1. Subsurface damage in polishing–annealing processed ZnO substrates
- Author
-
P. T. Neuvonen, Lasse Vines, Filip Tuomisto, Klaus Magnus H Johansen, Vera Prozheeva, A. Yu Kuznetzov, and A. Zubiaga
- Subjects
Detection limit ,Secondary ion mass spectrometry ,ta214 ,Positron annihilation spectroscopy ,Materials science ,ta114 ,Annealing (metallurgy) ,Mechanical Engineering ,Analytical chemistry ,Polishing ,02 engineering and technology ,021001 nanoscience & nanotechnology ,Condensed Matter Physics ,01 natural sciences ,Mechanics of Materials ,Vacancy defect ,0103 physical sciences ,ZnO ,General Materials Science ,Wafer ,010306 general physics ,0210 nano-technology ,Vacancies - Abstract
Positron annihilation spectroscopy and secondary ion mass spectrometry have been applied to study the evolution of polishing-induced defects in hydrothermally grown ZnO samples depending on the annealing temperature. Annealing of the as-grown ZnO wafer at 1200–1500 °C is found to lead to Li accumulation in the sub-surface layer, and significant reduction of Li content in the bulk. Polishing is shown to introduce vacancy complexes involving both V Zn and V O . Post-polishing annealing of hydrothermally grown ZnO with removed Li layer at 800 ° C reduces the concentration of polishing-induced defects below the detection limit.
- Published
- 2017