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Recently, semiconductor devices are becoming more diverse and scaled down for various applications such as electronic devices, communication systems and automotive components. Such applications can utilize sputtered shielding structures to solve electromagnetic interference (EMI) issues. To reduce the EMI issues, copper and nickel are commonly used as sputtered shielding materials. To analyze the shielding effectiveness, we applied the Schelkunoff's theory. For the verification of the Schelkunoff's theory, we simulated and measured the shielding effectiveness of copper and nickel at the frequency range between 100 kHz and 10 MHz using two identical coils.

Recently, high density integrated circuits are packaged in the electronic devices such as smartphones and smartwatches. Power amplifier modules integrated in such devices interact with other circuits due to its inductive components, and may cause the electromagnetic interference issues. To reduce the electromagnetic issues, sputtering technology can be used. In this paper, we present the shielding effectiveness measurement results of sputtered shielding materials in the low-frequency range from 30 kHz to 20 MHz using a vector network analyzer. Sputtered shielding materials are copper, nickel, titanium and stainless steel. By comparing the insertion loss, the shielding effectiveness is analyzed. The effect of the sputtered materials' thickness is also analyzed. Among the four materials, sputtered copper has the highest shielding effectiveness.