1. Hot embossing of microstructure with moving induction heating and gas-assisted pressuring
- Author
-
Ching-Chieh Kao, Hung Wei-Cheng, Kun-Cheng Ke, and Sen-Yeu Yang
- Subjects
010302 applied physics ,Fabrication ,Materials science ,Induction heating ,02 engineering and technology ,Substrate (printing) ,021001 nanoscience & nanotechnology ,Condensed Matter Physics ,Microstructure ,medicine.disease_cause ,01 natural sciences ,Electronic, Optical and Magnetic Materials ,Stack (abstract data type) ,Hardware and Architecture ,Thermocouple ,Electromagnetic coil ,Mold ,0103 physical sciences ,medicine ,Electrical and Electronic Engineering ,Composite material ,0210 nano-technology - Abstract
A new apparatus for a moving induction heating and gas-assisted hot embossing apparatus has been developed. A mechanism was designed and implemented to move the platform in and out the wrapped coil, on which the sealed box for substrate/mold was placed. A chamber of 195 mm diameter and 221 mm length was machined. The movable platform, the sealed box with substrate/mold stack, wrapped coil and cooling fan were all implemented in the high pressure chamber. The nine-point thermocouples attached on the mold, thus, a temperature history of the moving induction heating can be obtained and study the influence of the moving path and power on the heating rate and temperature distribution. The micro V-cut structure hot embossing experiment were performed to prove the potential of this moving induction heating and gas-assisted pressuring hot embossing for fast fabrication of microstructure onto polymeric substrates. As a results, replication rates were all above 95% at 200 °C and 5 kgf/cm2 and the cycle time was less than 4 min and the optic measurement shows the replicated V-cut film can enhance the 36.8% illuminance. The experiment results show the manufacturing potential of this apparatus.
- Published
- 2019