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By controlling the sputtering power, rotational speed of the substrate and sputtering time, Ni–Cr thin films with appropriate composition were fabricated by double-target magnetron co-sputtering techniques. The homogeneity and oxidation of Ni–Cr thin film has been studied by Auger electron spectroscopy (AES). The structures of Ni–Cr thin films were determined by an X-ray diffractometer (XRD). The oxidation and the resistance stability of the Ni–Cr thin film after rapid thermal process (RTP) have been studied. The relations between TCR and RTP techniques of Ni–Cr thin films were discussed. [ABSTRACT FROM AUTHOR]

The electromechanical properties of nichrome (Ni–Cr 80/20 wt.%) used as a common material for application in thin film strain gauges have been studied. The surface topography and chemical composition of Ni–Cr thin films grown on the glass substrate by magnetron sputtering have been analyzed by atomic force microscope (AFM) and energy dispersive spectroscopy (EDS), respectively. The temperature coefficient of resistance (TCR) has been determined by a Nano-volt/Micro ohm meter. The gauge factor (FG) has been determined by the cantilever method. Low stable TCR values (22 ppm to 46 ppm in the 50–150°C temperature range) have been obtained. Resistance stability is achieved by rapid thermal annealing (RTA) at 300°C for 10 min combined with a 24 h thermal annealing (TA) at 150°C. The desired 45 Ω/m sheet resistance and a gauge factor of 2.6 have been attained for 40-nm-thickness films. The films have very small roughness of 2.1~4.4 nm. [ABSTRACT FROM AUTHOR]