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In recent years, the interest of the electromagnetic pulse (EMP) threat is increasing with the rapid development of the electronics industry. Especially, the power cable is one of the targets that can be exposed to EMP and affect to the appliance. However, the EMP-coupling method is previously insufficient and is partially analyzed between EMP sources and cable. Because the simulation method such as the finite-difference time-domain (FDTD) and an experiment often take a very long time to present the EMP-cable coupling. Therefore, in this paper, we propose the EMP-estimation coupling method to analyze from the overall perspective based on the hybrid electromagnetic (EM) numerical method. In addition, the protection guideline for the appliance is evaluated as the cable length is changed.

It is necessary to reduce the crosstalk noise in high-speed signaling channels. In the channel routing area, the tabbed routing pattern is used to mitigate far-end crosstalk (FEXT), and the electrical length is controlled with a time domain reflectometer (TDR) and time domain transmission (TDT). However, unlike traditional channels having uniform width and space, the width and space of tabbed routing changes by segment, and the capacitance and inductance values of tabbed routing also change. In this paper, we propose a tabbed routing equivalent circuit modeling method using the segmentation approach. The proposed model was verified using 3D EM simulation and measurement results in the frequency domain. Based on the calculated inductance and capacitance parameters, we analyzed the insertion loss, FEXT, and self-impedance in the frequency domain, and TDT and FEXT in the time domain, by comparing the values of these metrics with and without tabbed routing. Using the proposed tabbed routing model, we analyzed tabbed routing with variations of design parameters based on self- and mutual-capacitance and inductance.

Recently, semiconductor devices are becoming more diverse and scaled down for various applications such as electronic devices, communication systems and automotive components. Such applications can utilize sputtered shielding structures to solve electromagnetic interference (EMI) issues. To reduce the EMI issues, copper and nickel are commonly used as sputtered shielding materials. To analyze the shielding effectiveness, we applied the Schelkunoff's theory. For the verification of the Schelkunoff's theory, we simulated and measured the shielding effectiveness of copper and nickel at the frequency range between 100 kHz and 10 MHz using two identical coils.

Recently, high density integrated circuits are packaged in the electronic devices such as smartphones and smartwatches. Power amplifier modules integrated in such devices interact with other circuits due to its inductive components, and may cause the electromagnetic interference issues. To reduce the electromagnetic issues, sputtering technology can be used. In this paper, we present the shielding effectiveness measurement results of sputtered shielding materials in the low-frequency range from 30 kHz to 20 MHz using a vector network analyzer. Sputtered shielding materials are copper, nickel, titanium and stainless steel. By comparing the insertion loss, the shielding effectiveness is analyzed. The effect of the sputtered materials' thickness is also analyzed. Among the four materials, sputtered copper has the highest shielding effectiveness.