1. Experimental And Numerical Characterization Of PCB-Embedded Power Dies Using Solderless Pressed Metal Foam
- Author
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BENSEBAA, Said, Bouarroudj-Berkani, Mounira, Berkani, Mounira, Lefebvre, Stéphane, Petit, Mickael, Schmitt, Nicolas, Systèmes et Applications des Technologies de l'Information et de l'Energie (SATIE), École normale supérieure - Rennes (ENS Rennes)-Conservatoire National des Arts et Métiers [CNAM] (CNAM)-Université Paris-Saclay-Centre National de la Recherche Scientifique (CNRS)-Ecole Normale Supérieure Paris-Saclay (ENS Paris Saclay)-Université Gustave Eiffel-CY Cergy Paris Université (CY), Ecole Normale Supérieure Paris-Saclay (ENS Paris Saclay), Université Paris-Est Créteil Val-de-Marne - Paris 12 (UPEC UP12), Conservatoire National des Arts et Métiers [CNAM] (CNAM), Laboratoire de mécanique et technologie (LMT), Université Paris-Saclay-Centre National de la Recherche Scientifique (CNRS)-Ecole Normale Supérieure Paris-Saclay (ENS Paris Saclay), Institut national supérieur du professorat et de l'éducation - Académie de Créteil (UPEC INSPÉ Créteil), École normale supérieure - Rennes (ENS Rennes)-Conservatoire National des Arts et Métiers [CNAM] (CNAM), and HESAM Université - Communauté d'universités et d'établissements Hautes écoles Sorbonne Arts et métiers université (HESAM)-HESAM Université - Communauté d'universités et d'établissements Hautes écoles Sorbonne Arts et métiers université (HESAM)-Université Paris-Saclay-Centre National de la Recherche Scientifique (CNRS)-Ecole Normale Supérieure Paris-Saclay (ENS Paris Saclay)-Université Gustave Eiffel-CY Cergy Paris Université (CY)
- Subjects
010302 applied physics ,Wire bonding ,business.product_category ,Materials science ,[SPI.NRJ]Engineering Sciences [physics]/Electric power ,02 engineering and technology ,Metal foam ,021001 nanoscience & nanotechnology ,01 natural sciences ,Electrical contacts ,Characterization (materials science) ,Power (physics) ,[SPI]Engineering Sciences [physics] ,Soldering ,0103 physical sciences ,Thermal ,Die (manufacturing) ,Composite material ,0210 nano-technology ,business ,ComputingMilieux_MISCELLANEOUS - Abstract
A new process of embedding power die on PCB is presented which consists on removing wire bonding and solder and using only a pressed metal foam to connect the top and bottom sides of the die. First, the manufacturing process is described. Then the effective electrical, thermal and mechanical properties of the mixture made of the foam impregnated by resin insuring the contacts between die and PCB are identified experimentally and numerically. Finally, 3D FEM simulations are performed to estimate the electrical contacts resistances between foam and pads of the die within the package.
- Published
- 2020