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Carbon fiber reinforced aluminum matrix composites (C f /Al) are widely used in various industries. But they are difficult to join because it is hard to realize the wetting and continuity of the carbon fiber in joint. To solve this problem, C f /Al are joined by ultrasonic soldering in this work. Results show that the C f /Al can be wetted within 5 s under ultrasonic. Transmission electron microscope result shows that the surface of the wetted carbon fiber is covered by an amorphous-nanocrystalline layer, which is formed due to the high solder velocity, temperature and pressure caused by cavitation. Carbon fibers flow into the solder after the Al matrix is eroded, guaranteeing its continuity in the joint. Limited carbon fibers flow into the joint at low ultrasonic power of 333.3 W, while a fully carbon fiber reinforced composite joint is obtained at 1000 W. The soldered joints have higher strength than the C f /Al substrate, and its formation mechanism is discussed. [ABSTRACT FROM AUTHOR]

Sealing problems, subsequent cleaning processes and poor force transmission effect etc. series of problems which strongly restrict the development and application of traditional medium pressure-based sheet forming technology. To overcome these problems, the magnetorheological fluid (MRF) can be used as the alternative force transmission medium. In this study, the deep drawing process of a 304 stainless steel sheet using MRF was investigated. The die cavity was filled with MRF and electric current was used to quantitatively adjust the magnetic fields distribution, which then controls the deformation behavior of the forming sheet. As compared to the conventional deep drawing process, experimental results clearly show that significant improvement in the produced sample quality was obtained when using the MRF with the electric current of 2 A. These improvements include: the height of the boundary circle reduces by 20%, the wall thickness distribution is more uniform, the rebound ratio correspondingly reduces from 9.6% to 0.67%, and the degree of sticking mode and the size precision are significantly increased. The results of this study provide scientific guidance to solve the bottleneck in the traditional deep drawing forming technology. The potential applications of the MRF-based new deep drawing technology to improve the product quality were explored. [ABSTRACT FROM AUTHOR]

The method of embedded cold-pressing joining could achieve the joining of sheets with different thickness and the joining of dissimilar sheets. Besides, it could meet the lightweight request easily. This article expounded the joining mechanism of this method deeply. To expound the joining mechanism of this method, this article has taken aluminum and stainless steel as examples. In addition, numerical stimulation studies of different hole types’ connecting processes had shown that it was easier to reach plastic yield conditions for aluminum and deform it under the same load conditions. The deformation achieved was significantly greater than that for stainless steel. The width increment of the joining parts increased with the increase of the load pressures; however, the thickness changes of the joining parts behaved in an opposite manner. When the pressing volume of the punch reached 2.4 mm, with the width increment of aluminum sheets of the square hole reaching 2.78 mm, which was the maximum width increment, followed by the hexagonal hole, and the round hole being a minimum. Hole type had a small influence on the width of stainless steel sheets. The experimental results of different hole type joining process indicated that compared with round hole and hexagonal hole, the filling of the square hole was relatively difficult. In case of unreasonable process schemes, defects such as “fake joining,” “offset loading” and “hole deformation” would occur. Thus, this article provided a theoretical basis for the scheme establishment and quality control of the embedded cold-pressing joining process. [ABSTRACT FROM PUBLISHER]

• DFT and AIMD were combined to study the oxidation mechanism of CrN. • Surface energy of CrN low-index surface was calculated. • The adsorption configuration and electronic structure were analyzed. • The dynamics process of O 2 dissociation and adsorption was studied by AIMD. • The PDOS change during AIMD simulation were analyzed. [Display omitted] Density functional theory (DFT) calculation and ab initio molecular dynamics (AIMD) are combined to investigate the CrN oxidation mechanism. The surface energy, adsorption configuration and electronic structure of oxygen molecule and atom on the CrN (100) surface are investigated through DFT calculation. AIMD calculation is used to investigate the geometric configuration and electronic structure evolution of O 2 molecule adsorption and dissociation process at 1073 K. Results show that the (100) surface has the lowest surface energy. The top site of Cr atom is the most stable adsorption site for oxygen molecules and atoms, and the adsorption energy values are −4.276 eV and −4.975 eV, respectively. Charge density difference results show that both oxygen molecule and atom undergo charge transfer with the Cr atom. The O atom gains electrons while the Cr atom loses electrons. Results of partial density of states show that the Cr O bond is formed due to the hybridization between the O-p and Cr-d orbitals. At 1073 K, AIMD results show that the O 2 molecule automatically dissociates into O atoms, and the dissociated O atoms form stable covalent bonds with the surface Cr atom. The hybridization between the O-p and Cr-d orbitals gradually increases, thereby forming stable adsorption. [ABSTRACT FROM AUTHOR]

Density functional theory (DFT) and ab initio molecular dynamics (AIMD) calculations are combined to study the α-Ti oxidation mechanism on atomic scale. The most and second stable adsorption site for O atoms on the surface layer is FCC and HCP site, respectively. The most stable adsorption site of subsurface layer is octahedral site. O atoms all gain electrons from adsorbed Ti atoms and the Ti–O bonds are mainly formed by the hybridization between O-p and Ti-d orbitals. At both 303 K and 873 K, AIMD results show that O 2 molecule gradually dissociate into O atoms on α-Ti (0001) surface and then adsorb on the surface. The increase of temperature accelerates the dissociation rate of O 2 molecule. During the formation of Ti–O bond, O and Ti atom gain and lose electrons, respectively. The partial density of states evolution results show that the Ti–O bond is formed by the gradually strengthened hybridization between O-p and Ti-d orbitals. At 303 K, α-Ti (0001) surface can form a dense oxide film. But a discontinuous and loose oxide film is formed at 873 K and O atoms can penetrate into the octahedral and tetrahedral sites of the subsurface layer. • DFT and AIMD were combined to reveal the α-Ti oxidation mechanism. • Adsorption behavior of O atom on surface and subsurface was studied by DFT. • The dynamic dissociation and adsorption process of O 2 was investigated by AIMD. • The temperature effect on the O 2 dissociation behavior was studied by AIMD. • Electronic structure during DFT and AIMD calculation were investigated. [ABSTRACT FROM AUTHOR]

This work focused on the microstructure, morphology and thermal stability of a MoNbTaTiV refractory high-entropy alloy synthesized by mechanical alloying. The mechanically alloyed powder with a uniform chemical distribution and an average grain size of less than 15 nm was obtained after 40 h milling process. With a refinement of the grain size and an increase of the lattice strain, the milled powder transformed from large and inhomogeneous to refined and homogeneous. The mechanically alloyed powder exhibited excellent thermal stability at 1200 °C. • MoNbTaTiV refractory high-entropy alloy was synthesized by mechanical alloying. • The alloyed powder presented a uniform chemical distribution and an average grain size of less than 15 nm. • The alloyed powder exhibited refinement and homogeneous size distribution. • The alloyed powder maintained bcc phase and nanoscale grain size at 1200 °C. [ABSTRACT FROM AUTHOR]