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High Density Vertically Integrated Photodiodes (HDVIP) MWIR detectors were fabricated in LPE-grown Mercury Cadmium Telluride material. Devices were fabricated with two different acceptor level concentrations. The low doped n-region was held at a single concentration but the dimensions are tailored to simultaneously maintain high quantum efficiency while minimizing dark current and 1/f noise. Since this study target was for operating at high temperatures, detector I-V data was collected between 120 K and 280 K for I-Vs and 180 to 280 K for noise to understand current mechanisms that limit device performance at these elevated temperatures. Noise as a function of frequency has also been collected over the same temperature range. 1/f noise has also been modeled for MWIR detectors as a function of temperature and will be covered.

Modern electronic applications demand more and more complex, multifunctional microsystems with performance characteristics which can only be achieved by using best-of-breed materials and device technologies. Three-dimensional (3-D) integration of separate, individually complete device layers provides a way to build complex heterogeneous microsystems without compromising the system performance and fabrication yield. In the 3-D integration approach, each device layer is fabricated separately using optimized materials and processes. The layers are bonded and interconnected through area array vertical interconnects with lengths on the order of microns. This paper will review bonding techniques for high density area array 3-D integration of integrated circuits, focusing on techniques suitable for die-to-die and die-to-wafer bonding configurations.

Microspectrometers based on the monolithic integration of a microelectromechanical system (MEMS) Fabry–Perot filter and a HgxCd1–xTe-based infrared detector are discussed and measured results presented. The microspectrometers are designed to operate in the 1.5 μm to 2.6 μm wavelength range. Design equations are presented which account for the mechanical and optical characteristics of the device. Measurements indicate linewidths as narrow as 55 nm, switching times of 40 μs, and a tuning range of 380 nm, which is limited by snap-down. Optical characterization of the distributed Bragg mirrors and the Fabry–Perot filter are presented, and these are shown to be in good agreement with simple first-order analytical models. Bowing of the movable Fabry–Perot mirror due to stress gradients is identified as the dominant source of linewidth broadening.

A monolithically integrated low-temperature micro-electro-mechanical systems (MEMS) and HgCdTe infrared (IR) detector technology is introduced, implemented, and characterized. The ultimate aim of this project is to develop a MEMS-based optical filter, integrated with an IR detector, that selects narrow wavelength bands within the short-wavelength IR (SWIR) region of the spectrum. The entire fabrication process is compatible with two-dimensional IR focal plane array technology, and needs to be compatible with a proposed electrically tunable MEMS filter based on a Fabry-Perot optical cavity. The fabricated device consists of an HgCdTe SWIR photoconductor, distributed Bragg mirrors formed of Ge-SiO-Ge, a sacrificial spacer layer within the cavity, and a silicon nitride membrane for structural support. Mirror stacks fabricated on silicon, identical to the structures that will form the optical cavity, have been characterized to determine the optimum filter characteristics. The measured full-width at half-maximum (FWHM) was 34 nm at the center wavelength of 1,780 nm with an extinction ratio of 36.6. Fully integrated filters on HgCdTe photoconductors with a center wavelength of approximately 1,950 nm give a FWHM of approximately 100 nm, and a peak responsivity of approximately 8×104 V/W. The experimental results are in good agreement with the optical model, which takes into account mirror reflectivity, absorption within the cavity by the spacer material, and absorption by the silicon nitride support structure.

We report successful implementation of high-density 3D integration technology in the fabrication of advanced mixed-signal processors for infrared focal plane arrays. Separate analog and digital integrated circuits (ICs) were custom designed and fabricated in standard bulk CMOS technology in two different commercial foundries. The 3D interconnects were arrayed in a 256×256 format with a 30 micron pitch and had the form of through-silicon vias 4 micron in diameter and 30 micron deep. Completed 3D readout IC stacks were tested pixel by pixel, demonstrating operability of 99.9%. The 3D IC stacks were hybridized with infrared photodiode arrays and produced functional FPA imagers with 99.9% array operability and unprecedented performance. Such imaging arrays and other smart sensors enabled by 3D integration of sensing elements with sophisticated signal processing are of increasing interest for Internet-of-Things applications, from net-enabled surveillance to mobile health.

A 16 element HgCdTe e-APD detector has been developed for lidar receivers that has significant improvements in sensitivity in the spectral range from < 1μm to 4 μm. A demonstration detector consisting of a 4x4 APD detector array, with 80 μm square elements, a custom CMOS readout integrated circuit (ROIC), a closed cycle cooler-Dewar, and support electronics has been designed, fabricated, and tested. The custom ROIC design provides > 6 MHz bandwidth with low noise and 21 selectable gains. Ninety-six arrays were fabricated with 69% of the arrays meeting the dark current spec in the center 4 pixels at 10 V bias where the APD gain was expected to be around 150. Measurements to 12 V on one array showed APD gains of 654 with a gain normalized dark currents of 1.2 fA to 3.2 fA. The lowest dark current array showed a maximum dark current of 6.2 pA at 10 V and 77 K. The 4.4 μm cutoff detector was characterized at an operating temperature of 77K with a 1.55 μm, 1μs wide, laser pulse. The photon conversion efficiency at unity gain was 91%. The mean measured APD gain at 77 K was 308 at 11V, the responsivity was 782 μV/pW, the average NEP was 1.04 fW/Hz1/2. The bandwidth was 6.8 MHz, and the broadband NEP was 2.97 pW. This detector offers a wide spectral response, dynamic range, and substantially improved sensitivity and lifetime for integrated path differential absorption (IPDA) lidar measurements of atmospheric trace gases such as CO2 and CH4.

Hyperspectral imaging in the infrared bands is traditionally performed using a broad spectral response focal plane array, integrated in a grating or a Fourier transform spectrometer. This paper describes an approach for miniaturizing a hyperspectral detection system on a chip by integrating a Micro-Electro-Mechanical-System (MEMS) based tunable Fabry Perot (FP) filter directly on a photodetector. A readout integrated circuit (ROIC) serves to both integrate the detector signal as well as to electrically tune the filter across the wavelength band. We report the first such demonstration of a tunable MEMS filter monolithically integrated on a HgCdTe detector. The filter structures, designed for operation in the 1.6-2.5 μm wavelength band, were fabricated directly on HgCdTe detectors, both in photoconducting and high density vertically integrated photodiode (HDVIP) detectors. The HDVIP detectors have an architecture that permits operation in the standard photodiode mode at low bias voltages (≤0.5V) or in the electron avalanche photodiode (EAPD) mode with gain at bias voltages of ~20V. In the APD mode gain values of 100 may be achieved at 20 V at 200 K. The FP filter consists of distributed Bragg mirrors formed of Ge-SiO-Ge, a sacrificial spacer layer within the cavity and a silicon nitride spacer membrane for support. Mirror stacks fabricated on silicon, identical to the structures that will form the optical cavity, have been characterized to determine the optimum filter characteristics. The measured full width at half maximum (FWHM) was 34 nm at the center wavelength of 1780 nm with an extinction ratio of 36.6. Fully integrated filters on HgCdTe photoconductors with a center wavelength of approximately 1950 nm give a FWHM of approximately 100 nm, and a peak responsivity of approximately 8 × 104 V/W. Initial results for the filters on HDVIP detectors exhibit FWHM of 140 nm.

Hyperspectral imaging in the infrared bands is traditionally performed using a broad spectral response focal plane array, integrated in a grating or a Fourier transform spectrometer. This paper describes an approach for miniaturizing a hyperspectral detection system on a chip by integrating a Micro-Electro-Mechanical-System (MEMS) based tunable Fabry Perot (FP) filter directly on a photodetector. A readout integrated circuit (ROIC) serves to both integrate the detector signal as well as to electrically tune the filter across the wavelength band. We report the first such demonstration of a tunable MEMS filter monolithically integrated on a HgCdTe detector. The filter structures, designed for operation in the 1.6-2.5 μm wavelength band, were fabricated directly on HgCdTe detectors, both in photoconducting and high density vertically integrated photodiode (HDVIP) detectors. The HDVIP detectors have an architecture that permits operation in the standard photodiode mode at low bias voltages (≤0.5V) or in the electron avalanche photodiode (EAPD) mode with gain at bias voltages of ~20V. In the APD mode gain values of 100 may be achieved at 20 V at 200 K. The FP filter consists of distributed Bragg mirrors formed of Ge-SiO-Ge, a sacrificial spacer layer within the cavity and a silicon nitride spacer membrane for support. Mirror stacks fabricated on silicon, identical to the structures that will form the optical cavity, have been characterized to determine the optimum filter characteristics. The measured full width at half maximum (FWHM) was 34 nm at the center wavelength of 1780 nm with an extinction ratio of 36.6. Fully integrated filters on HgCdTe photoconductors with a center wavelength of approximately 1950 nm give a FWHM of approximately 100 nm, and a peak responsivity of approximately 8×104 V/W. Initial results for the filters on HDVIP detectors exhibit FWHM of 140 nm.

This paper describes a technology for three-dimensional (3-D) integration of multiple layers of silicon integrated circuits. The technology promises to dramatically enhance on-chip signal processing capabilities of a variety of detector devices hybridized with Si electronics. The focus of the paper is on high performance infrared focal plane arrays based on HgCdTe, which offer the ultimate in infrared sensitivity and find application in high performance military systems. Performance data from test FPA devices with integrated multilayer Si stacks are discussed in this paper.

A low temperature MEMS process integrated with an infrared detector technology has been developed. The integrated microsystem is capable of electrically selecting narrow wavelength bands in the range from 1.6 to 2.5 μm within the short-wavelength infrared (SWIR) region of the electromagnetic spectrum. The integrated fabrication process is compatible with two-dimensional infrared focal plane array technology. The demonstration prototypes consist of both HgCdTe SWIR photoconductive as well as high density vertically integrated photodiode (HDVIP®) detectors, two distributed Bragg mirrors formed of Ge-SiO-Ge, an air-gap optical cavity, and a silicon nitride membrane for structural support. The tuning spectrum from fabricated MEMS filters on photoconductive detectors indicates a wide tuning range and high percentage transmission. Tuning is achieved with a voltage of only 7.5 V, and the FWHM ranged from 95-105 nm over a tuning range of 2.2 μm to 1.85 μm. The same MEMS filters, though unreleased, and with the sacrificial layer within the optical cavity, have been fabricated on planarised SWIR HDVIP® photodiodes with FWHM of less than 60 nm centred at a wavelength of approximately 1.8 μm. Finite element modelling of various geometries for the silicon nitride membrane will also be presented. The modelling is used to optimize the filter geometry in terms of fill factor, mirror displacement versus applied voltage, and membrane bowing.

The resistivity, Seebeck coefficient, superconducting transition temperature, and upper critical field have been measured in Cs/sub x/WO/sub 3/ for 0.19< or =x< or =0.30. In contrast to Rb/sub x/WO/sub 3/, no temperature-dependent anomalies were observed in either the normal resistivity or the Seebeck coefficient. The superconducting transition temperature, T/sub c/, increases monotonically with decreasing x from 2 K at x = 0.30 up to 6.7 K at x=0.20, with an inflection near 0.24. The resistivity as a function of x increases monotonically with decreasing x and also has an inflection near x=0.24.

Results of measurements of T/sub c/ and H/sub c2/ on single crystals of Cs/sub 0/./sub 1/WO/sub 2/./sub 9/F/sub 0/./sub 1/ are reported. The critical temperature varied from 4.87 to 4.94 K for different specimens. The upper critical field showed an anisotropy reflecting the symmetry; its temperature dependence was also measured. 11 refs.

A monolithically integrated low temperature MEMS and HgCdTe infrared detector technology has been implemented and characterised. The MEMS-based optical filter, integrated with an infrared detector, selects narrow wavelength bands in the range from 1.6 to 2.5 μm within the short-wavelength infrared (SWIR) region of the electromagnetic spectrum. The entire fabrication process is compatible with two-dimensional infrared focal plane array technology. The fabricated device consists of an HgCdTe SWIR photoconductor, two distributed Bragg mirrors formed of Ge-SiO-Ge, a sacrificial spacer layer within the cavity, which is then removed to leave an air-gap, and a silicon nitride membrane for structural support. The tuning spectrum from fabricated MEMS filters on photoconductive detectors shows a wide tuning range and high percentage transmission is achieved with a tuning voltage of only 7.5 V. The FWHM ranged from 95-105 nm over a tuning range of 2.2 μm to 1.85 μm. Finite element modelling of various geometries for the silicon nitride membrane will also be presented. The modelling is used to determine the best geometry in terms of fill factor, voltage displacement prediction and membrane bowing.