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Inverted metamorphic Ga0.3In0.7As photovoltaic converters with sub‐0.60 eV bandgaps grown on InP and GaAs are presented. Threading dislocation densities are 1.3 ± 0.6 × 106 and 8.9 ± 1.7 × 106 cm−2 on InP and GaAs, respectively. The devices generate open‐circuit voltages of 0.386 and 0.383 V, respectively, under irradiance producing a short‐circuit current density of ≈10 A cm−2, yielding bandgap‐voltage offsets of 0.20 and 0.21 V. Power and broadband reflectance measurements are used to estimate thermophotovoltaic (TPV) efficiency. The InP‐based cell is estimated to yield 1.09 W cm−2 at 1100 °C versus 0.92 W cm−2 for the GaAs‐based cell, with efficiencies of 16.8 versus 9.2%. The efficiencies of both devices are limited by sub‐bandgap absorption, with power weighted sub‐bandgap reflectances of 81% and 58%, respectively, the majority of which is assumed to occur in the graded buffers. The 1100 °C TPV efficiencies are estimated to increase to 24.0% and 20.7% in structures with the graded buffer removed, if previously demonstrated reflectance is achieved. These devices also have application to laser power conversion in the 2.0–2.3 µm atmospheric window. Peak laser power converter efficiencies of 36.8% and 32.5% are estimated under 2.0 µm irradiances of 1.86 and 2.81 W cm−2, respectively. [ABSTRACT FROM AUTHOR]

High-efficiency, four-terminal tandem solar cells composed of thin GaAs films mechanically stacked onto interdigitated back contact silicon solar cells with a glass interlayer are demonstrated. The optimal thickness of the absorber layer of a rear heterojunction GaAs subcell for use in four terminal tandem solar cells was studied. GaAs top cells with absorber layer thicknesses of 1.5, 1.9, 2.3, 2.8, and 3.5 μm were fabricated on glass and mechanically stacked onto interdigitated back-contact Si bottom cells. All tandem cells were found to have efficiencies above 30% under the AM1.5 G spectrum demonstrating a relatively weak sensitivity to thickness in the four-terminal configuration. We found the 2.8 μm absorber layer cell to have the highest top cell and tandem cell efficiency at 26.38% and 32.57%, respectively. Optical modeling with transfer matrix method for the planar top cell and Lambertian light trapping in the textured Si subcell, along with drift-diffusion Hovel equations, were used to show photon recycling enhancement to the effective diffusion length and VOC of the top cell as a result of the low-index glass interlayer. [ABSTRACT FROM AUTHOR]

High‐efficiency solar cells are essential for high‐density terrestrial applications, as well as space and potentially vehicle applications. The optimum bandgap for the terrestrial spectrum lies beyond the absorption range of a traditional dual junction GaInP/GaAs cell, with the bottom GaAs cell having higher bandgap energy than necessary. Lower energy bandgaps can be achieved with multiple quantum wells (QWs), but such a pathway requires advanced management of the epitaxial growth conditions in order to be useful. Strain‐balanced GaAsP/GaInAs QWs are incorporated into a single junction GaAs solar cell and a dual junction GaInP/GaAs solar cell, leading to 27.2% efficiency in the single junction device and a one‐sun record 32.9% efficiency in the tandem device. Good carrier collection and low non‐radiative recombination are observed in the cells with up to 80 QWs. The GaAs cells employ a rear‐heterojunction architecture to boost the open‐circuit voltage to over 1.04 V in the quantum well device, despite the large number of QWs. [ABSTRACT FROM AUTHOR]

Inverted metamorphic (IMM) multijunction solar cells represent a promising material platform for ultrahigh efficiency photovoltaic systems (UHPVs) with a clear pathway to beyond 50% efficiency. The conventional device processing of IMM solar cells, however, typically involves wafer bonding of a centimeter‐scale die and destructive substrate removal, thereby imposing severe restrictions in achievable cell size, type of module substrate, spatial layout, as well as cost effectiveness. Here, we report material design and fabrication strategies for microscale triple‐junction IMM (3J IMM) Ga0.51In0.49P/GaAs/In0.26Ga0.74As solar cells that can overcome these difficulties. Specialized schemes of delineation and undercut etching enable the defect‐free release of microscale IMM solar cells and printed assemblies on a glass substrate in a manner that preserves the growth substrate, where efficiencies of 27.3% and 33.9% are demonstrated at simulated AM1.5D one‐ and 351 sun illumination, respectively. A composite carrier substrate where released IMM microcells are formed in fully functional, print‐ready configurations allows high‐throughput transfer printing of individual IMM microcells in a programmable spatial layout on versatile choices of module substrate, all desired for CPV applications. [ABSTRACT FROM AUTHOR]