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Your search keyword '"Chang, Jing-Yao"' showing total 1 results
Start Over Author "Chang, Jing-Yao" Topic bending (metalwork)
1 results on '"Chang, Jing-Yao"'

1. Investigation of pre-bending substrate design in packaging assembly of an IGBT power module.

Author

Lee, Chang-Chun, Kao, Kuo-Shu, Lin, Leon, Chang, Jing-Yao, Leu, Fang-Jun, Lu, Yu-Lan, and Chang, Tao-Chih

Subjects
*BENDING (Metalwork), *INSULATED gate bipolar transistors, *SUBSTRATES (Materials science), *WARPAGE in electronic circuits, *SOLDER & soldering, *STRAINS & stresses (Mechanics)
Abstract

Highlights: [•] Serious warpage of IGBT power module is induced from assembly processes. [•] A pre-bending substrate with a curve opposite the warp is proposed. [•] Design is validated by FEA and related actual measurements. [•] Increasing DBC thickness of Al2O3 layer reduces warps and bonded solder stresses. [•] A thicker base plate is suggested to reduce warping of the entire packaging structure. [ABSTRACT FROM AUTHOR]

Published
2014
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