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The instability of the gate bias and drain bias stresses is observed at high temperature in amorphous InGaZnO thin-film transistors (a-IGZO TFTs). The transfer characteristics of a-IGZO TFTs at different temperatures are also investigated in this paper. The transfer curve exhibits an apparent subthreshold current stretchout phenomenon at high temperature. The stretchout phenomenon becomes more serious with the increase of the temperature. In addition, thermally induced holes are accumulated by the negative gate voltage and get trapped in the gate dielectric or at the dielectric/channel interface at high temperature. The negative threshold voltage shifts with stress time and this is because the trapped holes induce more electrons. For drain bias stress at high temperature, the transfer curve exhibits an apparent shift during drain bias stress at high temperature compared with the same at room temperature. At high temperature, thermally induced holes are trapped in the gate insulator, especially near the drain region. Capacitance-voltage measurements have been used to prove the nonuniform hole-trapping phenomenon. Furthermore, the simulation of the capacitance-voltage and current-voltage curves also have been applied to confirm the hole-trapping distribution. The obtained results clarify that the instability is caused by nonuniform hole-trapping phenomenon. [ABSTRACT FROM AUTHOR]

Abstract: In this research, paraffin wax is employed as the passivation layer of the bottom gate amorphous indium–gallium–zinc oxide thin-film transistors (a-IGZO TFTs), and it is formed by sol–gel process in the atmosphere. The high yield and low cost passivation layer of sol–gel process technology has attracted much attention for current flat-panel-display manufacturing. Comparing with passivation-free a-IGZO TFTs, passivated devices exhibit a superior stability against positive gate bias stress in different ambient gas, demonstrating that paraffin wax shows gas-resisting characteristics for a-IGZO TFTs application. Furthermore, light-induced stretch-out phenomenon for paraffin wax passivated device is suppressed. This superior stability of the passivated device was attributed to the reduced total density of states (DOS) including the interfacial and semiconductor bulk trap densities. [Copyright &y& Elsevier]

Abstract: N2O plasma treatment suppressed the temperature-dependent sub-threshold leakage current of amorphous indium–gallium–zinc-oxide thin film transistors (a-IGZO TFTs). For untreated devices, the transfer curve exhibited abnormal electrical properties at high temperature. The abnormal electrical properties are explained by the energy band diagrams for both forward and reverse sweep. Above 400K, holes can be generated from trap-assisted transition, and drift to the source side which induces source barrier lowering. The source side barrier lowering enhances electron injection from the source to channel and causes an apparent sub-threshold leakage current. This phenomenon, which is experimentally verified, only appears in the device without N2O plasma treatment, but not in the device with N2O plasma treatment. The results suggested that the density of states for a-IGZO with N2O plasma treatment is much lower than that without plasma treatment. [Copyright &y& Elsevier]