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An analytic model of dual-layer-structure (DLS) microelectromechanical system (MEMS) thermal wind sensor was proposed in this article. Heat conduction and heat convective theory were applied to obtain the temperature difference between upstream and downstream under different wind speeds and directions. Simulation by finite element method (FEM) was performed to verify the proposed model. The DLS MEMS wind sensor was fabricated by commercial foundry with two polysilicon layers and one metal layer. After being packaged, the wind sensor was tested based on front surface sensing mode in the wind tunnel up to 33 m/s. The results demonstrated that the wind speed measurement agrees with the proposed model well and the average error of output voltage was no more than 8 mV. Moreover, the measured wind direction increased with the actual value marked on the base from 0° to 360°, which was consistent with the established model. Moreover, the average error was close to 3.7° and the maximum value was no more than 6.38°, which may be caused by asymmetry in scribing and packaging. [ABSTRACT FROM AUTHOR]

In this article, the benchmark drift of micromachined thermal wind sensor due to the packaging asymmetry has been analyzed and compensated. For the ideal wind sensors with symmetric packaging, the benchmark does not vary with speed and direction. However, for the real sensors, especially for handmade ones, packaging asymmetry problems are usually inevitable. Consequently, benchmark drifts with wind because of different thermal distribution in each direction, which was verified by the proposed lumped parameters model. The real sensors were tested in a wind tunnel and results showed the benchmark drift as well. The contribution of this work lies in the establishment of the equation of benchmark dependent on wind speed, which can predict benchmark value under different wind speeds by calibration at zero wind speed. This compensation method is extremely simple and convenient for industrial production. After compensation, the relative wind speed errors are reduced from 46 to 8% up to 30 m/s, and the wind direction errors are reduced from 30° to 7° over the full range of 360°. [ABSTRACT FROM AUTHOR]

A thermal wind sensor utilizes the fact that airflow over a heated plate will cool it asymmetrically, with the upstream part of the plate being cooled more than the downstream part. In the temperature-balanced (TB) mode, the heating power may be distributed spatially in the sensor such that any flow-induced temperature gradient is cancelled. Information about the airflow can be extracted in the distribution of heating power in the sensor. Ideally, the influence of changes in the ambient temperature on the sensor’s output can be eliminated if in the whole measurement range the temperature sensor sensitivities are equal. However, because of the temperature dependency of the material properties of the airflow and the sensor, it may have a temperature drift. This paper, for the first time, investigates temperature effects of the ceramic microelectromechanical system (MEMS) thermal wind sensor based on the TB mode. The sensor consists of four outlying heaters and four inlying thermistors in two orthogonal directions on a ceramic substrate. When working in the TB mode, it could measure wind speed and wind direction by applying a power difference on the upstream and downstream heaters, so that the flow-induced temperature gradient is eliminated. Theoretical analysis has been developed which takes the variations of thermophysical properties in the sensor and the control circuits into account. Experiments for testing wind speed and direction have been performed in a wind tunnel with an adjustable ambient temperature. It shows that the wind speed is linearly influenced by the ambient temperature while the wind direction is inherently unaffected by ambient temperature variations. After compensation, the sensor shows a credible performance with an error of less than ±1m/s in wind speed and ±2° in wind direction in a temperature range from 0 °C to 30 °C. [ABSTRACT FROM AUTHOR]

A 2-D anemometer sensor on a ceramic substrate is proposed, modeled, simulated, and fabricated. The sensor consists of four outlying heaters and four inlying thermistors arranged in two orthogonal directions on a ceramic substrate. The heaters are driven by power feedback control circuits, while the thermistors measure the temperature distribution on the surface of the sensor. By applying a power difference on the upstream and downstream heaters, the flow-induced temperature gradient is canceled via the temperature-balanced mode, and both wind speed and direction can be extracted by the applied power difference. An analytical model of the 2-D anemometer sensor is developed for the applied power difference as a function of wind speed and direction. The finite-element method simulations have been utilized to demonstrate the analytical model. The sensor was fabricated directly on the ceramic substrate by using a typical lift-off technology. The sensor output was measured and compared with the theoretical model. A high measurement accuracy has been achieved from 0 to 40 m/s with a speed error less than ±0.5m/s and a direction error of less than ±2°. [ABSTRACT FROM AUTHOR]

Modeling of the packaged wind sensor operating on constant power (CP) mode is proposed in this paper. The proposed model is based on the theory of heat conduction and forced convection. The presented model indicates that the total output dc voltage is proportional to the square root of the wind speed, and ${V}_{x}$ , as well as ${V}_{y}$ , varies with the wind direction based on cosine function. The wind sensor is fabricated by microelectromechanical systems (MEMS) technology and packaged with the glue. The test is performed in the wind tunnel and the measured results indicate an agreement with the presented model. The relative error of voltage for the wind speed is less than 14% up to 30 m/s, while that for the wind direction is no more than 10.7% from 0° to 360°. [ABSTRACT FROM AUTHOR]

This paper introduces a novel sensing element scheme to improve the accuracy of 2-D micromachined thermal wind sensor. The sensing element consists of eight heaters and eight thermistors placed on ceramic substrate. The octagon-arranged sixteen resistors are divided into two wind sensing groups, cross-type group and saltire-type group. These two groups monitor wind independently, and the final measured wind speed and direction are extracted from the measurement results of the two groups. Based on this octagon-sensing design, the sensor achieves higher accuracy for wind measurement, which is verified by the experiment. The results show that for the wind speed up to 33 m/s, the sensor has a measurement error less than ±1%, and the airflow direction over the full range of 360° is determined with a maximum error of ±1.5°. [2018-0045] [ABSTRACT FROM AUTHOR]

In this paper, the effect of insulation trenches on micromachined silicon thermal wind sensors is explored. The sensor is composed of a central heater and four thermistors. It measures wind speed and direction through detecting the airflow-induced temperature difference on the chip surface. Three different forms of insulation trenches are designed and fabricated to explore their effects on the performance of wind sensors. The experimental results show that when the sensors work in constant voltage mode, the center and arch trenches enhance the performance, while the arch trenches have the most significant effect on the sensitivity improvement. Moreover, all the three kinds of insulation trenches reduce the power consumption for the sensors operated in constant temperature difference mode. The insulation trench design in this paper can provide a valuable reference for the design and fabrication of micromachined silicon thermal wind sensors. [ABSTRACT FROM PUBLISHER]

This paper presents the design, fabrication, and performance of a micromachined silicon thermal wind sensor with improved sensitivity. Deep reactive ion etching (DRIE) trenches are fabricated between the heater and the thermistors to suppress the lateral heat conduction in the chip. In addition, eight thermistors symmetrically arranged in four directions around the heater form two Wheatstone full-bridges, resulting in about 50% increase of the sensitivity with respect to four thermistors. Based on these two methods, the sensitivity of the micromachined silicon thermal wind sensor is improved remarkably, which is verified by the experiment. The results show that the measurement wind speed range is up to 33 m/s in constant voltage (CV) mode with the initial heating power of 256 mW. The sensitivity is measured to be 29.37 mV/ms−1 at the wind speed 3.3 m/s, achieving improvement of about 226%, compared with that of the traditional wind sensor. Wind direction measurement results show that airflow direction over the full range of 360° is determined with an accuracy of ±5°. [2017-0052] [ABSTRACT FROM AUTHOR]

A 2-D MEMS wind sensor based on $\Delta \text{P}$ (power difference) thermal feedback control is presented. The sensor consists of four outlying heaters and four inlying thermistors in two orthogonal directions on ceramic substrate. A $\Delta \text{P}$ thermal feedback control system is applied to eliminate the flow-induced temperature difference between upstream and downstream so as to achieve a temperature-balanced mode. This applied power difference among the four heaters is a measure for the wind speed and direction. Experimental results demonstrate that the measured speed varies from 0 to 40 m/s with an error less than ±0.5 m/s while the measured direction spans from 0° to 360° with an error less than ±2°. [2017-0286] [ABSTRACT FROM AUTHOR]