1. Semiconductor Packaging
- Author
-
Chen, Andrea and Lo, Randy Hsiao-Yu
- Subjects
Circuits and Devices ,Electromagnetics and Microwaves ,Electronic Packaging ,ENG ,MATERIALS ,ElectricalEngineering ,SCI-TECH ,STM ,array ,ball ,compound ,frame ,grid ,lead ,level ,molding ,package ,wafer ,bic Book Industry Communication::T Technology, engineering, agriculture::TJ Electronics & communications engineering::TJF Electronics engineering ,bic Book Industry Communication::T Technology, engineering, agriculture::TJ Electronics & communications engineering::TJF Electronics engineering::TJFC Circuits & components ,bic Book Industry Communication::T Technology, engineering, agriculture::TG Mechanical engineering & materials::TGM Materials science - Abstract
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
- Published
- 2012
- Full Text
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