29 results on '"Spelt, Jan K."'
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2. Predicting delamination in multilayer composite circuit boards with bonded microelectronic components
3. Jet properties and mixing chamber flow in a high-pressure abrasive slurry jet: part II—machining rates and CFD modeling
4. Jet properties and mixing chamber flow in a high-pressure abrasive slurry jet: part I—measurement of jet and chamber conditions
5. Strain-rate dependent influence of adherend stiffness on fracture load prediction of BGA solder joints
6. Fracture load prediction of BGA solder joints: Cohesive zone modeling and experimental verification
7. Abrasive waterjet micro-machining of channels in metals: Model to predict high aspect-ratio channel profiles for submerged and unsubmerged machining
8. Comparison of solder joint fracture behavior in Arcan and DCB specimens
9. Effect of processing parameters on fracture toughness of lead-free solder joints
10. Finite element continuum modeling of vibrationally-fluidized granular flows
11. Abrasive waterjet micro-machining of channels in metals: Comparison between machining in air and submerged in water
12. Particle impact velocities in a vibrationally fluidized granular flow: Measurements and discrete element predictions
13. Influence of process parameters on average particle speeds in a vibratory finisher
14. Bulk mass flow in a vibratory finisher: mechanisms and effect of process parameters
15. High pressure abrasive slurry jet micro-machining using slurry entrainment
16. Effect of Solder Joint Length on Fracture Under Bending
17. Effect of geometry on the fracture behavior of lead-free solder joints
18. Mixed-mode fracture load prediction in lead-free solder joints
19. Fracture load prediction of lead-free solder joints
20. Inertial particle separation in helical channels: A calibrated numerical analysis
21. Lab on a rod: Size-based particle separation and sorting in a helical channel
22. Analytical elasto-creep model of interfacial thermal stresses and strains in trilayer assemblies
23. Ultrasonic couplants for acoustic microscopy of low speed materials
24. Jet properties and mixing chamber flow in a high-pressure abrasive slurry jet: part II—machining rates and CFD modeling
25. Bending strength of adhesive joints in microelectronic components: Comparison of edge-bonding and underfilling
26. Effect of adhesive fillet geometry on bond strength between microelectronic components and composite circuit boards
27. Effect of Solder Joint Length on Fracture Under Bending
28. High pressure abrasive slurry jet micro-machining using slurry entrainment
29. 'BGA Solder Joint Fracture as a Function of Strain Rate and PCB Rigidity': SMTA International Conference on Soldering and Reliability
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