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The findings of the experimental study into optimizing the heat transfer rate of a PCM-based heat sink for high-power LEDs are presented in this work. The study investigated five heat sink types, with and without PCM. The LED case and junction temperatures, LED module temperatures, heat storage and release rate analyses, analyses of three types of cyclic operation modes, luminous flux, and heat sink thermal resistance were all examined independently. The results indicated that the PCM-based LED heat sink had improved thermal performance. The LED junction temperature of the PCM-equipped E-20 heat sink is nine degrees Celsius lower at 10 W than that of the heat sink without PCM. Furthermore, the E-20 heat sink with PCM extends the LED module's critical lifespan. As a bonus, the E-20 with PCM had a 38.19 percent lower thermal resistance at 10 W than the E-20 without PCM. According to these results, the heat sink E-20 emits 715 lm at 10 W when operated without a phase-change material (PCM). With the same input power, the luminous flux of an E-20 equipped with a heat sink and a phase-change material (PCM) is 750 lm, a gain of 4.7%. Finally, clearly recommend the heat E-20 sink with PCM suitable for high-power LED thermal management system. [ABSTRACT FROM AUTHOR]

The current experimental investigation focused on the 16 W Light Emitting Diode (LED) with Phase Change Material (PCM)-filled heat sinks to augment consistency, high luminous flux and heat sink with low thermal resistance. Parameters such as input power, fin pitch value and quantity of fins were varied to study the heat transfer performance of the heat sink without and with PCM. Experimental results reveal that the hexagonal heat sink having a pitch of 10 mm performed well due to the increased melting rate of PCM as compared to other heat sinks. The thermal resistance of the H-10 heat sink with PCM was observed to be 3.3 °C/W, which is 73% lower than that of the H-10 heat sink without PCM at 16 W. The junction temperature enhancement ratio of 3.625 was observed for the H-10 heat sink with PCM at 16 W power input for SCT of 90 °C. [ABSTRACT FROM AUTHOR]

This study performed a steady-statenumerical analysis to understand the temperature in different heat sink configurations forLEDapplications. Seven heat sink configurationsnamed R, H-6, H-8, H-10,C,C3, and C3E3 were considered. Parameters like input power, number of fins, heat sink configuration were varied, and their influence on LED temperature distribution, heat sink thermal resistance and thermal interface material temperature were studied. The results showed that the temperature distribution of the H-6 heat sink decreased by 46.30%compared with theCheat sink for aninput power of 16W. The result of theH-6 heat sink shows that the heat sink thermal resistance was decreased by 73.91% compared with the Cheat sink at 16W. The lowest interface material temperature of 54.11 °C was achieved by the H-6 heat sink when the input power was used 16W. The H-6 heat sink exhibited better performance due to more surface area with several fins than other heat sinks. [ABSTRACT FROM AUTHOR]