3D printing technology. As the twist angle increased, the compressive strength of the fabricated Al 2 O 3 structure decreased, and the deformation mechanism of the Al 2 O 3 structures gradually changed from stretching-dominated to bending-dominated, which can be predicted by the Gibson–Ashby model. The relationship between the effective elastic modulus and the volume fraction that can be modified by varying the wall thickness was described by the Pabst–Gregorova exponential relationship. The compressive strength of the Al 2 O 3 structure with a twist angle of 0° can reach 62.4 MPa at a volume fraction of 13.3%, providing guidance to optimize lightweight structures of ceramics. [ABSTRACT FROM AUTHOR]

Nano-SiO 2 porous thermal insulating material (TIM) has drawn tremendous research interests due to its advantages of low density, high porosity and low thermal conductivity. However, its long-term stability in humid environment can be severely deteriorated by the high hydrophilicity resulting from tetrahedral coordination of oxygen and capillary effect of porous structure. It is still a great challenge to cost-effectively fabricate bulk TIM with superior hydrophobicity and consequent remarkable self-cleaning capability. Herein, via an oil-in-water microemulsion treatment, we have proposed a new strategy to construct 3D superior hydrophobic nano-SiO 2 porous TIM. The polymethylhydrosiloxane-modified TIM exhibits a large water contact angle of 166°, and corresponding excellent self-cleaning characteristic while maintaining low thermal conductivity of 0.031 W/m·K. Moreover, our high hydrophobicity of TIM exhibits excellent durability under high temperature up to 400 °C, high humidity of 100%, and chemical erosions. Detailed knowledge of the physical chemistry basis of the superior hydrophobic nano-SiO 2 porous TIM can provide great opportunity to fabricate advanced self-cleaning and heat insulating devices especially targeted for harsh environments. [ABSTRACT FROM AUTHOR]

Regarding advanced 5G mobile communication, microwave dielectric ceramics are considered as the most potential materials to develop new-generation base station resonators. Herein, ZnNb 2 O 6 ceramics with ε r of approximately 24 have been prepared using the solid-state reaction method, with tailored extra ZnO of x mol% (x = 1, 2 and 3). We have for the first time applied the P-V-L chemical bond theory to investigate ZnNb 2 O 6 ceramics with ZnO doping, by exploring the relationship of dielectric properties and chemical bond characteristics. Particularly, the Raman spectra demonstrates that the full width at half maximum of υ 1 (A g) vibration mode can exhibit significant correlation with the quality factor (Q × f). To further support the experimental study, we have also conducted the first-principle calculation of electron density difference via CASTEP package, which further confirms the change of temperature coefficient of resonance frequency (τ f). Our newly designed ZnNb 2 O 6 ceramics doped with 1 mol% ZnO exhibit excellent dielectric properties, i.e., ε r = 23.74, Q × f = 102,824 GHz and τ f = −55.38 ppm/°C, which demonstrates great potential to construct miniaturized 5G base station with advanced ceramic dielectrics. [ABSTRACT FROM AUTHOR]

We have optimized a CuO-doped silver paste to significantly improve the adhesion strength of silver thick film on AlN ceramic substrate, which can be widely applied in power electronic packaging applications. Via a combination of scanning electron microscope and X-ray diffraction, we have systematically studied the silver layer morphology on top of AlN ceramic substrate, and the interphases between the silver thick film and AlN substrate. Due to the CuAl 2 O 4 intermediate formed at the silver layer/AlN interface, the adhesion strength of silver thick film can be greatly improved. Particularly, the silver paste with 3 wt% nano-CuO sintered on AlN ceramic substrate exhibits high adhesion strength of 15.3 MPa with good electrical conductivity of 0.9 mΩ/□. [ABSTRACT FROM AUTHOR]

Ceramics joining has been widely applied in MEMS sensors, microwave and imaging devices as well as other ceramic packaging applications to fabricate multifunctional ceramic components. In this study, a glass frit with gradient thermal expansion coefficient (TEC) has been applied as the bonding material to join the ceramic of Al 2 O 3 and AlN. This glass frit consists of two types of glasses with different TEC. The Al 2 O 3 and AlN ceramics have been successfully joined with this glass frit in muffle furnace at 850 °C for 1 h. The bonding strength of Al 2 O 3 /AlN ceramic joined via this glass frit exceeds 40 MPa without any cracks in the joining interface, which is much superior compared with that of conventional glass frit bonding. Our work demonstrates that the gradient-TEC glass frit bonding is an effective method to join different types of ceramics. [ABSTRACT FROM AUTHOR]

PbO–ZnO–B 2 O 3 (PZB) glass with low-melting temperature has been widely applied in microelectromechanical systems (MEMS) packaging. However, the high thermal expansion coefficient (TEC) of PZB glass usually leads to strict packaging requirements. Here, in order to achieve ideal TEC, we have introduced β -eucryptite into PZB/ β -eucryptite composite glass and optimized the composite fabrication process. Firstly, PbO:ZnO:B 2 O 3 in mol ratio of 65:15:20 was selected as glass matrix owing to its low-melting temperature and good wettability. Then, β -eucryptite ceramics with ultra-low TEC were synthesized via a facile solid-state reaction method to optimize subsequent composite TEC value. The combination of corresponding material and device characterizations suggest that the pure phase and regular columnar grains of β -eucryptite ceramic can be obtained by sintering at 1450 °C for three hours, which can result in the lowest negative TEC of α 30-300°C = −10.74 × 10−6 K−1. Furthermore, regarding the PZB/ β -eucryptite composite glasses, systematic experiments demonstrated that the β -eucryptite introduction can greatly impact the TEC of matrix glass with only negligible effect on the softening point (T s). Importantly, composite glasses with TEC of α 30-300°C = 3.26 × 10−6 K−1, T s = 380 °C and wetting angle < 30° are ideal for MEMS packaging. This work implements optimized fabrication process to obtain low-melting PZB/ β -eucryptite composite glasses with ideal TEC values, which can be envisaged to be applied in advanced MEMS packaging applications. [ABSTRACT FROM AUTHOR]

Herein, a bio-based plasticizer ketalized tung oil butyl levulinate (KTBL) was developed using methyl eleostearate, a derivative of tung oil, and butyl levulinate. KTBL can be used as an auxiliary plasticizer to partially replace traditional plasticizer. The plasticizer has a ketone structure, an ester base, and a long linear chain. It was mixed with dioctyl phthalate (DOP), and the effect of the plasticizer KTBL as an auxiliary plasticizer on the plasticization of poly(vinyl chloride) (PVC) was studied. Their compatibility and plasticizing effect were evaluated using dynamic–mechanical thermal analysis (DMA), mechanical property analysis, and thermogravimetric analysis (TGA). The results demonstrate that when the KTBL to DOP ratio is 1:1, the blended sample with KTBL exhibits superior mechanical performance compared to pure DOP, resulting in an increased elongation at break from 377.47% to 410.92%. Moreover, with the increase in KTBL content, the durability is also significantly improved. These findings suggest that KTBL can serve as an effective auxiliary plasticizer for PVC, thereby reducing the reliance on DOP. [ABSTRACT FROM AUTHOR]

Abstract Ca 0.66 Ti 0.66 Nd 0.34 Al 0.34 O 3 (CTNA) ceramics were prepared by solid-state reaction method and their sintering behavior, microwave dielectric properties, and microstructure were investigated. CTNA ceramics were examined by Raman scattering to reveal the correlation of perovskite structure with the microwave properties. It found that the area of peak A 1g (O) stretch mode reflects the quality factor Q × f value in the perovskite materials. This concludes that the oxygen octahedron plays an important role of the material's microwave performance. Sintering temperature affected the unit cell volume and the lattice parameters of the CTNA ceramics, the grain size distribution, the Gibbs free energy, the thermal expansion coefficient (CTE), and the dielectric properties (ε r , Q × f , τ f). The samples sintered at 1500 °C displayed the best dielectric constant and Q × f , as 44.94 and 41922.22 GHz, respectively. Highlights • The CTNA ceramics were sintered at different temperatures were investigated. • The thermal analysis detailed description of the stages of sintering process. • The unit cell volume is affected by the sintering temperature was confirmed by XRD. • Raman to reveal the correlation of structure with the microwave properties. • Relationship between grain size, Gibbs free energy, CTE, and dielectric properties. [ABSTRACT FROM AUTHOR]

The influence of BaO content (up to 15 mol%) on the crystallization behaviour, structure, thermal properties and microwave dielectric properties of the BaO-CaO-B 2 O 3 -SiO 2 glasses and glass-ceramics system was investigated. The glasses were produced by melting at 1400 °C and quenching into water, and the glass-ceramics were produced via heat treatment at temperatures between 750 and 800 °C. The results of X-ray diffraction analysis showed that increasing the BaO content raised the resistance of the glass against crystallization and favoured the transformation of β-CaSiO 3 and α-CaSiO 3 phases, which crystallized in the Ba-free and in low BaO content compositions, into SiO 2 and Ba 4 Si 6 O 16 , which crystallized in compositions with higher concentrations of BaO. The BaO content had little influence on the glass transition temperature ( T g ) and the linear coefficient of thermal expansion (CTE), but strongly reduced the softening point ( T s ). Even the addition of BaO as minor additives resulted in a dramatic reduction of the T s ; for example, the T s decreased from 902 °C for the Ba-free composition to 682 °C for the BaO-containing one (5%). Low values of the dielectric constant (5.9 ≤  ε r ≤ 6.63) and dielectric loss (1.12 × 10 −3 ≤ tan δ  ≤ 3.15 × 10 −3 ) were measured. [ABSTRACT FROM AUTHOR]

The influence of substitution with rare earth elements in orthorhombic Ca 0.66 Ti 0.66 R 0.34 Al 0.34 O 3 (R = Sm, Nd, La) perovskite ceramics, which were successfully produced with a solid-state reaction method, on their crystal structure (analyzed with Rietveld refinement of X-ray diffractograms and Raman spectroscopy) and on the microwave dielectric properties was investigated. The dielectric constant (ε r ) increased due to the increase of cell volume, which was a result of the increase of the ionic radius of the rare earth cations incorporated in the host lattice R 3+ . The values of the quality factors were 43620.74, 41292.71, and 38389.57 GHz for the Sm-, Nd-, and La-containing ceramics, respectively. The decrease of these values is correlated to the level of distortion of the octahedral due to the incorporation of the three different rare earth cations. The temperature coefficient of resonant frequency increased from 4.99 for the Sm-ceramics to 9.92 ppm/ ° C for the La-ceramics, attributed to the increase of cell polarization. [ABSTRACT FROM AUTHOR]

Perovskite ceramics with a formula of Ca 0.7 Ti 0.7 La 0.3 Al 0.3 O 3 (CTLA) were produced through a conventional solid-state reaction procedure following three different La 3+ -doping methods using powders of La 2 O 3 , or La 2 O 3 /Al 2 O 3 powder mixture, or LaAlO 3 . La 3+ doping favored grain growth and densification, affected the grain size distribution, and improved the dielectric properties of the produced sintered CTLA ceramics. The doping methods had a strong influence on these properties. More specifically, doping with La 2 O 3 and La 2 O 3 /Al 2 O 3 resulted in formation of solid solution, while a secondary phase formed in the CTLA ceramics doped with LaAlO 3 , which caused a coarsening of the microstructure and lowered the La 3+ doping effects on the dielectric properties. The experimental results suggest that La 3+ doping improves the dielectric properties of the sintered CTLA perovskite ceramics, which are further enhanced by doping with Al 3+ ions in small amounts. However, further increase of Al 3+ ions content jeopardizes them. [ABSTRACT FROM AUTHOR]

Ca 0.66 Ti 0.66 Sm 0.34 Al 0.34 O 3 (CTSA) ceramics were produced using a solid-state reaction method, and their sintering behavior, microwave dielectric properties, and microstructure were investigated. Sintering temperature affected the unit cell volume and the lattice parameters of the CTSA ceramics as well as the grain size distribution, the Gibbs free energy, the thermal expansion coefficient (CTE), and the dielectric properties (ε r , Q×f, τ f ). The samples sintered at 1500 °C displayed the best dielectric constant and Q×f, as 42.49 and 46069.86 GHz, respectively. [ABSTRACT FROM AUTHOR]

BaO-Sm 2 O 3 -5TiO 2 (BST5) ceramics with NdAlO 3 additions of up to 15 wt% were produced with a solid state reaction method, and their structural and microwave dielectric properties were determined. Experimental results showed that NdAlO 3 neither merged nor altered the orthorhombic tungsten bronze structure of the main phase of the produced ceramics (except for a shrinkage in the crystal lattice), but it was segregated in distinct grains in the microstructure of the produced ceramics. However, the amount of NdAlO 3 strongly influenced the densification and the microstructure (i.e. grain shape and size) of the produced ceramics. Analysis of the experimental results suggests that the microstructural features can be correlated to the dielectric properties of these ceramics. Accordingly, the dielectric constant (ε r ) and the temperature coefficient of resonant frequency (τ f ) of the produced BLT5 ceramics can be tuned with the amount of NdAlO 3 additions and the sintering process parameters. The best dielectric properties were achieved for BaO-Sm 2 O 3 -5TiO 2 ceramics with 7.5% NdAlO 3 (ε r =73.22, Q×f =10,300 GHz, and τ f =−1.05 ppm/°C). [ABSTRACT FROM AUTHOR]

Surface metallization of aluminum nitride is performed by a reactively thick film method. A layer of copper film is deposited on the surface of AlN ceramics. The morphology and composition of the metalized copper layer on ceramic substrate were investigated via scanning electron microscope (SEM) and X-ray diffraction (XRD). The interface layer between copper film and AlN substrate was examined through SEM, XRD and EDS. Reaction phases, Cu 2 O and intermediate phases (CuAlO 2 and CuAl 2 O 4 ), were detected at the interface layer. Subsequently, the formation process of these phases at the interface layer was discussed. And consequently, the relation within reaction phases and bonding strength was observed. Reaction phases play a key role in increasing bonding strength. The effect of these phases such as Cu 2 O and intermediate phases (CuAlO 2 and CuAl 2 O 4 ) on the mechanical property was discussed. Results show that the presence of Cu 2 O particles are detrimental to bonding strength. However, spinel CuAl 2 O 4 and isolated CuAlO 2 laminates at the interface layer can increase the bonding strength. The experimental results suggest that this thick film method is a useful technology for various metal-ceramics bonding. [ABSTRACT FROM AUTHOR]

Abstract: A kind of polymer composite was fabricated using polystyrene as the matrix and Si3N4 powder as filler employing the method of heat press molding. Microstructure, thermal conductivity and dielectric constant of the Si3N4 filled composite were evaluated. The effect of the volume fraction of Si3N4, the particle size of the polystyrene matrix and the silane treatment of Si3N4 filler on the thermal conductivity of the composite was investigated; dielectric constant of the composite was evaluated. The main factors that affect the thermal conductivity of the composite were confirmed through theoretical analyzing of the experimental data and the thermal conductivity model. Experimental results show that with the filler content increasing, a thermally conductive network is formed in the composites, thus the thermal conductivity of the composite increases rapidly. The composites experience a highest thermal conductivity of 3.0W/mK when the volume fraction of the filler reaches 40%. The increasing of thermal conductivity is dominated by the ease of forming a thermal conductive network. A larger polystyrene particle size, a higher Si3N4 filler content and the silane treatment of the filler have a beneficial effect on improving the thermal conductivity. The dielectric constant increases with the content of Si3N4 filler, however, it remains at a relatively low lever (<4, at 1MHz). [Copyright &y& Elsevier]

Reaction sialon suspensions were prepared using 3-wt.% KD1 (a polyester/polyamine condensation copolymer) as dispersant in organic media of 60-vol.% methyletheylketone and 40-vol.% ethanol. Different homogenizing procedures were used and compared, such as: high energetic planetary milling, low energetic ball milling and ultrasonic disaggregation. The effect of different homogenizing routes and solids loading on the rheology of suspensions and on the properties of slip casting green bodies has been studied. The differences observed among the various mixing procedures could be attributed to the different degrees of disaggregation and therefore to different fractions of surface coverage of the reaction sialon powders by the dispersant. [Copyright &y& Elsevier]

For new-generation miniaturized and high-frequency electronics, it is of vital importance to develop advanced electronic packaging materials, which combine high electromagnetic interference (EMI) shielding effectiveness (SE) and efficient thermal management capabilities, including heat absorption, thermal conductivity (TC) and heat dissipation. However, high EMI SE and efficient thermal management usually cannot complement each other for the same packaging material, because EMI shielding devices convert electromagnetic radiation directly into heat consumption, leading to consequent severe challenge to dispose heat dissipation. Herein, we have newly developed a high-performance phase change composites, in which MXene is confined in shape-stabilized phase change material (PCM) for simultaneous achievement of high EMI SE and efficient thermal management. Regarding high EMI, MXene can effectively shield electromagnetic radiation by converting the radiation into heat consumption. As for thermal management, PCM enables efficient heat absorption via the phase change process, and MXene enhances the thermal conductivity (TC) of MXene/PCM composite to facilitate heat dissipation. As a result, our developed MXene/PCM composite can achieve a high EMI SE of 64.7 dB in X-band, with an improved TC of 0.74 W/m·K. Furthermore, the interlayer capillary effect of MXene inhibits the leakage of liquid PCM during the solid-liquid phase transition, which can maintain the PCM shape stability. Our newly-designed shape-stabilized MXene/PCM composites with high EMI SE and large TC shed new light on designing EMI shielding materials with prolonged exposure to electromagnetic radiation, which can be envisioned to exhibit vast implications for advanced new-generation miniaturized and high-frequency electronics. [Display omitted] [ABSTRACT FROM AUTHOR]

The strong covalent bonding of SiC makes it difficult to be fully sintered using conventional sintering techniques. Therefore, electrical current-assisted sintering techniques such as spark plasma sintering are needed to sinter SiC. The finite numerical simulations have been generally used to predict and guide sintering processes of ceramics (i.e.TiC,AlO 3). In this work, the numerical simulations of the temperature distribution, electrical field and thermal field on the porous SiC cylindrical samples by Comsol were investigated in details. The influence of porosity on the temperature distribution and electrical field distribution of the SiC samples were analyzed. Both the maximum current density (1.19 × 107A/m2) and the maximum temperature (2030 °C) of the SPS device occurred at the punch/spacer interface. The temperature values at the centre of the samples were proportional to the porosity, and the temperatures at the center of the samples increased from ∼1960 °C to ∼2010 °C at t = 2000s, with the porosity increasing from 1% to 60%. The uniformity of the temperature distribution deteriorated as the porosity increases, and the temperature gradients between the center and edge of the samples with the porosity of 1% and 60%, were ∼80 °C and ∼130 °C at t = 2000s, respectively. [ABSTRACT FROM AUTHOR]

In this paper, an insulating film was successfully prepared by sintering 35 wt % CaO-15 wt % Al2O3-10 wt % B2O3-40 wt % SiO2 glass at 875 °C. After sintering, the main component of the insulating film was glass-ceramics. The main crystal phase was CaAl2Si2O8, and the crystallization activation energy was 189.76 kJ/mol. After preparing the insulating film, its color turned yellow, and the diffusion of Ag was found by XPS and XRD data. When the temperature increased to 875 °C, the color of the insulating film became lighter, and the silver content decreased. The adhesion of the multilayer structure could reach 875 N. The dielectric constant of the insulating film in the multilayer structure was approximately 5, and the dielectric loss was 0.0011. After sintering, the dielectric strength of the insulating film could reach 13.11 kV/mm, which fully meets the requirements of a complex packaging structure. [ABSTRACT FROM AUTHOR]

Herein, Ce3+ and Ce3+/Dy3+ co-doped Ca 3 Al 2 O 6 phosphors have been designed and synthesized via a facile citrate-based sol-gel technique, and their structural, photoluminescence properties and energy transfer phenomenon were investigated comprehensively. The XRD analysis indicated that pure Ca 3 Al 2 O 6 phase can be synthesized at low temperature (1000 °C) for merely 2 h. The photoluminescence spectra showed the dominant emission of Ce3+ singly doped phosphors is located in the blue region even at low Ce3+ doping level, which indeed favors the energy transfer from Ce3+ to other luminescent centers. When Dy3+ is co-doped into Ca 3 Al 2 O 6 :Ce3+ phosphors, the remarkable sensitizing effect of Ce3+ on Dy3+ is validated by comparatively analyzing the excitation, emission spectra and average lifetimes of the series of samples. Through the concentration quenching theory, the critical distance between Ce3+ and Dy3+ is calculated to be 13.50 Å. Furthermore, the energy transfer mechanism between them is most likely ascribed to electric dipole-dipole interaction. In virtue of the variation of the emission intensities of Ce3+ and Dy3+, the emitting colors of Ca 3 Al 2 O 6 :Ce3+, Dy3+ phosphors can realize tunable luminescence from deep blue to bluish-white region through controlling the Dy3+ content. Based on these analysis, Ca 3 Al 2 O 6 :Ce3+, Dy3+ phosphors could potentially be applied as a single-phase color-tunable phosphors pumped by near-ultraviolet (n-UV) radiation. • Developed a facile sol-gel method to prepare successfully Ca 3 Al 2 O 6 compound. • The blue emission of as-prepared Ca 3 Al 2 O 6 :Ce3+ phosphors dominates, which favors the energy transfer process. • The possible mechanism for the dominance of blue emission was discussed. • The energy transfer phenomenon in Ca 3 Al 2 O 6 :Ce3+, Dy3+ phosphors was investigated in detailed. • Ca 3 Al 2 O 6 :Ce3+, Dy3+ can serve as a single-phase color-tunable phosphors excited by near-ultraviolet radiation. [ABSTRACT FROM AUTHOR]

BaO-Sm 2 O 3 –5TiO 2 (BST) added by Al 2 O 3 was prepared by solid-state reaction method. The main phase is Ba 3.99 Sm 9.34 Ti 18 O 54 of orthorhombic tungsten bronze structure, and the secondary phase is Ba 1.18 Al 1.90 Ti 6.09 O 16 of tetragonal structure, which has two types of grains: one is grey and cubic, and the other is white and quasi-rectangular. Microstructure was characterized by XRD, SEM, and Raman spectra. Micromechanical properties of different phases were assessed by nanoindentation and micro-scratch tests with Berkovich indenter. Volume fractions of different phases obtained by statistical analysis of grid indentation are in good agreement with those obtained by XRD analysis. Vickers hardness method is more appropriate for the determination of the fracture toughness of dielectric ceramics. BST ceramic without addition of Al 2 O 3 has better mechanical properties than BST-A with addition of Al 2 O 3 , indicating that addition of Al 2 O 3 impairs the micromechanical properties of dielectric ceramics. [ABSTRACT FROM AUTHOR]

Bio-based vitrimers present a promising solution to the issues associated with non-renewable and non-recyclable attributes of traditional thermosetting resins, showcasing extensive potential for diverse applications. However, their broader adoption has been hindered by the requirement for catalyst inclusion during the synthesis process. In this study, a cardanol-based curing agent with poly-hydroxy and tertiary amine structures was prepared by a clean synthetic method under the theory of click chemistry. The reaction of a cardanol-based curing agent with diglycidyl ether of bisphenol A formed catalyst-free, self-healing, and recyclable bio-based vitrimers. The poly-hydroxy and tertiary amine structures in the vitrimers promoted the curing of epoxy-carboxylic acid in the cross-linked network and served as internal catalysts of dynamic transesterification. In the absence of catalysts, the vitrimers network can achieve topological network rearrangement through dynamic transesterification, exhibiting excellent reprocessing performance. Moreover, the vitrimers exhibited faster stress relaxation (1500 s at 180 °C), lower activation energy (92.29 kJ·mol−1) and the tensile strength of the recycled material reached almost 100% of the original sample. This work offers a new method for preparing cardanol-based epoxy vitrimers that be used to make coatings, hydrogels, biomaterials, adhesives, and commodity plastics in the future. [ABSTRACT FROM AUTHOR]

The high integration density of microelectronic devices leads to local heat accumulation, and effective heat dissipation and signal transmission of packaging materials have become the primary issues to be solved. However, existing polymer materials have difficulty meeting the requirements due to their unsatisfactory thermal conductivity and thermal expansion properties. In this work, we proposed the use of digital light processing (DLP) printing technology to construct a triply periodic minimum surface (TPMS) skeleton, and a continuous and efficient heat conduction path was successfully constructed in epoxy resin by impregnating h-BN on the skeleton surface. When the loading of h-BN was 20 vol%, the thermal conductivity of the TPMS(SiO 2)@BN/EP(BN) composites was 1.86 W/(m·K), which was 786 % higher than that of pure epoxy resin. In addition, the thermal expansion coefficient of the composites decreased by more than 70 %. At the test frequencies of 3∼10 MHz, the composites showed stable dielectric properties, and the dielectric constant was always maintained in a low range, between 3.85 and 4.15. This work has realized the transformation of the method for constructing a heat conduction path from disordered to ordered and from random to repeatable. This provides a new strategy for the selection of microelectronic packaging materials. [ABSTRACT FROM AUTHOR]

This paper presents that polyethylene glycol (PEG) synthesizes a form-stable phase change material (FS-PCM) with high thermal conductivity and considerable heat storage density. PEG was confined to the chain structure of epoxy resin (EP) via high-temperature melt blending and curing, which solves the leakage problem of PCMs during phase transformation. In order to increase the thermal conductivity and stability of the PEG/EP while maintaining good heat storage capacity and insulation ability, a low loading of reticulated porous Al 2 O 3 ceramic (RPC) was introduced into the PEG/EP matrix. RPC increases the thermal conductivity of FS-PCM by 5.5 times and the heat storage rate by 4 times. In addition, FS-PCM filled with 13.8 vol% RPCs has a coefficient of thermal expansion (CTE) of 80 ppm/K at 85–150 °C -a decrease of 62% over the matrix. Furthermore, the BN network is formed on RPC by vacuum impregnation technology, which further improves the thermal conductivity. This novel FS-PCM has excellent comprehensive properties and does not need for case package, indicating great prospects in thermal management and thermal storage. [ABSTRACT FROM AUTHOR]

This work focused on the influence of hydrogen content on the microstructure and mechanical properties of ER5183 Al-Mg-Mn alloy wires for aluminum alloy welding. The hydrogen content of the ER5183 wires was measured, the macroscopic and microscopic morphologies of fractures were observed as well as the microstructure of the wires, and the tensile strength of the wires was also tested and investigated. The experimental results demonstrated three typical irregular macroscopic fractures of the wires appeared during the drawing process when the hydrogen content exceeded 0.23 μg/g. In the meantime, the aggregated pores were observed in the microstructure of the ϕ5.2 mm wire with the hydrogen content of 0.38 μg/g. Such defects may become the origin of cracks in subsequent processing and tensile tests. Moreover, higher hydrogen content in the ϕ5.2 mm welding wire will bring obvious changes in the fracture surface, which are internal cracks and micropores replacing the original uniform and compact dimples. With the higher hydrogen content, the tensile strength and plastic strain rate of ϕ1.2 mm wires would decrease. At the same time, unstable crack propagation would occur during the process of plastic deformation, leading to fracture. Considering the mechanical properties and microstructure, the hydrogen content of the ER5183 wires should be controlled below 0.23 μg/g. [ABSTRACT FROM AUTHOR]

Different microstructures were obtained under various thermal conditions by adjusting the heat treatment parameters of the Cr-Co-Ni-Mo series of ultra-high strength stainless steel. The effect of organizational evolution on the stress corrosion cracking (SCC) of the Cr-Co-Ni-Mo series of ultra-high strength stainless steel was investigated using potentiodynamic polarization curves, electrochemical impedance spectroscopy (EIS), transmission electron microscopy (TEM), scanning electron microscopy (SEM) and other test methods in combination with slow strain rate tensile tests (SSRTs). The results show that the Mo- and Cr-rich clusters and precipitation of the Laves phase reduce the corrosion resistance, while increasing the austenite content can improve the corrosion resistance. The Cr-Co-Ni-Mo series of ultra-high strength stainless steel has a high SCC resistance after quenching at 1080 °C and undergoing deep cooling (DC) treatment at −73 °C. With increasing holding time, the strength of the underaged and peak-aged specimens increases, but the passivation and SCC resistance decreases. At the overaged temperature, the specimen has good SCC resistance after a short holding time, which is attributed to its higher austenite content and lower dislocation density. As a stable hydrogen trap in steel, austenite effectively improves the SCC resistance of steel. However, under the coupled action of hydrogen and stress, martensitic transformation occurs due to the decrease in the lamination energy of austenite, and the weak martensitic interface becomes the preferred location for crack initiation and propagation. [ABSTRACT FROM AUTHOR]

Abstract: The crystal structure and photoluminescence properties of Eu2+ doped Li2Ca0.7Sr0.3SiO4 phosphors were investigated. The Li2Ca0.7Sr0.3SiO4 is not an alloy between the tetragonal Li2CaSiO4 and hexagonal Li2SrSiO4 but crystallizes in orthorhombic structure similar to Li2(CaSr)SiO4. Photoluminescence properties of the Li2Ca0.7Sr0.3SiO4:Eu2+ phosphors, summarized in effective excitation in the UV region, strong emission in the blue light range (with a peak at 427nm) and the CIE chromaticity coordinate (0.154, 0.038), indicate this phosphor has great potential in UV-chip pumped white LEDs. White light output by mixing the Li2Ca0.7Sr0.3SiO4:Eu2+ blue and Li2SrSiO4:Eu2+ yellow phosphor was attempted. With proper molar ratio of these two compound phosphors, warm white light with CIE chromaticity coordinate close to that of the nature white light (0.33, 0.33) and color temperature about 5000K was obtained. The results indicated that the Li2Ca0.7Sr0.3SiO4:Eu2+ may become an important phosphor candidate for ultra-violet chip pumped and multi-phosphors converted white LEDs. [Copyright &y& Elsevier]

Dense AlN ceramics with a thermal conductivity of 180W/m·K were obtained at the sintering temperature of 1750 °C using CaF2 and YF3 as additives. At temperatures below 1650 °C, the shrinkage of AlN ceramics is promoted by liquid (Ca,Y)F2 and Ca12Al14O32F2. Liquid CaYAlO4 mainly improves the densification of the sample when the sintering temperature increases to 1750 °C. The formation of liquid (Ca,Y)F2 at a relatively low temperature results in homogeneous YF3 distribution around the AlN particles, which benefits the removal of oxygen impurity in the AlN lattice, and thus a higher thermal conductivity. [Copyright &y& Elsevier]

• Polymer-matrix composites. • 3-Dimensional reinforcement. • Thermal properties. • Syntactic foams. • Hollow glass microspheres. Electronic packaging materials with low dielectric constant (D k) and high thermal conductivity (TC) are of vital importance in mitigating signal delay and enhancing heat dissipation efficiency in modern electronics. However, low D k and high TC are difficult to complement each other, because high TC filler usually possesses a high D k. Herein, we have newly designed a composite material simultaneously with low D k and high TC through hollow glass microspheres (HGMs), boron nitride particles, epoxy resin and reticulated porous ceramic (RPC). The composite material prepared by sintering HGMs and RPC is more effective in improving TC while keeping low D k. Specifically, the D k of the newly designed composite is lower than 3.0 with a large TC of 0.96 W/m·K. This new epoxy-matrix composite with both low D k and high TC can shed new light on designing electronic packaging materials for advanced miniaturized electronics. [ABSTRACT FROM AUTHOR]

A new composite structure (glass fiber assembly-filled honeycomb sandwich panel) is prepared in order to improve the acoustic properties. Effect of glass fiber assembly with different filling shapes (random and fiber ball), fiber diameter, fiber content and air-layer on acoustic properties are explored. Sound absorption coefficient (SAC) and sound transmission loss (STL) are determined by a B&K impedance tube. The experiment results indicate that the first resonance frequency of SAC disappears along with the improvement of the second resonance frequency by reducing the fiber diameter or increasing the fiber content. STL can be improved by the increase of the fiber content. Random glass fiber assembly with the fine fibers has the best STL in the all testing samples. The advantage of glass fiber assembly for improving the STL of honeycomb sandwich panel is particularly clear at frequencies below 4.5 kHz. Especially, the STL difference reaches the maximum at around 20 dB at frequencies below 3.0 kHz. [ABSTRACT FROM AUTHOR]

• MXene/AgNWs aerogels with interpenetrating double-network structure were fabricated. • The porous structure contributes to higher attenuation of electromagnetic waves. • 3D network provides channel for electron and phonon transmission in epoxy composites. • The composites possess remarkable EMI SE and thermal conductivity. The novel multifunctional materials with anti-electromagnetic interference (EMI) and effective thermal management are ideal for modern electronic industry. Generally, the EMI shielding effectiveness (SE) and thermal conductivity (TC) of materials can be effectively enhanced by compounding with high electrically and thermally conductive fillers. However, it seems that the high-performance cannot be compensated without sacrificing the high fillers loading. Herein, from one-dimensional silver nanowires (AgNWs) and two-dimensional MXene, three-dimensional MXene/AgNWs aerogels were designed as electric and heat transferring skeletons for epoxy nanocomposites by directional-freezing and freeze-drying methods. The resultant MXene/AgNWs/Epoxy nanocomposites with a low MXene/AgNWs content of 8.2 wt% combine a high electrical conductivity of 1532 S/m, and an exceptional EMI SE value of 94.1 dB with 3 mm thickness at the X-band frequency, as well as an improved TC of 2.34 W/m·K. The fabricated MXene/AgNWs/Epoxy nanocomposites possess excellent comprehensive properties enable valuable applications in electronic devices for EMI shielding and thermal management. [ABSTRACT FROM AUTHOR]