13 results on '"Kuroda, Tadahiro"'
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2. A 96-MB 3D-Stacked SRAM Using Inductive Coupling With 0.4-V Transmitter, Termination Scheme and 12:1 SerDes in 40-nm CMOS.
3. 3D NoC with Inductive-Coupling Links for Building-Block SiPs.
4. A 30 Gb/s/Link 2.2 Tb/s/mm^2 Inductively-Coupled Injection-Locking CDR for High-Speed DRAM Interface.
5. A 0.55 V 10 fJ/bit Inductive-Coupling Data Link and 0.7 V 135 fJ/Cycle Clock Link With Dual-Coil Transmission Scheme.
6. An Inductive-Coupling DC Voltage Transceiver for Highly Parallel Wafer-Level Testing.
7. 3-D System Integration of Processor and Multi-Stacked SRAMs Using Inductive-Coupling Link.
8. 2 Gb/s 15 pJ/b/chip Inductive-Coupling Programmable Bus for NAND Flash Memory Stacking.
9. A High-Speed Inductive-Coupling Link With Burst Transmission.
10. A 0.14 pJ/b Inductive-Coupling Transceiver With Digitally-Controlled Precise Pulse Shaping.
11. 47% Power Reduction and 91% Area Reduction in Inductive-Coupling Programmable Bus for NAND Flash Memory Stacking.
12. A 107-pJ/bit 100-kb/s 0.18-μm Capacitive-Coupling Transceiver With Data Edge Signaling and DC Power-Free Pulse Detector for Printable Communication Sheet.
13. Near-field wireless connection for 3D-system integration.
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