Search

2D transition metal dichalcogenides (TMDs) for advanced logic transistor technologies are deposited by various modifications of the chemical vapor deposition (CVD) method using a wide variety of precursors. Being a major electrical performance limiter, the TMD crystal grain size strongly differs between the various CVD precursor chemistries from nano‐ to millimeter‐sized crystals. However, it remains unclear how the CVD precursor chemistry affects the nucleation density and resulting TMD crystal grain size. This work postulates guiding principles to design a CVD process for highly crystalline TMD deposition using a quantitative analytical model benchmarked against the literature. The TMD nucleation density reduces favorably under low supersaturation conditions where the metal precursor sorption on the starting surface is reversible and the corresponding metal precursor desorption rate exceeds the overall deposition rate. Such reversible precursor adsorption guarantees efficient long‐range gas‐phase lateral diffusion of precursor species in addition to short‐range surface diffusion, which vitally increases crystal grain size. The proposed model explains the large spread in experimentally observed TMD nucleation densities and crystal grain sizes for state‐of‐the‐art CVD chemistries. Ultimately, it empowers the reader to interpret and modulate precursor adsorption and diffusion reactions through designing CVD precursor chemistries. [ABSTRACT FROM AUTHOR]

Atomically thin, 2D semiconductors, such as transition metal dichalcogenides, complement silicon in ultra‐scaled nano‐electronic devices. However, the semiconductor and its interfaces become increasingly more difficult to characterize chemically and electrically. Conventional methodologies, including scanning probe microscopies, fail to capture insight into the chemical and electronic nature of the semiconductor, albeit vital to understand its impact on the semiconductor performance. Therefore, this work presents a unique and universal in situ approach combining time‐of‐flight secondary ion mass spectrometry and atomic force microscopy to map chemical differences between regions of different electrical conductivity in epitaxially deposited tungsten disulfide (WS2) on sapphire substrates. Surprisingly, WS2 regions of lower electrical conductivity possess a larger amount of sulfur compared to regions with higher conductivity, for which oxygen is also detected. Such difference in chemical composition likely roots from the non‐homogeneously terminated sapphire starting surface, altering the WS2 nucleation behavior and associated defect formation between neighboring sapphire terraces. These resulting sapphire terrace‐dependent doping effects in the WS2 hamper its electrical conductivity. Thus, accurate chemical assignment at a sub‐micrometer lateral resolution of atomically thin 2D semiconductors is vital to achieve a more detailed understanding on how the growth behavior affects the electrical properties. [ABSTRACT FROM AUTHOR]

• Dual gated WS 2 MOSCAP devices were fabricated to measure both n/p-branch C-V response. • Frequency/temperature dependent CV curves were correlated with WS 2 MOSCAP simulation. • Interface trap density across the bandgap (D IT (E)) is extracted for 2ML WS 2. Dual gated 2ML WS 2 MOS Capacitors have been fabricated with capacitance values as high as 2.7uF/cm2 (with single sheet charge centroid assumption for the WS 2 channel). Frequency and temperature dependent C-V measurements were correlated with simulations to extract the interface trap density-energy (D IT (E)) profile. We observe an exponentially decaying defect distribution from the conduction band (E C) edge with a magnitude of 8 × 1013 cm−2 eV−1 and an inverse slope of 0.12 eV and a similar distribution with a peak magnitude of 1.2 × 1014 cm−2 eV−1 from the valence band (E V) edge with an inverse slope of 0.12 eV. [ABSTRACT FROM AUTHOR]